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    • 61. 发明申请
    • PROCESSING METHOD FOR BUMP-INCLUDED DEVICE WAFER
    • 用于封装的器件滤波器的处理方法
    • US20130230966A1
    • 2013-09-05
    • US13410794
    • 2012-03-02
    • Devin MartinMark Brown
    • Devin MartinMark Brown
    • H01L21/78
    • H01L21/67092
    • A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step.
    • 一种凸起包括器件晶片的处理方法,包括:粘合剂提供步骤,在载体晶片的环形槽中提供粘合剂,使得粘合剂从载体晶片的环形突起的上表面突出; 晶片安装步骤,通过所述粘合剂将所述器件晶片的前侧附着并固定到所述载体晶片的前侧,以便在执行所述粘合剂提供步骤之后容纳所述载体晶片的凹部中的凸起; 以及在进行晶片安装步骤之后,研磨或抛光器件晶片的背面的厚度减小步骤,以将器件晶片的厚度减小到预定厚度。
    • 62. 发明授权
    • Insulated panels and systems and methods for forming sealed insulated panels
    • 绝缘板和用于形成密封绝缘板的系统和方法
    • US08429824B2
    • 2013-04-30
    • US12832337
    • 2010-07-08
    • Mark BrownKyozaburo Takagi
    • Mark BrownKyozaburo Takagi
    • B21D47/00
    • E04C2/288Y10T29/49629Y10T29/49632
    • Insulated panels and methods of forming insulated panels are provided. According to the method, mold bulkhead and a sealing strip including a first anchor extension, a second anchor extension, and a panel cap are provided. The method also includes removably attaching the exterior face of the sealing strip to the interior mold surface on at least one of the plurality of mold sides, wherein the first anchor extension and the second anchor extension project into the interior mold volume, and wherein the sealing strip defines a sealed insulation zone. A curable building material is introduced into the interior mold volume to form a first slab. The first slab at least partially surrounds the first anchor extension. The method also includes inserting an insulation material layer into the interior mold volume, wherein the insulation material layer is at least partially within the sealed insulation zone. A curable building material is introduced into the interior mold volume adjacent to the insulation material layer to form a second slab. The second slab at least partially surrounds the second anchor extension. The method also includes the step of allowing the curable building material to cure to provide a cured insulated panel, wherein the panel cap defines at least a portion of at least one of the plurality of intermediate faces.
    • 提供绝缘板和形成绝缘板的方法。 根据该方法,提供了模具隔板和包括第一锚固件延伸部,第二锚固件延伸部和面板盖的密封条。 该方法还包括将密封条的外表面可拆卸地连接到多个模具侧面中的至少一个上的内部模具表面,其中第一锚固件延伸部和第二锚固件延伸部伸入内部模具体积中,并且其中密封件 条限定了密封绝缘区。 将可固化建筑材料引入内部模具体积中以形成第一板坯。 第一板坯至少部分地围绕第一锚固件延伸部分。 该方法还包括将绝缘材料层插入内部模具体积中,其中绝缘材料层至少部分地在密封绝缘区域内。 将可固化建筑材料引入与绝缘材料层相邻的内部模具体积中,以形成第二板坯。 第二平板至少部分地围绕第二锚定延伸部。 该方法还包括允许可固化建筑材料固化以提供固化的绝缘板的步骤,其中面板盖限定多个中间面中的至少一个的至少一部分。
    • 63. 发明申请
    • METHOD OF PROCESSING DEVICE WAFER
    • 处理器件波形的方法
    • US20130023107A1
    • 2013-01-24
    • US13185942
    • 2011-07-19
    • Devin MartinMark Brown
    • Devin MartinMark Brown
    • H01L21/304
    • H01L21/67132B24B7/228B24B19/022B24B37/042H01L21/67092H01L21/6835H01L23/544H01L2221/68327H01L2221/6834H01L2223/54493H01L2224/13H01L2924/1461H01L2924/00
    • A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer.
    • 一种处理器件晶片的方法包括载体晶片准备步骤,其准备载体晶片,该载体晶片在其表面上包括过量的载体区域,该载体晶片设置在与器件晶片的表面上的过度的外周区域相对应的位置, 所述载体晶片在所述凹部形成步骤之后,在所述粘合剂放置步骤之后,将粘合剂放置在所述凹部中以便从所述载体晶片的表面突出的粘合剂放置步骤, 晶片接合步骤,将载体晶片的表面和器件晶片的表面彼此接合,从而将器件晶片用粘合剂固定在载体晶片上,并且在晶片接合步骤之后,使设备变薄的变薄步骤 通过研磨或抛光装置晶片的反面将晶片晶片制成预定的厚度。
    • 64. 发明申请
    • GOLF CLUB GROOVE CLEANING AND DEBURRING TOOL
    • 高尔夫俱乐部清洁清洁工具
    • US20110214242A1
    • 2011-09-08
    • US13042400
    • 2011-03-07
    • Mark Brown
    • Mark Brown
    • A63B57/00
    • A63B57/60A63B57/00
    • A golf club groove cleaning and deburring tool that includes a base portion having a grip affixed to its top side and a blade attached to its substantially planar bottom side. The blade extends substantially normal in relation to the planar bottom side of the base portion and includes substantially planar sides and a bottom cutting edge, a maximum width equal to or less than 0.035 inches (0.9 mm) and a depth equal to or less than 0.020 inches (0.508 mm), and wherein the substantially planar sides are either substantially straight and parallel from the base portion to the bottom cutting edge or taper from the base portion to the bottom cutting edge.
    • 一种高尔夫球杆槽清洁和去毛刺工具,其包括具有固定到其顶侧的手柄的基部和附接到其基本平坦的底侧的刀片。 叶片相对于基部的平面底侧基本上垂直延伸,并且包括基本平坦的侧面和底部切割边缘,最大宽度等于或小于0.035英寸(0.9mm)和深度等于或小于0.020 英寸(0.508mm),并且其中基本上平坦的边基本上是直的并且从基部到底切割边平行,或者从基部到底切割刃是锥形的。
    • 67. 发明申请
    • MODULAR ENTERPRISE AUTHORIZATION SOLUTION
    • 模块化企业授权解决方案
    • US20080109898A1
    • 2008-05-08
    • US11556607
    • 2006-11-03
    • Mannan MohammedSaivendra KayalRon TielkeMark BrownNathan Dolly
    • Mannan MohammedSaivendra KayalRon TielkeMark BrownNathan Dolly
    • H04L9/32
    • H04L63/102G06F21/629
    • An authorization framework located external to an application may be invoked to determine user authorization for a requested application component. Small amounts of supplemental authentication code are added to application code to invoke provider modules within the authentication framework. The provider modules perform authorization functions outside of the application and return authorization results to the application. The functions include determining a user role, determining the permissions associated with the user role, comparing the role permissions to the security defined on the requested application component by a rule, and returning an authorization state to the authentication framework. The supplemental authentication code may invoke one or more providers through provider interfaces that translate requests to a particular provider. Using the provider based authorization framework, authorization for an application component is achieved externally without hard-coding authorization code within the application itself.
    • 可以调用位于应用程序外部的授权框架,以确定所请求的应用程序组件的用户授权。 少量的补充认证码被添加到应用程序代码中以调用认证框架内的提供者模块。 提供者模块执行应用程序之外的授权功能,并将授权结果返回给应用程序。 这些功能包括确定用户角色,确定与用户角色相关联的权限,通过规则将角色权限与所请求的应用程序组件上定义的安全性进行比较,并将授权状态返回给认证框架。 补充认证码可以通过向特定供应商转换请求的提供商接口来调用一个或多个提供者。 使用基于提供者的授权框架,可以在外部实现应用程序组件的授权,而不需要在应用程序本身内部进行硬编码授权代码。