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    • 62. 发明授权
    • Back plate assembly for a board
    • 板的背板组件
    • US07292447B2
    • 2007-11-06
    • US11308411
    • 2006-03-22
    • Wan-Lin XiaTao LiJun Long
    • Wan-Lin XiaTao LiJun Long
    • H05K7/20
    • H01L23/4093H01L2924/0002H05K1/0271Y10T24/42H01L2924/00
    • A back plate assembly (100) for a board (200) comprises a back plate (110) abutting against a side of the board and a plurality of posts (120). Each post comprises at least one latching portion (1206) formed thereon. After the latching portions have passed through the back plate and the board, the latching portions are blocked by one of the board and the back plate to secure the back plate to the board. Screws (330) are used to extend through a heat sink (300) to threadedly engage with the posts thereby mounting the heat sink to the board. Thus, the heat sink can have an intimate contact with an electronic component (210) mounted on the board.
    • 用于板(200)的后板组件(100)包括邻接板的一侧的后板(110)和多个柱(120)。 每个柱包括形成在其上的至少一个闩锁部分(1206)。 在闩锁部分通过背板和板之后,闩锁部分被板和背板中的一个阻挡,以将背板固定到板上。 螺丝(330)用于延伸穿过散热器(300)以与柱螺纹接合,从而将散热器安装到板上。 因此,散热器可以与安装在电路板上的电子部件(210)紧密接触。
    • 68. 发明授权
    • Heat sink assembly with a locking device
    • 带有锁定装置的散热器组件
    • US07746643B2
    • 2010-06-29
    • US11831930
    • 2007-07-31
    • Hao LiJun LongTao Li
    • Hao LiJun LongTao Li
    • H05K7/20H01L23/34H01L23/26A44B21/00
    • H01L23/4093H01L2924/0002Y10T24/44026Y10T24/44034H01L2924/00
    • A heat sink assembly includes a heat sink having a first shoulder and a second shoulder, and a locking device having a retention module, a first clip and a second clip. The first clip has two extension portions engaging with the retention module and a pressing portion between the two extension portions. The second clip comprises a pressing portion located on the second shoulder, an axle connecting with the pressing portion and pivotably engaging with the retention module and a locking portion connecting with the pressing portion. The second clip can rotate around the axle thereof when the heat sink assembly is in an unlocked position; the locking portion engages with the retention module and the pressing portion presses the second shoulder of the heat sink toward the retention module when the heat sink assembly is in a locked position.
    • 散热器组件包括具有第一肩部和第二肩部的散热器,以及具有保持模块,第一夹子和第二夹子的锁定装置。 第一夹子具有与保持模块接合的两个延伸部分和两个延伸部分之间的按压部分。 所述第二夹具包括位于所述第二肩部上的按压部,与所述按压部分连接并与所述保持模块可枢转地接合的轴和与所述按压部连接的锁定部。 当散热器组件处于解锁位置时,第二夹子可绕其轴线旋转; 当散热器组件处于锁定位置时,锁定部分与保持模块接合并且按压部分将散热器的第二肩部朝向保持模块按压。
    • 70. 发明授权
    • Heat dissipation device
    • 散热装置
    • US07495912B2
    • 2009-02-24
    • US11309919
    • 2006-10-27
    • Jun LongHao LiTao Li
    • Jun LongHao LiTao Li
    • H05K7/20F28F7/00
    • H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter (31) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.
    • 散热装置包括与第一发热电子部件热接触的散热器(10)。 风扇管道(30)在其中容纳散热器,并且在其相对侧具有入口(350)和出口(302)。 风扇(20)安装在风扇导管的入口处。 由风扇产生的气流的一部分流过散热器以冷却第一发热电子部件。 风扇导管上安装有快门(31)。 由风扇产生的气流的另一部分流经活门,吹出位于第一发热电子元件旁边的第二个发热电子部件,并在风扇通道的外面。