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61. 发明授权

US09414525B2 Coolant-cooled heat sink configured for accelerating coolant flow 有权
标题翻译：冷却液冷却的散热器，用于加速冷却剂流
公开(公告)号：US09414525B2
公开(公告)日：2016-08-09
申请号：US14827588
申请日：2015-08-17
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H05K7/2039 , H05K7/20254 , H05K7/20772
摘要： Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.
摘要翻译：提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面电子组件。冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过冷气携带舱。减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。

62. 发明授权

US09363924B2 Ground-based heat sink facilitating electronic system cooling 有权
标题翻译：地面散热器，便于电子系统冷却
公开(公告)号：US09363924B2
公开(公告)日：2016-06-07
申请号：US13780538
申请日：2013-02-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28D15/06 , H05K7/20 , F24J3/08 , F28D15/02
CPC分类号： H05K7/2039 , F24T10/30 , F28D15/0266 , F28D15/0275 , H05K7/20827 , Y02E10/10 , Y02E10/16
摘要： Cooling methods are provided which include providing a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.
摘要翻译：提供了冷却方法，其包括提供散热器，该散热器具有带有隔室的壳体，冷却剂入口和冷却剂出口。壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。壳体外部的第二部分设置成便于将提取的热量导入地面。

63. 发明授权

US09351431B2 Cooling system with automated seasonal freeze protection 有权
标题翻译：具有自动季节性冻结保护的冷却系统
公开(公告)号：US09351431B2
公开(公告)日：2016-05-24
申请号：US13649334
申请日：2012-10-11
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh , Jing Zhang
IPC分类号： F28F13/00 , H05K7/20
CPC分类号： H05K7/20836 , F28F2265/14
摘要： An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.
摘要翻译：提供了一种用于冷却电子部件的自动多流体冷却系统和方法。冷却系统包括冷却剂回路，冷却剂箱，多个阀和控制器。在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

64. 发明授权

US09253921B2 Coolant-conditioning unit with automated control of coolant flow valves 有权
标题翻译：具有自动控制冷却剂流量阀的冷却液调节装置
公开(公告)号：US09253921B2
公开(公告)日：2016-02-02
申请号：US13782003
申请日：2013-03-01
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： G05D23/00 , H05K7/20
CPC分类号： H05K7/20281 , F28F27/02 , H05K7/20781 , H05K7/20836
摘要： A method is provided which includes providing a coolant-conditioning unit which includes a facility coolant path, having a facility coolant flow control valve, and a system coolant path accommodating a system coolant, and having a bypass line with a system coolant bypass valve. A heat exchanger is coupled to the facility and system coolant paths to facilitate transfer of heat from the system coolant to facility coolant in the facility coolant path, and the bypass line is disposed in the system coolant path in parallel with the heat exchanger. A controller automatically controls a regulation position of the coolant bypass valve and a regulation position of the facility coolant flow control valve based on a temperature of the system coolant, and automatically adjusts the regulation position of the system coolant bypass valve to facilitate maintaining the facility coolant flow control valve at or above a specified, partially open, minimum regulation position.
摘要翻译：提供一种方法，其包括提供冷却剂调节单元，该冷却剂调节单元包括具有设备冷却剂流量控制阀的设备冷却剂通道和容纳系统冷却剂的系统冷却剂通道，并且具有与系统冷却剂旁通阀的旁路管路。热交换器被耦合到设备和系统冷却剂路径，以便于将热量从系统冷却剂传送到设备冷却剂路径中的设备冷却剂，并且旁路管线与热交换器平行地设置在系统冷却剂路径中。控制器基于系统冷却液的温度自动控制冷却剂旁通阀的调节位置和设备冷却剂流量控制阀的调节位置，并且自动调节系统冷却剂旁通阀的调节位置以便于维持设备冷却剂流量控制阀处于或高于指定的，部分打开的最小调节位置。

65. 发明授权

US09148982B2 Separate control of coolant flow through coolant circuits 有权
标题翻译：通过冷却剂回路分离冷却剂流量
公开(公告)号：US09148982B2
公开(公告)日：2015-09-29
申请号：US13671887
申请日：2012-11-08
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： G06F19/00 , H05K7/20 , G05D23/19 , G06F1/20
CPC分类号： H05K7/2079 , G05D23/1934 , G06F1/206 , H05K7/20836
摘要： Methods and coolant distribution systems are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.
摘要翻译：方法和冷却剂分配系统被提供用于自动冷却剂流控制，例如，促进多个不同电子系统的冷却。这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂电路i基于传输到冷却剂的确定的热负荷。不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

66. 发明授权

US09067288B2 Heat sink structure with a vapor-permeable membrane for two-phase cooling 有权
公开(公告)号：US09067288B2
公开(公告)日：2015-06-30
申请号：US13676242
申请日：2012-11-14
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： B23P15/26 , H05K7/20 , G06F1/20 , F28F3/00 , F28F3/12 , F28F13/00 , F28D15/02
CPC分类号： B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

67. 发明授权

US09061383B2 Heat sink structure with a vapor-permeable membrane for two-phase cooling 有权
公开(公告)号：US09061383B2
公开(公告)日：2015-06-23
申请号：US14064315
申请日：2013-10-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K7/20 , B23P15/26 , G06F1/20 , F28F3/00 , F28F3/12 , F28F13/00 , F28D15/02
CPC分类号： B23P15/26 , F28D15/0266 , F28F3/00 , F28F3/12 , F28F13/00 , G06F1/20 , H05K7/20254 , H05K7/20272 , H05K7/2029 , H05K7/20772 , Y10T29/4935
摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

68. 发明授权

US08964390B2 Sectioned manifolds facilitating pumped immersion-cooling of electronic components 有权
标题翻译：有助于泵送浸入式冷却电子部件的分段式歧管
公开(公告)号：US08964390B2
公开(公告)日：2015-02-24
申请号：US13671802
申请日：2012-11-08
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , F28D15/00 , F28F27/00 , F28F9/00 , B23P15/26
CPC分类号： B23P15/26 , F28D15/02 , F28F3/048 , F28F3/12 , F28F2250/06 , H05K7/20809 , Y10T29/4935
摘要： Cooling apparatuses and methods are provided for facilitating pumped immersion-cooling of electronic components. The cooling apparatus includes a housing forming a compartment about one or more components, a supply manifold, a return manifold, and a coolant loop coupling in fluid communication the supply and return manifolds and the housing. Coolant flowing through the coolant loop flows through the compartment of the housing and at least partially immersion-cools the component(s) by flow boiling. A pump facilitates circulation of coolant within the loop, and a coolant bypass line is coupled between the supply and return manifolds. The return manifold includes a mixed-phase manifold section, and the bypass line provides coolant from the supply manifold directly to the mixed-phase manifold section. Coolant flows from the coolant bypass line into the mixed-phase manifold section in a direction counter to the direction of any coolant vapor flow within that manifold section.
摘要翻译：提供冷却装置和方法以便于电子部件的抽吸浸没冷却。冷却装置包括围绕一个或多个部件形成隔室的壳体，供应歧管，回流歧管以及使供应和返回歧管与壳体流体连通的冷却剂回路联接器。流过冷却剂回路的冷却剂流过壳体的隔室，并且至少部分地通过流动沸腾来浸没组件。泵有利于循环内的冷却剂循环，并且冷却剂旁通管线连接在供应和返回歧管之间。回流歧管包括混合相歧管部分，并且旁路管线将冷却剂从供应歧管直接提供给混合相歧管部分。冷却剂从冷却剂旁通管路流向与该歧管部分内任何冷却剂蒸气流的方向相反的方向流入混合相歧管部分。

69. 发明授权

US08817465B2 Multi-rack assembly with shared cooling apparatus 有权
标题翻译：带共用冷却装置的多机架组件
公开(公告)号：US08817465B2
公开(公告)日：2014-08-26
申请号：US13684736
申请日：2012-11-26
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth , Madhusudan K. Iyengar , Robert E. Simons
IPC分类号： H05K5/00
CPC分类号： H05K7/20709 , H05K7/20781
摘要： A method is provided which includes providing a multi-rack assembly having adjacent first and second electronics racks, each being at least partially air-cooled, and an air-to-liquid heat exchanger associated with the first rack for cooling at least a portion of air passing through the first rack. The heat exchanger, which is disposed at the air inlet or air outlet side of the first rack and is coupled in fluid communication with a coolant loop to receive coolant from the loop and exhaust coolant to the loop, transfers heat from air passing thereacross to coolant passing therethrough. The assembly also includes a cooling unit, associated with the first rack and cooling coolant in the coolant loop, and an airflow director associated with the second rack and facilitating ducting at least a portion of air passing through the second rack to also pass across the heat exchanger associated with the first rack.
摘要翻译：提供了一种方法，其包括提供具有相邻的第一和第二电子机架的多齿条组件，每个电子机架至少部分地被空气冷却，以及与第一齿条相关联的空气与液体热交换器，用于冷却至少一部分空气通过第一个机架。该热交换器设置在第一齿条的空气入口或空气出口侧，并且与冷却剂回路流体连通地连接以接收来自回路的冷却剂并将冷却剂排出到回路，将来自经过其的空气的热量传递给冷却剂通过组件还包括与第一齿条相关联的冷却单元和冷却剂回路中的冷却冷却剂，以及与第二齿条相关联的气流引导件，并且便于管道通过第二齿条的至少一部分空气也穿过热交换机与第一个机架相关联。

70. 发明授权

US08806749B2 Two-phase, water-based immersion-cooling apparatus with passive deionization 有权
标题翻译：具有无源去离子的两相水基浸没式冷却装置
公开(公告)号：US08806749B2
公开(公告)日：2014-08-19
申请号：US13684724
申请日：2012-11-26
申请人： International Business Machines Corporation
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： H01L23/34 , H01L21/50 , B21D53/02
CPC分类号： H05K13/00 , F28D15/02 , F28D2021/0028 , H01L23/427 , H01L23/473 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K7/20236 , H05K7/203 , H05K7/20745 , H05K7/20772 , H05K7/20809 , Y10T29/49002 , Y10T29/49353 , H01L2924/00
摘要： Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.
摘要翻译：提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。该方法包括例如：将壳体围绕待冷却的电子部件固定，壳体至少部分围绕并围绕待冷却的电子部件形成隔室; 在所述隔室内设置流体，其中待冷却的所述电子部件至少部分地浸入所述流体内，并且其中所述流体包括水; 以及在所述隔间内提供去离子结构，所述去离子结构包括去离子材料，所述去离子材料确保所述隔室内的所述流体的去离子，其中所述去离子结构被构造成适应所述隔室内的流体的沸腾。

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