专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

61. 发明申请

US20160141937A1 FUEL VAPORIZATION USING DATA CENTER WASTE HEAT 有权
公开(公告)号：US20160141937A1
公开(公告)日：2016-05-19
申请号：US14547284
申请日：2014-11-19
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H02K7/18 , H05K7/20 , H02P9/04
CPC分类号： F01K25/08 , F01K5/00 , F25B15/00 , F25B19/00 , F25B27/02 , F25B49/00 , H02P9/04 , H05K7/20709 , H05K7/20818 , H05K7/20836
摘要： Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

62. 发明申请

US20160136851A1 COMPOSITE HEAT SINK STRUCTURES 有权
公开(公告)号：US20160136851A1
公开(公告)日：2016-05-19
申请号：US14828767
申请日：2015-08-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： B29C43/18 , B29C43/20
CPC分类号： H01L23/473 , B29C43/18 , B29C43/203 , B29C70/84 , B29C70/88 , B29K2101/12 , B29K2705/00 , B29L2009/00 , B29L2031/3406 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/00 , H01L2924/0002 , H05K7/20254 , H05K7/20436 , H05K7/20509 , H05K7/20772
摘要： Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

63. 发明申请

US20160095260A1 PROTECTIVE LOUVER ASSEMBLY FOR AIR-MOVING ASSEMBLY 审中-公开
标题翻译：用于空气动力组件的保护装置
公开(公告)号：US20160095260A1
公开(公告)日：2016-03-31
申请号：US14831090
申请日：2015-08-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , Robert K. MULLADY , Roger R. SCHMIDT
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , H05K7/20181
摘要： Apparatuses and methods are provided for blocking removal of an air-moving assembly from a chassis when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the chassis, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.
摘要翻译：提供了设备和方法，用于当处于操作状态时阻止从底盘移除空气移动组件。该装置包括具有百叶窗和互锁元件的保护百叶窗组件。百叶窗设置在空气移动组件的空气入口或空气出口处，并且依赖于通过空气移动组件的气流的存在或不存在而在操作和静止取向之间枢转。互锁元件与百叶窗相关联，以在操作方向和静止取向之间与百叶窗枢转。在操作方向上，互锁元件至少部分地阻挡至少一个将空气移动组件固定在底盘内的紧固件，从而防止空气移动组件从底盘移除时运行状态

64. 发明申请

US20160095259A1 LOCKING LOUVER ASSEMBLY FOR AIR-MOVING ASSEMBLY 有权
标题翻译：用于空运组件的锁紧装置
公开(公告)号：US20160095259A1
公开(公告)日：2016-03-31
申请号：US14831073
申请日：2015-08-20
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Christopher R. CIRAULO , Milnes P. DAVID , Dustin W. DEMETRIOU , Robert K. MULLADY , Roger R. SCHMIDT
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , F04D25/14 , H05K7/20181 , H05K7/2019
摘要： Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.
摘要翻译：提供了设备和方法，用于在运行状态下将空气移动组件锁定在底盘内。该装置包括具有百叶窗和锁定机构的锁定百叶窗组件。百叶窗设置在空气移动组件的空气入口或出口处，并且依赖于通过空气移动组件的气流的存在或不存在而在操作和静止取向之间枢转。所述锁定机构包括固定到所述百叶窗上以与之枢转的键合元件，所述键合元件包括当所述百叶窗处于操作定向时沿第一方向定向的细长键，以及当所述百叶窗处于操作方向时的第二方向，在静止的方向。钥匙接收元件与底盘相关联，并且包括钥匙开口，该钥匙开口接收并容纳细长钥匙在第一和第二方向之间的运动，并且防止空气移动组件的移除所述机箱具有朝向所述第一方向的所述键。

65. 发明申请

US20160050790A1 MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING 有权
标题翻译：具有整体冷却冷却功能的多组分电子模块
公开(公告)号：US20160050790A1
公开(公告)日：2016-02-18
申请号：US14925110
申请日：2015-10-28
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28D15/00 , G06F1/20 , H01L21/4882 , H01L23/34 , H01L23/367 , H01L23/3675 , H01L23/3677 , H01L23/473 , H01L2924/0002 , H05K7/20281 , H01L2924/00
摘要： A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.
摘要翻译：提供冷却剂冷却的电子模块，其包括多组件组件和具有在各个电子部件上对齐的开口的模块盖。导热元件设置在开口内，每个包括相对的冷却剂冷却和传导表面，导电表面热耦合到相应的电子部件。设置在模块盖上方的歧管组件包括内部和外部歧管元件，内部元件构造成便于冷却剂流入冷却剂冷却表面。外部歧管元件设置在内部歧管元件上并且联接到模块盖，其中内部和外部歧管元件限定冷却剂供应歧管，并且外部歧管元件和模块盖限定冷却剂返回歧管。冷却剂供应开口与冷却剂供应歧管流体连通，并且冷却剂排放通道与冷却剂回流歧管流体连通。

66. 发明申请

US20150359140A1 SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE 有权
标题翻译：电子卡选择性夹紧冷却冷却结构
公开(公告)号：US20150359140A1
公开(公告)日：2015-12-10
申请号：US14827699
申请日：2015-08-17
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Amilcar R. ARVELO , Mark A. BRANDON , Levi A. CAMPBELL , Tan D. DOAN , Michael J. ELLSWORTH, JR. , Randall G. KEMINK , Eric J. McKEEVER
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , B23P15/26 , G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , Y10T29/4935 , H01L2924/00
摘要： Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure.
摘要翻译：提供了冷却装置和冷却剂冷却的电子组件，其包括被配置为耦合到可操作地插入到电子系统中的电子卡的热转印结构。热传递结构包括可在打开位置和夹紧位置之间移动的夹紧结构。与电子系统可操作地插入的电子系统相关联的冷却剂冷却结构驻留在电子卡之间，并且至少部分地通过将电子卡插入电子系统中的夹持结构。夹紧结构的打开位置便于电子系统内的电子卡与卡之间的冷却剂冷却结构与至少部分地夹持结构之间的卡止结构，并且夹紧结构向夹紧位置的移动有利于夹紧冷却剂冷却结构的热传递结构以及从卡到冷却剂冷却结构的热传导。

67. 发明申请

US20150109728A1 FIELD-REPLACEABLE BANK OF IMMERSION-COOLED ELECTRONIC COMPONENTS 有权
公开(公告)号：US20150109728A1
公开(公告)日：2015-04-23
申请号：US14058581
申请日：2013-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/203 , H05K7/20 , H05K7/20236 , H05K7/20336 , H05K7/20781
摘要： A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

68. 发明申请

US20150107801A1 COOLANT-COOLED HEAT SINK CONFIGURED FOR ACCELERATING COOLANT FLOW 有权
标题翻译：用于加速冷却液流动的冷却冷却热水槽
公开(公告)号：US20150107801A1
公开(公告)日：2015-04-23
申请号：US14058562
申请日：2013-10-21
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Richard C. CHU , Milnes P. DAVID , Michael J. ELLSWORTH, JR. , Madhusudan K. IYENGAR , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20254 , H05K7/20772
摘要： Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.
摘要翻译：提供冷却装置，冷却的电子模块和制造方法，其有助于从一个或多个电子部件到冷却剂的热传递。该冷却装置包括具有导热结构的冷却剂冷却的散热器，该导热结构具有一个带有冷却剂输送隔室，该冷却剂输送室包括变化的横截面冷却剂流动区域，冷却剂流动区域通过冷却剂流动区域大致平行于结构的主传热表面电子组件。冷却剂冷却的散热器包括冷却剂入口和与冷却剂携带室流体连通的冷却剂出口，并且冷却剂承载室的冷却剂流动区域至少部分地沿冷却剂流过冷气携带舱。减少的冷却剂流动面积有助于通过至少部分地加速冷却剂供给室内的冷却剂流而增加主传热表面和冷却剂之间的有效传热系数。

69. 发明申请

US20150055299A1 FABRICATING MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING 有权
标题翻译：整体冷却冷却制造多组分电子模块
公开(公告)号：US20150055299A1
公开(公告)日：2015-02-26
申请号：US14528098
申请日：2014-10-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Amilcar R. ARVELO , Levi A. CAMPBELL , Michael J. ELLSWORTH, JR. , Eric J. McKEEVER
IPC分类号： H05K7/20
CPC分类号： H05K7/20263 , F28D15/00 , G06F1/20 , H01L21/4882 , H01L23/34 , H01L23/367 , H01L23/3675 , H01L23/3677 , H01L23/473 , H01L2924/0002 , H05K7/20281 , H01L2924/00
摘要： Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold.
摘要翻译：提供了制造冷却剂冷却部件组件的方法，其包括提供具有在各个电子部件上对准的开口的多部件组件和模块盖。导热元件设置在开口内，每个包括相对的冷却剂冷却和传导表面，导电表面热耦合到相应的电子部件。设置在模块盖上方的歧管组件包括内部和外部歧管元件，内部元件构造成便于冷却剂流入冷却剂冷却表面。外部歧管元件设置在内部歧管元件上并且联接到模块盖，其中内部和外部歧管元件限定冷却剂供应歧管，并且外部歧管元件和模块盖限定冷却剂返回歧管。冷却剂供应开口与冷却剂供应歧管流体连通，并且冷却剂排放通道与冷却剂回流歧管流体连通。

70. 发明申请

US20150052753A1 SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE 有权
标题翻译：电子卡选择性夹紧冷却冷却结构
公开(公告)号：US20150052753A1
公开(公告)日：2015-02-26
申请号：US14528052
申请日：2014-10-30
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Amilcar R. ARVELO , Mark A. BRANDON , Levi A. CAMPBELL , Tan D. DOAN , Michael J. ELLSWORTH, Jr. , Randall G. KEMINK , Eric J. McKEEVER
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： H05K7/20254 , B23P15/26 , G06F1/20 , H01L23/473 , H01L2924/0002 , H05K7/20772 , Y10T29/4935 , H01L2924/00
摘要： Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure.
摘要翻译：提供了制造冷却装置的方法，其包括：提供构造成耦合到电子卡的热转印结构，所述热转印结构包括可在打开位置和夹紧位置之间移动的夹持结构; 以及提供冷却剂冷却结构，其被配置为驻留在所述电子系统的接收槽内并且与所述电子系统的接收槽相关联，所述电子系统在所述电子系统中可操作地插入所述冷却剂冷却结构，所述冷却剂冷却结构驻留在所述电子卡之间，当传输结构耦合到电子卡并且卡可操作地插入到接收槽中时，结构，其中打开的位置有助于将电子卡插入到电子系统中，并且夹持结构移动到夹紧位置有助于夹紧冷却剂冷却结构的热传递结构，以及从电子卡到冷却剂冷却结构的热传导。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式