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    • 63. 发明授权
    • Methods of manufacturing charge trap-type non-volatile memory devices
    • 制造电荷陷阱型非易失性存储器件的方法
    • US08178408B2
    • 2012-05-15
    • US12651781
    • 2010-01-04
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • Hak-Sun LeeKyoung-Sub ShinJeong-Dong Choe
    • H01L21/336H01L21/3205
    • H01L27/11568
    • Some methods are directed to manufacturing charge trap-type non-volatile memory devices. An isolation layer pattern can be formed that extends in a first direction in a substrate. A recess unit is formed in the substrate by recessing an exposed surface of the substrate adjacent to the isolation layer pattern. A tunnel insulating layer and a charge trap layer are sequentially formed on the substrate. The tunnel insulating layer and the charge trap layer are patterned to form an isolated island-shaped tunnel insulating layer pattern and an isolated island-shaped charge trap layer pattern by etching defined regions of the substrate, the isolation layer pattern, the tunnel insulating layer, and the charge trap layer until a top surface of the charge trap layer that is disposed on a bottom surface of the recess unit is aligned with a top surface of the isolation layer pattern. A blocking insulating layer is formed that covers the charge trap layer pattern, the isolation layer pattern, and a defined region of the substrate interposed between the charge trap patterns. A gate electrode pattern is formed on the blocking insulating layer to face the charge trap layer pattern. This manufacturing process may reduce charge spreading between unit memory cells and/or may prevent/avoid reduction in the breakdown voltage of the blocking insulating layer.
    • 一些方法涉及制造电荷陷阱型非易失性存储器件。 可以形成在衬底中沿第一方向延伸的隔离层图案。 通过使邻近隔离层图案的基板的暴露表面凹陷而在基板中形成凹部单元。 隧道绝缘层和电荷陷阱层依次形成在基板上。 图案化隧道绝缘层和电荷陷阱层,通过蚀刻衬底的限定区域,隔离层图案,隧道绝缘层,隔离层状图案,隔离层状图案,隧道绝缘层, 并且电荷陷阱层直到设置在凹陷单元的底表面上的电荷陷阱层的顶表面与隔离层图案的顶表面对准。 形成了覆盖电荷陷阱层图案,隔离层图案和插入在电荷阱图案之间的基板的限定区域的阻挡绝缘层。 在阻挡绝缘层上形成面对电荷陷阱层图案的栅电极图案。 该制造过程可以减小单元存储单元之间的电荷扩展和/或可以防止/避免阻塞绝缘层的击穿电压的降低。
    • 65. 发明授权
    • Non-volatile memory device and method of manufacturing the same
    • 非易失性存储器件及其制造方法
    • US08049269B2
    • 2011-11-01
    • US11898266
    • 2007-09-11
    • Se-Hoon LeeKyu-Charn ParkJeong-Dong Choe
    • Se-Hoon LeeKyu-Charn ParkJeong-Dong Choe
    • H01L29/792H01L29/788H01L21/336H01L21/8247
    • H01L27/115H01L27/11568H01L29/66833H01L29/792H01L29/7926
    • In a non-volatile memory device, active fin structures extending in a first direction may be formed on a substrate. A tunnel insulating layer may be formed on surfaces of the active fin structures and bottom surfaces of trenches that may be defined by the active fin structures. A charge trapping layer and a blocking layer may be sequentially formed on the tunnel insulating layer. A gate electrode structure may include first portions disposed over top surfaces of the active fin structures and second portions vertically spaced apart from portions of the charge trapping layer that may be disposed over the bottom surfaces of the trenches, and may extend in a second direction substantially perpendicular to the first direction. Thus, lateral electron diffusion may be reduced in the charge trapping layer, and thereby the data retention performance and/or reliability of the non-volatile memory device may be improved.
    • 在非易失性存储器件中,可以在衬底上形成沿第一方向延伸的活性鳍结构。 隧道绝缘层可以形成在活动鳍结构和沟槽底表面的表面上,沟槽绝缘层可以由活性鳍结构限定。 电荷俘获层和阻挡层可以顺序形成在隧道绝缘层上。 栅极电极结构可以包括设置在有源鳍结构的顶表面上的第一部分和与可以设置在沟槽的底表面之上的电荷俘获层的部分垂直间隔开的第二部分,并且可以在基本上 垂直于第一方向。 因此,电荷捕捉层中的横向电子扩散可能减少,从而可以提高非易失性存储器件的数据保持性能和/或可靠性。
    • 67. 发明申请
    • Non-volatile memory device and method of manufacturing the same
    • 非易失性存储器件及其制造方法
    • US20080061361A1
    • 2008-03-13
    • US11898266
    • 2007-09-11
    • Se-Hoon LeeKyu-Charn ParkJeong-Dong Choe
    • Se-Hoon LeeKyu-Charn ParkJeong-Dong Choe
    • H01L29/792H01L21/336
    • H01L27/115H01L27/11568H01L29/66833H01L29/792H01L29/7926
    • In a non-volatile memory device, active fin structures extending in a first direction may be formed on a substrate. A tunnel insulating layer may be formed on surfaces of the active fin structures and bottom surfaces of trenches that may be defined by the active fin structures. A charge trapping layer and a blocking layer may be sequentially formed on the tunnel insulating layer. A gate electrode structure may include first portions disposed over top surfaces of the active fin structures and second portions vertically spaced apart from portions of the charge trapping layer that may be disposed over the bottom surfaces of the trenches, and may extend in a second direction substantially perpendicular to the first direction. Thus, lateral electron diffusion may be reduced in the charge trapping layer, and thereby the data retention performance and/or reliability of the non-volatile memory device may be improved.
    • 在非易失性存储器件中,可以在衬底上形成沿第一方向延伸的活性鳍结构。 隧道绝缘层可以形成在活动鳍结构和沟槽底表面的表面上,沟槽绝缘层可以由活性鳍结构限定。 电荷俘获层和阻挡层可以顺序形成在隧道绝缘层上。 栅极电极结构可以包括设置在有源鳍结构的顶表面上的第一部分和与可以设置在沟槽的底表面之上的电荷俘获层的部分垂直间隔开的第二部分,并且可以在基本上 垂直于第一方向。 因此,电荷捕捉层中的横向电子扩散可能减少,从而可以提高非易失性存储器件的数据保持性能和/或可靠性。