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    • 66. 发明授权
    • Method of producing porous silica-based particles
    • 生产多孔二氧化硅基颗粒的方法
    • US07901652B2
    • 2011-03-08
    • US11793707
    • 2005-12-15
    • Kazuaki InoueKazuhiro NakayamaAkira Nakashima
    • Kazuaki InoueKazuhiro NakayamaAkira Nakashima
    • C01B33/141C01B33/143
    • C01B33/193B01J20/103B01J20/28004B01J20/28011C01B33/143C01B33/18C01P2004/03
    • Porous silica-based particles with relatively larger average diameter of 1 micron or more and a low particle density are prepared. The method includes the steps of (a) preparing two-layer separated liquid including an organic silicon compound layer and a water layer, then adding an organic solvent, an alkali, and a surfactant into the water layer while agitating at least the water layer so that the organic silicon compound layer and the water layer are not completely mixed with each other, further hydrolyzing and/or partial hydrolyzing the organic silicon compound in the mixed aqueous solution to prepare silica-based particle precursors, (b) adding sodium aluminate into the mixed aqueous solution containing the silica-based particle precursors and then preparing silica-based particles having pores, cavities or voids inside the particles, and (c) washing and drying the silica-based particles. The particles are useful for various applications such as microcapsules, adsorbents, catalysts, and so on.
    • 制备相对较大的平均直径为1微米或更大并且具有低颗粒密度的多孔二氧化硅基颗粒。 该方法包括以下步骤:(a)制备包含有机硅化合物层和水层的两层分离液体,然后在至少水层搅拌的同时向水层中加入有机溶剂,碱和表面活性剂 有机硅化合物层和水层彼此不完全混合,进一步水解和/或部分水解混合水溶液中的有机硅化合物以制备二氧化硅基颗粒前体,(b)将铝酸钠加入到 混合含有二氧化硅基颗粒前体的水溶液,然后在颗粒内制备具有孔,空洞或空隙的二氧化硅基颗粒,和(c)洗涤和干燥二氧化硅基颗粒。 这些颗粒可用于各种应用,如微胶囊,吸附剂,催化剂等。
    • 67. 发明申请
    • Method for manufacturing silicon wafer
    • 硅晶片制造方法
    • US20090325385A1
    • 2009-12-31
    • US12584269
    • 2009-09-01
    • Shinichi TomitaMasao YoshimutaYasuyuki HashimotoAkira Nakashima
    • Shinichi TomitaMasao YoshimutaYasuyuki HashimotoAkira Nakashima
    • H01L21/304
    • H01L21/304H01L21/02024H01L21/2007H01L21/76256
    • A method for manufacturing a silicon wafer is characterized by performing one or both of grinding and polishing to a thin discoid silicon wafer to give bowl-shaped warpage that is concave at a central part to a wafer surface. One main surface of the thin discoid silicon wafer is adsorbed and held, and one or both of grinding and polishing are performed to the other main surface to fabricate a convex wafer whose thickness is increased from a wafer outer periphery toward a wafer center or fabricate a concave wafer whose thickness is reduced from the wafer outer periphery toward the wafer center. Then, the other main surface is adsorbed and held to protrude the center or the periphery of the one main surface side based on elastic deformation. One or both of grinding and polishing are carried out with respect to the one main surface to flatten the main surface, and adsorption and holding are released to give bowl-shaped warpage that is concave at the central part to the other main surface or the one main surface. By the method, an SOI wafer or an epitaxial silicon wafer having a high degree of flatness is obtained.
    • 硅晶片的制造方法的特征在于对薄盘状硅晶片进行研磨抛光中的一个或两个以给出在晶片表面的中心部分凹陷的碗形翘曲。 吸附并保持薄盘形硅晶片的一个主表面,并且对另一个主表面进行研磨和抛光中的一个或两个以制造厚度从晶片外周朝向晶片中心增加的凸形晶片,或者制造 其厚度从晶片外周朝向晶片中心减小的凹晶片。 然后,基于弹性变形,另一个主表面被吸附并保持成一个主表面侧的中心或周边突出。 研磨抛光中的一个或两个相对于一个主表面进行,以平坦化主表面,并且释放吸附和保持以产生碗形翘曲,其在中心部分处凹入另一个主表面或一个 主表面。 通过该方法,获得了具有高平坦度的SOI晶片或外延硅晶片。
    • 69. 发明申请
    • Sheet feeding device
    • 送纸装置
    • US20080012201A1
    • 2008-01-17
    • US11701407
    • 2007-02-02
    • Akira NakashimaToyoaki Nanba
    • Akira NakashimaToyoaki Nanba
    • B65H5/08
    • B65H3/0684B65H3/48B65H3/54B65H2404/1521
    • A sheet feeding device includes a stacking plate, a pick-up device, means for blowing air, and a holding member. On the plate, sheets to be fed into a processing apparatus are placed. The device sends out a top one of the sheets placed on the plate, and has a pick-up roller to be brought into contact with an upper side of the top sheet at a position within a predetermined level range when the sheet is to be fed into the apparatus. The means blows air to the sheet with a predetermined force in a direction to separate the sheet from the other sheets placed on the plate or from the plate. The member is to be brought into contact with the upper side at a position upstream of the roller with respect to a feeding direction in which the sheet is to be fed into the apparatus.
    • 片材进给装置包括堆叠板,拾取装置,用于吹送空气的装置和保持构件。 在板上放置要送入处理装置的片材。 该装置发出放置在板上的最上面的片材,并且具有一个拾取辊,以便在片材被供给时在一个预定水平范围内的位置与顶片的上侧接触 进入设备。 该装置以预定的力沿着将片材与放置在板上的其它片材或板材分开的方向吹送到片材上。 相对于纸张被供给到装置中的进给方向,该部件将在辊的上游位置与上侧接触。