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61. 发明授权

US5356491A Composition and method for treating tin plated steel surface 失效
标题翻译：镀锡钢表面处理的组成和方法
公开(公告)号：US5356491A
公开(公告)日：1994-10-18
申请号：US64085
申请日：1993-05-21
申请人： Tomoyuki Aoki , Masayuki Yoshida
发明人： Tomoyuki Aoki , Masayuki Yoshida
IPC分类号： C08F12/26 , C08F12/00 , C09D5/08 , C09D5/12 , C09D125/00 , C09D125/18 , C23C22/23 , C23C22/68 , C23C22/07
CPC分类号： C23C22/68 , C09D125/18 , C09D5/08 , C23C22/23
摘要： A superior protective prepainting treatment for tin plated steel surfaces, particularly DI cans, may be achieved by contacting the surface with an aqueous liquid composition containing from 1 to 30 g/L of phosphate ions, from 0.1 to 5 g/L of condensed phosphate ions, from 0.5 to 5 g/L of reducing agent, and from 0.1 to 20 g/L of dissolved solids of a water soluble aminated poly{vinyl phenol} resin.
摘要翻译： PCT No.PCT / US91 / 08405 Sec。 371日期：1993年5月21日 102（e）日期1993年5月21日PCT 1991年11月14日PCT。对镀锡钢表面，特别是DI罐的优异的保护性涂料处理可以通过使表面与含有1至30g / L磷酸根离子，0.1〜5g / L缩合磷酸根离子，0.5〜5g / L还原剂，0.1〜20g / L溶解固体的水溶性胺化聚{乙烯基苯酚} 树脂。

62. 发明申请

US20150158977A1 POLYAMIDE PRODUCTION METHOD 有权
标题翻译：聚酰胺生产方法
公开(公告)号：US20150158977A1
公开(公告)日：2015-06-11
申请号：US14406607
申请日：2012-06-19
申请人： Taku Ishimaru , Katsumi Akaike , Daisuke Kikuno , Tomoyuki Aoki , Minoru Noda , Yasunori Tsuda
发明人： Taku Ishimaru , Katsumi Akaike , Daisuke Kikuno , Tomoyuki Aoki , Minoru Noda , Yasunori Tsuda
IPC分类号： C08G69/26
CPC分类号： C08G69/26 , B29C47/1063 , B29C47/364 , C08G69/265 , C08G69/28 , C08G69/36 , C08L77/00 , C08L77/06 , D01F6/90
摘要： A method of producing a polyamide includes (i) polycondensating a polyamide precursor containing a salt made from a dicarboxylic acid and a diamine under pressure in a pre-polymerization tank to obtain a prepolymer, and (ii) highly polymerizing the prepolymer with an extruder, wherein when the prepolymer in a molten state which is obtained in the step (i) is fed, by a pump, to the low-pressure extruder from the pre-polymerization tank through a discharge side pipe disposed downstream of the pump, the prepolymer is fed such that the length L [cm] of the discharge side pipe and the linear velocity of discharge v [cm/s] of the prepolymer by the pump satisfy the relationship expressed by the equation, 0.1 [s]≦L/v
摘要翻译：制备聚酰胺的方法包括：（i）在预聚合槽中将压缩下由二羧酸和二胺制成的盐的聚酰胺前体缩聚得到预聚物，和（ii）用挤出机使聚合物高度聚合，其中当步骤（i）中获得的处于熔融状态的预聚物通过泵从预聚合槽通过布置在泵下游的排放侧管被泵送到低压挤出机中时，预聚物是进料使得排出侧管的长度L [cm]和泵的预定液体的线速度v [cm / s]满足由式表示的关系：0.1 [s]＆nlE; L / v < 10 [s]。

63. 发明授权

US08432018B2 Semiconductor device and manufacturing method of semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US08432018B2
公开(公告)日：2013-04-30
申请号：US13271469
申请日：2011-10-12
申请人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Eiji Sugiyama , Kaori Ogita , Naoto Kusumoto
发明人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Eiji Sugiyama , Kaori Ogita , Naoto Kusumoto
IPC分类号： H01L29/06
CPC分类号： H01L23/293 , H01L23/49855 , H01L23/66 , H01L27/1248 , H01L27/1266 , H01L27/13 , H01L28/10 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer.
摘要翻译：本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值在导电层上形成的绝缘层与导电层的厚度比为至少0.2。此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。

64. 发明授权

US08357598B2 Method for manufacturing antenna and method for manufacturing semiconductor device 有权
标题翻译：制造天线的方法及制造半导体器件的方法
公开(公告)号：US08357598B2
公开(公告)日：2013-01-22
申请号：US13196133
申请日：2011-08-02
申请人： Tomoyuki Aoki , Daiki Yamada
发明人： Tomoyuki Aoki , Daiki Yamada
IPC分类号： H01L21/20 , H01L21/36
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/6836 , H01L21/76826 , H01L21/76856 , H01L23/5227 , H01L24/83 , H01L27/1285 , H01L27/1292 , H01L27/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/6835 , H01L2221/68363 , H01L2223/6677 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01012 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01Q1/2225 , H05K1/095 , H05K3/02 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.
摘要翻译：本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。含有导电颗粒的流体被施加在物体上。在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

65. 发明授权

US08227851B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08227851B2
公开(公告)日：2012-07-24
申请号：US12952766
申请日：2010-11-23
申请人： Tomoyuki Aoki , Koji Dairiki , Yuugo Goto
发明人： Tomoyuki Aoki , Koji Dairiki , Yuugo Goto
IPC分类号： H01L27/112
CPC分类号： H01L27/13 , G06K19/07749 , H01L21/6835 , H01L23/5227 , H01L23/552 , H01L23/576 , H01L23/585 , H01L27/105 , H01L27/11509 , H01L27/11526 , H01L27/11546 , H01L27/1203 , H01L27/124 , H01L27/1266 , H01L29/78618 , H01L2221/6835 , H01L2221/68368 , H01L2924/0002 , H01L2924/12044 , H01L2924/30105 , H01Q1/2208 , H01L2924/00
摘要： It is an object of the invention to provide semiconductor devices which can protect privacy of consumers or holders of commercial products and control the communication range according to use, even when the semiconductor device which can exchange data without contact is mounted on the commercial products. A semiconductor device of the invention includes an element group including a plurality of transistors over a substrate; a first conductive film functioning as an antenna over the element group; a second conductive film surrounding the first conductive film; an insulating film covering the first and second end portions; and a third conductive film over the insulating film. The first conductive film is provided in the shape of a coil, and each end portion of the first conductive film is connected to the element group. First and second end portions of the second conductive film are not connected to each other.
摘要翻译：本发明的目的是提供可以保护消费者或商业产品持有人的隐私的半导体器件，并且即使当可以将交换数据而没有接触的半导体器件安装在商业产品上时，也可以根据使用来控制通信范围。本发明的半导体器件包括在衬底上包括多个晶体管的元件组; 用作元件组上的天线的第一导电膜; 围绕所述第一导电膜的第二导电膜; 覆盖所述第一和第二端部的绝缘膜; 和绝缘膜上的第三导电膜。第一导电膜设置为线圈形状，并且第一导电膜的每个端部连接到元件组。第二导电膜的第一端部和第二端部彼此不连接。

66. 发明授权

US07851278B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07851278B2
公开(公告)日：2010-12-14
申请号：US12000599
申请日：2007-12-14
申请人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
发明人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
IPC分类号： H01L21/00 , H01L21/84
CPC分类号： H01L31/0203 , H01L27/1446 , H01L27/14618 , H01L31/048 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.
摘要翻译：本发明提供一种半导体器件，其形成在绝缘基板上，通常是半导体器件，其具有可以在光学传感器，太阳能电池或使用TFT的电路中增加布线板的安装强度的结构，并且其可以使其安装在高密度的布线板上，并且还提供其制造方法。根据本发明，在半导体器件中，半导体元件形成在绝缘基板上，在半导体器件的侧面形成有凹部，与半导体元件电连接的导电膜形成在凹部一部分。

67. 发明授权

US07767516B2 Semiconductor device, manufacturing method thereof, and manufacturing method of antenna 有权
标题翻译：半导体装置及其制造方法以及天线的制造方法
公开(公告)号：US07767516B2
公开(公告)日：2010-08-03
申请号：US11920273
申请日：2006-05-29
申请人： Tomoyuki Aoki , Yuugo Goto
发明人： Tomoyuki Aoki , Yuugo Goto
IPC分类号： H01L21/8234
CPC分类号： G06K19/07749 , H01L23/49855 , H01L23/5227 , H01L23/5328 , H01L27/12 , H01L27/1292 , H01L27/13 , H01L2924/0002 , H01Q1/38 , H01Q7/00 , H01Q9/27 , H01Q23/00 , H05K3/1216 , H01L2924/00
摘要： An element group having a transistor is formed over a substrate and a conductive film to be a dummy pattern is formed over the element group by pushing out a paste including conductive particles from a first opening portion, and then a conductive film functioning as an antenna is formed continuously thereafter so as to electrically connect with the transistor, by pushing out a paste including conductive particles from a second opening portion. Therefore, an element group having a transistor, provided over a substrate; a first conductive film functioning as an antenna provided over the element group and is electrically connected to the transistor; a second conductive film to be a dummy pattern provided to be adjacent to the first conductive film and is not electrically connected to the transistor; are included.
摘要翻译：在基板上形成具有晶体管的元件组，并且通过从第一开口部分推出包括导电粒子的浆料，在元件组上形成作为虚设图案的导电膜，然后，用作天线的导电膜为随后通过从第二开口部分推出包括导电粒子的浆料，从而与晶体管电连接。因此，设置在基板上的具有晶体管的元件组; 用作天线的第一导电膜，设置在元件组上并电连接到晶体管; 第二导电膜为与第一导电膜相邻且不与晶体管电连接的虚设图案; 包括在内。

68. 发明授权

US07759788B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07759788B2
公开(公告)日：2010-07-20
申请号：US12230484
申请日：2008-08-29
申请人： Tomoyuki Aoki , Takuya Tsurume , Hiroki Adachi , Hisashi Ohtani
发明人： Tomoyuki Aoki , Takuya Tsurume , Hiroki Adachi , Hisashi Ohtani
IPC分类号： H01L23/14
CPC分类号： H01L23/49855 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： A highly reliable semiconductor device which is not damaged by local pressing force from the outside and in which unevenness of a portion where an antenna and an element overlap with each other is reduced. The semiconductor device includes a chip and an antenna. The chip includes a semiconductor element layer including a thin film transistor; a conductive resin electrically connected to the semiconductor element layer; and a sealing layer. The sealing layer in which a fiber body is impregnated with an organic resin covers the semiconductor element layer and the conductive resin, and has a thickness of 10 to 100 μm. The antenna has a depressed portion and is electrically connected to the semiconductor element layer through the conductive resin. The chip is embedded inside the depressed portion. The thickness of the chip is equal to the depth of the depressed portion.
摘要翻译：不会受到来自外部的局部按压力的损害，天线和元件相互重叠的部分的不均匀性降低的高度可靠的半导体装置。半导体器件包括芯片和天线。该芯片包括：包括薄膜晶体管的半导体元件层; 电连接到半导体元件层的导电树脂; 和密封层。纤维体浸渍有机树脂的密封层覆盖半导体元件层和导电性树脂，其厚度为10〜100μm。天线具有凹部，并且通过导电树脂与半导体元件层电连接。芯片嵌入凹陷部分内。芯片的厚度等于凹陷部分的深度。

69. 发明授权

US07670884B2 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device 有权
标题翻译：具有导电层的基板的制造方法和半导体装置的制造方法
公开(公告)号：US07670884B2
公开(公告)日：2010-03-02
申请号：US12268039
申请日：2008-11-10
申请人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
发明人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
IPC分类号： H01L21/00 , H01L21/24 , H01L21/20
CPC分类号： H01L27/12 , H01L23/48 , H01L23/5227 , H01L24/11 , H01L27/0629 , H01L27/1266 , H01L27/1292 , H01L27/13 , H01L28/10 , H01L29/78621 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/07811 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer; forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
摘要翻译：具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在无机绝缘层上形成具有所需形状的有机树脂层; 在无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

70. 发明授权

US07651932B2 Method for manufacturing antenna and method for manufacturing semiconductor device 有权
标题翻译：制造天线的方法及制造半导体器件的方法
公开(公告)号：US07651932B2
公开(公告)日：2010-01-26
申请号：US11433546
申请日：2006-05-15
申请人： Tomoyuki Aoki , Daiki Yamada
发明人： Tomoyuki Aoki , Daiki Yamada
IPC分类号： H01L21/20 , H01L21/36
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/6836 , H01L21/76826 , H01L21/76856 , H01L23/5227 , H01L24/83 , H01L27/1285 , H01L27/1292 , H01L27/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/6835 , H01L2221/68363 , H01L2223/6677 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01012 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01Q1/2225 , H05K1/095 , H05K3/02 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.
摘要翻译：本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。含有导电颗粒的流体被施加在物体上。在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

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