专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US4909891A Laminator 失效
标题翻译：层压机
公开(公告)号：US4909891A
公开(公告)日：1990-03-20
申请号：US116819
申请日：1987-11-05
申请人： Sigeo Sumi , Fumio Hamamura , Noriyasu Sawada , Ichio Fukuda
发明人： Sigeo Sumi , Fumio Hamamura , Noriyasu Sawada , Ichio Fukuda
IPC分类号： B29C31/00 , B32B37/22 , H05K3/00
CPC分类号： B32B37/226 , B32B38/185 , B32B38/1858 , B29C2791/006 , B29C31/00 , B29L2031/3425 , H05K3/0079 , Y10T156/17 , Y10T156/1712
摘要： A laminator for bonding a film onto a substrate is disclosed which comprises a film supply plate for supplying the film along a supply path, a film temporary bonding body and a film temporary bonding edge member for temporarily bonding the film in pressing contact with the substrate. The film temporary bonding edge member is detachably provided on the film temporary bonding body. A first heat insulator is interposed between the film temporary bonding body and the film temporary bonding edge member. The temporary bonding body is detachably provided at a leading end of the film supply path of the film supply plate. A second insulator is interposed between the film supply plate and the film temporary bonding body.
摘要翻译：公开了一种用于将膜结合到基板上的层压机，其包括用于沿着供给路径供应薄膜的薄膜供应板，薄膜临时粘合体和用于临时粘合与基板压接的薄膜临时粘合边缘部件。胶片临时粘合边缘部件可拆卸地设置在胶片临时粘合体上。在薄膜临时粘合体和胶片临时粘合边缘部件之间插入第一绝热体。临时粘合体可拆卸地设置在胶片供给板的胶片供给路径的前端。第二绝缘体插入在薄膜供应板和薄膜临时粘合体之间。

52. 发明授权

US4902363A Method using compressible temporary support for transfer layer 失效
标题翻译：使用可转移层的可压缩临时支撑的方法
公开(公告)号：US4902363A
公开(公告)日：1990-02-20
申请号：US176438
申请日：1988-02-25
申请人： William E. Delaney , Helmut H. Frohlich
发明人： William E. Delaney , Helmut H. Frohlich
IPC分类号： B44C1/165 , G03C1/805 , G03F3/10 , G03F7/004 , G03F7/09 , H05K3/00
CPC分类号： G03F3/10 , G03C1/805 , G03F7/09 , H05K3/0079 , Y10T428/249976 , Y10T428/249988 , Y10T428/249989 , Y10T428/249992
摘要： The invention relates to transfer layer sheets comprising a transfer layer on a compressible temporary support, and processes for their use.

53. 发明授权

US4834821A Process for preparing polymeric materials for application to printed circuits 失效
标题翻译：制备用于印刷电路的聚合物材料的方法
公开(公告)号：US4834821A
公开(公告)日：1989-05-30
申请号：US141815
申请日：1988-01-11
申请人： William A. Maligie
发明人： William A. Maligie
IPC分类号： B23K35/22 , B32B37/00 , B32B37/30 , H05K1/11 , H05K3/00 , H05K3/24 , H05K3/28
CPC分类号： B32B37/0076 , B23K35/224 , B32B37/26 , H05K3/0079 , H05K3/281 , H05K1/117 , H05K2203/0108 , H05K2203/0537 , H05K2203/066 , H05K2203/0723 , H05K2203/1545 , H05K3/0097 , H05K3/243 , Y10T156/108 , Y10T428/2486
摘要： A process for preparing curable, aqueous strippable, polymeric materials for application, in succession, as masks, to a specific area of each of a plurality of printed circuit boards that is to be protected from the stripping and plating processes associated with gold finger plating, during the fabrication thereof, includes forming a coating of substantially identical, uniformly spaced, areas of polymeric material on a continuous length of carrier web, applying a cover coating over the carrier web and the uniformly spaced areas of polymeric material with the cover coating having a width substantially the same as that of the carrier film, and winding up in a roll the continuous length of carrier web and the cover coating with the uniformly spaced polymeric material sandwiched therebetween.

54. 发明授权

US4763157A Transfer roller 失效
标题翻译：转印辊
公开(公告)号：US4763157A
公开(公告)日：1988-08-09
申请号：US091617
申请日：1987-08-31
申请人： David P. Bujese
发明人： David P. Bujese
IPC分类号： G03G15/16 , H05K3/00 , H05K3/06
CPC分类号： G03G15/1625 , G03G15/163 , H05K3/0079 , H05K3/065
摘要： Apparatus for the electrostatic transfer of a developed latent image from a master to a conductive receiving surface is provided and utilizes a transfer roller that traverses the carrier web to bring the master that is attached to the web adjacent to, but not in contact with, the conductive receiving surface.
摘要翻译：提供了用于将显影的潜像从母版静电转印到导电接收表面的装置，并且使用穿过载体网的转印辊，以使附接到幅材的母版与所述幅材相邻但不与其接触导电接收面。

55. 发明授权

US4759809A Method for forming alignment holes in a film to be laminated to a substrate having positioning holes 失效
标题翻译：在层叠到具有定位孔的基板上的膜中形成取向孔的方法
公开(公告)号：US4759809A
公开(公告)日：1988-07-26
申请号：US27230
申请日：1987-02-06
申请人： Takao Matsuo , Norihasu Sawada
发明人： Takao Matsuo , Norihasu Sawada
IPC分类号： B26D7/18 , B26F1/02 , B26F1/14 , B32B37/22 , B32B38/04 , H05K3/00 , B26D5/30
CPC分类号： B32B38/04 , B26D7/18 , B26F1/02 , B26F1/14 , B32B37/226 , H05K3/0079 , B26F2210/08 , B29C2793/0045 , B29C2793/0081 , B29L2031/3425 , H05K2203/063 , H05K2203/068 , H05K2203/1509 , H05K3/0032 , H05K3/005 , Y10T156/1056 , Y10T156/1062 , Y10T156/1304 , Y10T156/1744 , Y10T83/0481 , Y10T83/162 , Y10T83/446 , Y10T83/531 , Y10T83/538
摘要： In a laminating apparatus wherein a predetermined length of a film is laminated onto a substrate having positioning holes, a method for forming alignment or indexing holes in a film which corresponds with the positioning holes in the substrate includes detecting the position of the positioning holes, establishing the location on the film where the alignment holes are to be formed, and punching the holes in the film.
摘要翻译：在将预定长度的膜层压到具有定位孔的基板上的层压装置中，在与基板中的定位孔对应的膜中形成取向或分度孔的方法包括检测定位孔的位置，建立要在其上形成对准孔的胶片上的位置，以及冲压胶片中的孔。

56. 发明授权

US4743325A Method of sticking film sheet on panel surface 失效
公开(公告)号：US4743325A
公开(公告)日：1988-05-10
申请号：US908233
申请日：1986-09-17
申请人： Eiichi Miyake
发明人： Eiichi Miyake
IPC分类号： B29C63/02 , B32B37/22 , H05K3/00 , B32B31/18 , B32B31/20
CPC分类号： B32B37/226 , B29C63/02 , B32B38/185 , B32B2457/08 , H05K3/0079 , Y10T156/1052 , Y10T156/12 , Y10T156/1339 , Y10T156/1343 , Y10T156/1734 , Y10T156/1741 , Y10T83/0605
摘要： A method of sticking film sheet on a panel surface is disclosed in which a continuous web of film is cut to proper length fitted to the size of the panel to make an individual film sheet during continuous sticking operation for producing a film laminated panel. The sticking operation is not interrupted by the cutting operation.A laminator constructed to achieve this film laminated panel manufacture includes block members which are movable toward and away from the tacking station where the leading end of the continuous web of film is tacked to the forward end of the panel, and a cutter mounted on the block members. The cutter severs across the film web as the block members moves toward the tacking station in the same direction and at the same speed as the film web during sticking operation.

57. 发明授权

US4732829A Polymer printing 失效
标题翻译：聚合物印刷
公开(公告)号：US4732829A
公开(公告)日：1988-03-22
申请号：US672500
申请日：1984-11-19
申请人： Donald Sullivan
发明人： Donald Sullivan
IPC分类号： B23K35/22 , G03F7/16 , H05K3/00 , H05K3/12 , H05K3/28 , G03C3/00
CPC分类号： B23K35/224 , G03F7/16 , H05K3/281 , H05K2203/056 , H05K2203/0577 , H05K2203/066 , H05K2203/0759 , H05K3/0079 , H05K3/1216 , Y10S430/136
摘要： Improved printing with polymers is achieved by interposing a liquid layer conforming to rough substrate surfaces and possibly exhibiting different characteristics from an outer surface polymer layer. This is particularly advantageous in printed wiring board (PWB) manufacture requiring solder mask coating. Thus, a two layer composite polymer coating is provided. One inner adhesive photopolymer layer is applied to the PWB in the liquid state, displacing air from PWB surface. The outer layer of the composite therefore can be epoxy, dry film or liquid polymer. Dry film thus carried on a thin plastic sheet may be overlaminated onto a liquid inner layer already on the substrate, without the need for a vacuum laminator to eliminate bubbles or a plasticizing heat step to conform the dry film to the surface. The dry film solder mask so laminated is then exposed through a phototransparency to harden the light struck dry film solder mask and light struck inner layer photopolymer, thereby cojoining the dry film solder mask, inner layer and PWB surface. A solvent washout step removes unexposed dry film solder mask and unexposed inner layer photopolymer. This provides a faster process, requires less equipment, and improves adhesion to metal conductors. This embodiment gives a high resolution product with good solder mask qualities. The outer layer need not be photoimaged. Thus, pre-patterned epoxy solder masks may be printed on the carrier sheet, partially hardened and overlaminated in registor onto liquid photopolymer-coated PWB, then exposed to light source through a phototransparency and through the pre-patterned solder mask, thereby permanently adhering the outer layer to PWB. The composite coating can be a combination of known solder mask materials, dry film, UV-curable liquid polymers and thermal-curing epoxy, chosen for desired characteristics including electrical performance, printing resolution and cost.
摘要翻译：用聚合物改进的印刷通过插入符合粗糙的基材表面的液体层并且可能表现出与外表面聚合物层不同的特性来实现。这在需要焊接掩模涂层的印刷电路板（PWB）制造中是特别有利的。因此，提供了两层复合聚合物涂层。一个内部粘合剂光聚合物层以液态施加到PWB，从PWB表面排出空气。因此，复合材料的外层可以是环氧树脂，干膜或液体聚合物。因此携带在薄塑料片上的干膜可以被覆盖在已经在基材上的液体内层上，而不需要真空层压机以消除气泡或塑化加热步骤以使干膜符合表面。然后将如此层压的干膜焊接掩模通过光透明物曝光以硬化受光的干膜焊接掩模和轻质内层光聚合物，从而将干膜焊接掩模，内层和PWB表面相互连接。溶剂洗涤步骤除去未曝光的干膜焊接掩模和未曝光的内层光聚合物。这提供了更快的过程，需要更少的设备，并且改善对金属导体的粘合性。本实施例给出了具有良好焊接掩模质量的高分辨率产品。外层不需要光刻。因此，预先图案化的环氧焊料掩模可以印刷在载体片上，部分硬化并在转移器中叠层在液体光聚合物涂布的PWB上，然后通过光透明性和通过预图案化的焊接掩模暴露于光源，从而永久粘附外层到PWB。复合涂层可以是已知的焊接掩模材料，干膜，UV可固化液体聚合物和热固化环氧树脂的组合，其被选择用于期望的特性，包括电性能，印刷分辨率和成本。

58. 发明授权

US4680079A Printed circuit board laminating apparatus 失效
标题翻译：印刷电路板层压装置
公开(公告)号：US4680079A
公开(公告)日：1987-07-14
申请号：US711635
申请日：1985-03-14
申请人： Shoji Tanaka
发明人： Shoji Tanaka
IPC分类号： B26D5/28 , B26D5/32 , B26D7/06 , B29C31/00 , B32B37/22 , B32B38/04 , G03F7/16 , H05K3/00 , H05K3/28 , B32B31/00
CPC分类号： B32B38/04 , B26D5/28 , B26D5/32 , B26D7/0675 , B32B37/226 , B32B38/0004 , B32B38/185 , G03F7/161 , B26F2210/08 , B29C31/00 , B29L2031/3425 , B32B2309/68 , H05K3/0079 , H05K3/281 , Y10T156/1343 , Y10T156/1734 , Y10T156/1741
摘要： A printed circuit board laminator adapted for laminating a film on the surfaces of the baseboards of printed circuit boards. The laminator comprises a laminating mechanism which can continuously laminate a long film on the continuously fed baseboards. The laminator comprises a constant-gap baseboard feed mechanism, which can arrange the baseboards with a constant gap therebetween, and continuously feed them to the laminating mechanism. The laminator further comprises an access hole-making unit which can make access holes in the film to be aligned with indexing holes in the baseboards, prior to the lamination. The laminator also comprises a cutting mechanism which can cut the film laminated to the boards for separating the latter from each other.
摘要翻译：一种印刷电路板层压机，适用于在印刷电路板的基板的表面上层压薄膜。层压机包括层压机构，其可以连续地层压连续供给的底板上的长膜。层压机包括一个恒定的间隙基板进给机构，它可以在其间具有恒定的间隙布置基板，并将它们连续地供给到层压机构。层压机还包括进入孔制造单元，其可以在层压之前使得膜中的进入孔与底板中的分度孔对齐。层压机还包括切割机构，该切割机构可以将层压到所述板上的薄膜切割成彼此分离的薄膜。

59. 发明授权

US4652513A Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method 失效
标题翻译：用于在硬质光滑衬底中形成浮雕设计的方法和用于该方法的设备
公开(公告)号：US4652513A
公开(公告)日：1987-03-24
申请号：US777243
申请日：1985-09-18
申请人： William F. Pentak , Dewey L. Burkes
发明人： William F. Pentak , Dewey L. Burkes
IPC分类号： G03C1/74 , G03F7/00 , G03F7/12 , G03F7/16 , G03F7/20 , G03F7/34 , H05K3/00 , G03C5/00
CPC分类号： G03F7/161 , G03F7/00 , G03F7/12 , G03F7/343 , H05K3/0079 , H05K3/0082
摘要： A method is provided for acid etching or sandblasting decorative designs in the smooth surface of hard substrates such as glass, ceramics, plastics, and marble, granite, or other stones. A dry film photoresist, preferably a solder mask, is applied to the smooth surface without the addition of heat. The decorative design is placed on the dry film by exposing the dry film to ultraviolet light through a negative of the design to place the design on the surface of the photoresist. The dry film is then developed to remove a portion of it. The smooth surface is then acid etched or sandblasted, with the portion of the dry film remaining on the smooth surface protecting that portion of the smooth surface from the acid etching or sandblasting process. An apparatus is also provided for applying the dry film photoresist to the substrate.
摘要翻译：提供了在诸如玻璃，陶瓷，塑料和大理石，花岗岩或其它石头的硬质基材的光滑表面中的酸蚀刻或喷砂装饰设计的方法。将干膜光致抗蚀剂，优选焊接掩模施加到光滑表面而不加热。通过将干膜通过设计的负片暴露于紫外光以将设计放置在光致抗蚀剂的表面上，将装饰设计放置在干膜上。然后将干膜显影以除去其中的一部分。然后将光滑表面酸蚀或喷砂，其中干膜的一部分保留在光滑表面上，保护该部分光滑表面免受酸蚀或喷砂处理。还提供了一种用于将干膜光致抗蚀剂施加到基底上的装置。

60. 发明授权

US4621019A Non-photosensitive transfer resist 失效
标题翻译：非光敏转印抗蚀剂
公开(公告)号：US4621019A
公开(公告)日：1986-11-04
申请号：US702827
申请日：1985-02-19
申请人： John P. Vikesland
发明人： John P. Vikesland
IPC分类号： G03C1/00 , G03F7/09 , G03F7/11 , H05K3/00 , B32B9/00 , C09J7/02
CPC分类号： H05K3/0079 , H05K2203/0537 , H05K2203/0769 , H05K2203/0786 , Y10S428/901 , Y10T428/24843 , Y10T428/2813 , Y10T428/2817 , Y10T428/2848
摘要： A non-photosensitive transfer resist sheet material comprises in sequence(a) a carrier support(b) a release layer(c) a flexible, water-insoluble, aqueous-alkaline-soluble, non-photosensitive resist layer comprising a thermoplastic organic polymer,wherein said resist is able to adhere to a surface against which it is pressed at a temperature above 60.degree. C. The resist is useful as a protective layer in etching and coating processes in electronic circuitry technology.
摘要翻译：非感光转印抗蚀剂片材料依次包括载体载体（b），释放层（c）柔性的水不溶性水溶性碱溶性非光敏抗蚀剂层，其包含热塑性有机聚合物，其中所述抗蚀剂能够在高于60℃的温度下粘附到其被压制的表面上。抗蚀剂可用作电子电路技术中的蚀刻和涂覆工艺中的保护层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式