专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20050241951A1 Selective catalytic activation of non-conductive substrates 审中-公开
标题翻译：非导电衬底的选择性催化活化
公开(公告)号：US20050241951A1
公开(公告)日：2005-11-03
申请号：US11049828
申请日：2005-02-03
申请人： Kenneth Crouse
发明人： Kenneth Crouse
IPC分类号： C23C18/16 , C23C18/28 , C23C18/30 , C25D5/02 , C25D5/56 , H05K3/18
CPC分类号： C23C18/208 , C23C18/1608 , C23C18/1653 , C23C18/30 , C23C18/31 , C25D5/56 , H01Q1/2225 , H01Q7/00 , H05K3/182 , H05K2203/0709 , H05K2203/1157
摘要： A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles, for creating circuitry for smart cards, such as phone cards, and for providing electromagnetic shielding of electronic devices is provided. The method comprises the steps of catalyzing the non-conductive substrate by applying a catalytic ink, reducing a source of catalytic metal ions in the catalytic ink to its associated metal, depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; and plating electrolytic metal on the electroless metal layer to produce the desired pattern of metal on the non-conductive substrate. The catalytic ink typically comprises one or more solvents, a source of catalytic metal ions, a crosslinking agent, one or more copolymers, a polyurethane polymer, and, optionally, one or more fillers.
摘要翻译：提供了一种在非导电衬底上提供金属图案以产生用于无线物品的环形天线，用于创建诸如电话卡的智能卡的电路以及用于提供电子设备的电磁屏蔽的过程。该方法包括以下步骤：通过施加催化油墨催化非导电性基材，将催化油墨中的催化金属离子源还原成其相关金属，将无电金属沉积在基板表面上的催化油墨图案上; 并且在化学金属层上电镀电解金属，以在非导电基底上产生所需的金属图案。催化油墨通常包含一种或多种溶剂，催化金属离子源，交联剂，一种或多种共聚物，聚氨酯聚合物和任选的一种或多种填料。

52. 发明申请

US20050120550A1 Method for forming metal wires by microdispensing pattern 有权
标题翻译：通过微分散图案形成金属丝的方法
公开(公告)号：US20050120550A1
公开(公告)日：2005-06-09
申请号：US10864331
申请日：2004-06-10
申请人： Kevin Cheng , Ming-Huan Yang , Wan-Wen Chiu , Jane Chang
发明人： Kevin Cheng , Ming-Huan Yang , Wan-Wen Chiu , Jane Chang
IPC分类号： C23C18/16 , C23C18/18 , C23C18/30 , H01L29/10 , H05K3/18
CPC分类号： C23C18/30 , B82Y30/00 , C23C18/1608 , C23C18/1806 , C23C18/1855 , C23C18/1893 , C23C18/2006 , C23C18/204 , C23C18/2086 , H05K3/182 , H05K2203/013 , H05K2203/0709 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： A method for forming metal wires by microdispensing a pattern is disclosed. The method includes the steps of microdispensing a catalyst pattern on the substrate and forming metal wires by electroless plating. Before the step of microdispensing catalyst pattern, the surface properties of the substrate have been improved by a surface modification treatment.
摘要翻译：公开了一种通过微分散图案形成金属线的方法。该方法包括以下步骤：将基底上的催化剂图案微分散，并通过无电镀形成金属丝。在微分散催化剂图案的步骤之前，通过表面改性处理改善了基材的表面性质。

53. 发明申请

US20040264139A1 Process for manufacturing a cover 审中-公开
标题翻译：盖子制造工艺
公开(公告)号：US20040264139A1
公开(公告)日：2004-12-30
申请号：US10603913
申请日：2003-06-24
申请人： NOKIA CORPORATION
发明人： Kenichi Hashizume , Takaharu Fujii
IPC分类号： H05K007/20
CPC分类号： H05K1/119 , H01R9/226 , H01R13/50 , H01R43/24 , H05K1/0284 , H05K3/0014 , H05K3/182 , H05K2201/09118 , H05K2201/0999 , H05K2203/0709
摘要： A process of manufacturing a cover for an electronic device, the process comprising forming the cover for the device, incorporating electrical circuitry into the cover during the formation, and providing on the cover an integral connector structure for connecting the electrical circuitry to an electronic component.
摘要翻译：一种制造用于电子设备的盖的方法，该方法包括形成用于该装置的盖，在形成期间将电路并入盖中，以及在盖上提供用于将电路连接到电子部件的整体连接器结构。

54. 发明申请

US20040091818A1 High resolution 3-D circuit formation using selective or continuous catalytic painting 审中-公开
标题翻译：使用选择性或连续催化涂漆的高分辨率3-D电路形成
公开(公告)号：US20040091818A1
公开(公告)日：2004-05-13
申请号：US10292562
申请日：2002-11-12
发明人： Russell Winstead , Charles Rudisill
IPC分类号： G03F007/26 , G03F007/36
CPC分类号： H05K3/182 , H01Q1/38 , H05K1/0284 , H05K3/108 , H05K2203/0709 , H05K2203/1476
摘要： A method of forming an electrical feature such as a 3-D circuit on a substrate is described. The method includes the following steps. A catalytic paint is first selectively deposited on the surface of a molded polymer substrate to form a paint coating of the substrate. A conductive metal such as copper or nickel is then deposited onto the coating to form a plating of the substrate. An electrical feature is then obtained by forming a precision conductive pattern in the conductive metal.
摘要翻译：描述了在基板上形成诸如3-D电路的电气特征的方法。该方法包括以下步骤。首先将催化漆选择性地沉积在模制的聚合物基材的表面上以形成基材的涂料涂料。然后将诸如铜或镍的导电金属沉积到涂层上以形成基底的镀层。然后通过在导电金属中形成精密导电图案来获得电特征。

55. 发明申请

US20040018131A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates 失效
标题翻译：聚酰亚胺树脂前体溶液，通过使用该溶液制备的电子部件的层压体和制造层压体的方法
公开(公告)号：US20040018131A1
公开(公告)日：2004-01-29
申请号：US10450048
申请日：2003-06-10
发明人： Shinya Izumida , Koji Itoh , Minoru Oyama , Atsushi Suuki
IPC分类号： C22B011/00 , C01G055/00
CPC分类号： H05K3/387 , C08K5/0025 , C08K5/0091 , C09D179/08 , C23C18/1608 , C23C18/1612 , C23C18/2033 , C23C18/30 , H05K1/0346 , H05K3/181 , H05K3/185 , H05K3/386 , H05K2201/0154 , H05K2201/0236 , H05K2203/0709 , C08L79/04 , C08L79/08
摘要： Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.
摘要翻译：电子部件用层叠体通过在聚酰亚胺基板上涂布含有钯化合物的聚酰亚胺树脂前体溶液进行干燥而形成聚酰亚胺树脂前体层，在氢供体存在下照射紫外线，形成核用于底漆电镀，通过无电解电镀形成金属底漆层，并且在形成表面镀层之后或之后通过加热将聚酰亚胺树脂前体层转化成聚酰亚胺树脂层。本发明提供了电子部件的层叠体，其极大地改善了与金属层的粘附性，而不损害基板固有的特性，绝缘性能优异，并且用于制造层压体的聚酰亚胺树脂前体树脂溶液。

56. 发明授权

US3697319A Method of metallizing an electrically insulating surface 失效
标题翻译：电化学绝缘表面金属化方法
公开(公告)号：US3697319A
公开(公告)日：1972-10-10
申请号：US3697319D
申请日：1970-12-09
申请人： RCA CORP
发明人： FELDSTEIN NATHAN
IPC分类号： H01L49/02 , H05K3/18 , H05K3/38 , B41M3/08 , B44D1/14
CPC分类号： H05K3/387 , H01L49/02 , H05K3/181 , H05K2201/0116 , H05K2203/0709 , H05K2203/1105 , H05K2203/121 , H05K2203/125
摘要： A LAYER OF A RESINOUS ADHESIVE HAVING A METAL FORMATE SALT DISPERSED THERIN IS APPLIED TO THE INSULATING SURFACE. THE LAYER IS THEN HEATED TO DECOMPOSE THE METAL FORMATE SALT AND TO PRODUCE DECOMPOSITION PRODUCTS OF THE METAL OF THE SALT AND GASES, WHICH FORM MICROPORES IN THE LAYER AT THE SURFACE. THE SURFACE OF THE LAYER IS THEN ELECTROLESSLY PLATED WITH A METAL FOR WHICH THE METAL OF THE FORMATE SALT IS A CATALYST.

57. 发明授权

US10076032B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US10076032B2
公开(公告)日：2018-09-11
申请号：US15127165
申请日：2015-03-19
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takashi Kasuga , Yoshio Oka , Shigeyoshi Nakayama , Jinjoo Park , Sumito Uehara , Kousuke Miura , Hiroshi Ueda
IPC分类号： H05K1/05 , H05K1/09 , H05K3/02 , H05K3/10 , H05K3/38
CPC分类号： H05K1/092 , H05K1/05 , H05K3/022 , H05K3/108 , H05K3/38 , H05K3/384 , H05K2201/0154 , H05K2201/0257 , H05K2203/0709 , H05K2203/072
摘要： A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

58. 发明授权

US09706667B2 Via in a printed circuit board 有权
公开(公告)号：US09706667B2
公开(公告)日：2017-07-11
申请号：US15001140
申请日：2016-01-19
申请人： SIERRA CIRCUITS, INC.
发明人： Konstantine Karavakis , Kenneth S. Bahl
IPC分类号： H05K1/09 , H05K3/38 , H05K3/42
CPC分类号： H05K3/387 , H05K3/427 , H05K2201/0221 , H05K2201/0236 , H05K2203/0709 , Y10T29/49167
摘要： A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

59. 发明授权

US09511582B2 Ink formulations for flexographic printing of high-resolution conducting patterns 有权
标题翻译：用于柔性版印刷高分辨率导电图案的油墨配方
公开(公告)号：US09511582B2
公开(公告)日：2016-12-06
申请号：US14418184
申请日：2013-03-12
申请人： Eastman Kodak Company
发明人： Danliang Jin , Ed S. Ramakrishnan
IPC分类号： B41F5/24 , H05K3/18 , C09D11/101 , C09D11/52 , C23C18/16 , C23C18/20 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , C23C18/52
CPC分类号： B41F5/24 , C09D11/101 , C09D11/52 , C23C18/1608 , C23C18/204 , C23C18/206 , C23C18/2066 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , C23C18/52 , G06F2203/04103 , H05K3/182 , H05K2203/0709 , H05K2203/1545 , H05K2203/1572
摘要： Systems and methods disclosed herein are directed towards flexographic printing of microscopic high resolution conductive patterns (HRCP). These HRCP may be printed using one or more formulations for high polarity and stable viscosity inks for use in the flexographic printing process. The inks may be water permeable, UV curable, and configured to resist loss of integrity when exposed to water and atmospheric moisture.
摘要翻译：本文公开的系统和方法针对微观高分辨率导电图案（HRCP）的柔性版印刷。这些HRCP可以使用一种或多种用于柔性版印刷工艺的高极性和稳定粘度油墨的配方印刷。油墨可以是透水的，UV可固化的，并且被配置为当暴露于水和大气湿气时抵抗完整性的损失。

60. 发明申请

US20160353578A1 Printing Method for Fabrication of Printed Electronics 审中-公开
标题翻译：印刷电子印制方法
公开(公告)号：US20160353578A1
公开(公告)日：2016-12-01
申请号：US14552479
申请日：2014-11-24
申请人： Jun Yang
发明人： Jun Yang , Xiaolong Wang , Tengyuan Zhang , Qiuquan Guo
IPC分类号： H05K3/12 , H05K3/18
CPC分类号： H05K3/125 , H05K3/181 , H05K3/182 , H05K3/22 , H05K3/381 , H05K2201/2009 , H05K2203/0126 , H05K2203/013 , H05K2203/0709 , H05K2203/107 , H05K2203/1131 , H05K2203/1157 , H05K2203/1163 , H05K2203/1168 , H05K2203/125 , H05K2203/1355
摘要： This invention relates to fabrication of high quality printed electronics, particularly without the use of conductive inks, on various substrates by printing catalyst based inks followed by electroless deposition of metals. A method comprising substrate surface modification, preparing catalyst based inks, electroless deposition of a thick layer of metal and post-printing treatment is disclosed.
摘要翻译：本发明涉及通过印刷催化剂基油墨然后进行无电沉积金属，在各种基材上制造高质量印刷电子产品，特别是不使用导电油墨。公开了一种包括基材表面改性，制备催化剂基油墨，金属沉积金属和印后处理的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式