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51. 发明申请

US20160066419A1 Electronic Devices With Carbon Nanotube Printed Circuits 有权
标题翻译：具有碳纳米管印刷电路的电子设备
公开(公告)号：US20160066419A1
公开(公告)日：2016-03-03
申请号：US14472223
申请日：2014-08-28
申请人： Apple Inc.
发明人： Ibuki Kamei , Timothy J. Rasmussen , Trent K. Do
IPC分类号： H05K1/03 , H05K3/40 , H05K1/11
CPC分类号： H05K1/0393 , H05K1/028 , H05K1/097 , H05K1/111 , H05K1/118 , H05K3/041 , H05K3/28 , H05K3/361 , H05K3/4007 , H05K2201/026 , H05K2201/05 , H05K2203/0759
摘要： An electronic device has structures such as substrates and internal housing structures. The substrates may be rigid substrates such as rigid printed circuit boards and flexible substrates such as flexible printed circuits, flexible touch sensor substrates, and flexible display substrates. Carbon nanotubes may be patterned to form carbon nanotube signal paths on the substrates. The signal paths may resist cracking when bent. A flexible structure such as a flexible printed circuit may have carbon nanotube signal paths interposed between polymer layers. Openings in a polymer layer may expose metal solder pads on the carbon nanotube signal paths. A stiffener may be provided under the metal solder pads. Polymer materials in the flexible structure may be molded to form bends. Bends may be formed along edges of a touch sensor or display or may be formed in a flexible printed circuit.
摘要翻译：电子设备具有诸如基板和内部壳体结构的结构。基板可以是刚性基板，例如刚性印刷电路板和柔性基板，例如柔性印刷电路，柔性触摸传感器基板和柔性显示基板。碳纳米管可以被图案化以在基底上形成碳纳米管信号路径。当弯曲时，信号路径可能会抗开裂。诸如柔性印刷电路的柔性结构可以具有夹在聚合物层之间的碳纳米管信号路径。聚合物层中的开口可能会暴露碳纳米管信号路径上的金属焊盘。可以在金属焊盘下设置加强件。柔性结构中的聚合物材料可以被模制以形成弯曲。弯曲部可以沿着触摸传感器或显示器的边缘形成，或者可以形成在柔性印刷电路中。

52. 发明申请

US20160011703A1 ELECTRODE MEMBER AND TOUCH WINDOW INCLUDING THE SAME 有权
标题翻译：电极会员和触摸窗口包括它们
公开(公告)号：US20160011703A1
公开(公告)日：2016-01-14
申请号：US14797118
申请日：2015-07-11
申请人： LG INNOTEK CO., LTD.
发明人： Dong Wook PARK , Myoung Soo AHN , Duck Hoon PARK
IPC分类号： G06F3/047 , G06F3/044
CPC分类号： G06F3/047 , G06F3/0412 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K1/097 , H05K2201/0145 , H05K2201/10128 , H05K2203/107
摘要： The electrode member according to the embodiment includes: a substrate; and an electrode part on the substrate, wherein the electrode part includes a sensing electrode and a wire electrode, at least one electrode of the sensing electrode and the wire electrode includes an opening part and the electrode part has a black color.
摘要翻译：根据实施例的电极构件包括：基板; 以及在所述基板上的电极部，所述电极部包括检测电极和线电极，所述检测电极和所述线电极的至少一个电极包括开口部，所述电极部具有黑色。

53. 发明授权

US09217890B2 Touch screen panel and method for manufacturing the same 有权
标题翻译：触摸屏面板及其制造方法
公开(公告)号：US09217890B2
公开(公告)日：2015-12-22
申请号：US14154979
申请日：2014-01-14
申请人： Samsung Display Co., Ltd.
发明人： Hee-Woong Park , Byeong-Kye Jeon
IPC分类号： G06F3/041 , G02F1/1333 , G06F3/044 , H05K1/09 , B82Y15/00 , H01L27/32 , H05K1/02 , H05K3/22 , H05K3/28 , H05K3/46
CPC分类号： G02F1/13338 , B82Y15/00 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , G06F2203/04112 , H01L27/323 , H05K1/0289 , H05K1/097 , H05K3/22 , H05K3/288 , H05K3/4685 , H05K2201/026 , H05K2201/0329 , H05K2201/0391 , H05K2201/10053 , H05K2201/10128 , H05K2203/173 , Y10T29/49016
摘要： In an aspect, a touch screen panel including a sensing region and a peripheral region, a plurality of first sensing patterns located in the sensing region, a plurality of second sensing patterns arranged in an intersected direction with the first sensing patterns connected to each other by a connection part, an insulating layer formed on the first sensing pattern, the second sensing pattern, and the connection part, and patterned to expose both side of the first sensing pattern, at least one bridge located to intersect with the connection part on the insulating layer; and a plurality of wires located on a peripheral region and connected to the first sensing pattern and the second sensing pattern are provided.
摘要翻译：一方面，一种包括感测区域和周边区域的触摸屏面板，位于感测区域中的多个第一感测图案，以与第一感测图案相交的方向布置的多个第二感测图案，第一感测图案通过连接部分，形成在第一感测图案上的绝缘层，第二感测图案和连接部分，并且被图案化以暴露第一感测图案的两侧，至少一个位于与绝缘体上的连接部分相交的桥层; 并且设置有位于周边区域并连接到第一感测图案和第二感测图案的多个电线。

54. 发明授权

US09217088B2 Particles and inks and films using them 有权
标题翻译：使用它们的颗粒和油墨和膜
公开(公告)号：US09217088B2
公开(公告)日：2015-12-22
申请号：US13168465
申请日：2011-06-24
申请人： Sachin Parashar , Siuli Sarkar , Oscar Khaselev , Brian G. Lewis , Michael T. Marczi , Bawa Singh , Nitin Desai , Michael Liberatore
发明人： Sachin Parashar , Siuli Sarkar , Oscar Khaselev , Brian G. Lewis , Michael T. Marczi , Bawa Singh , Nitin Desai , Michael Liberatore
IPC分类号： C09D11/03 , B22F1/00 , B22F9/24 , B82Y30/00 , C09D7/12 , C09D11/00 , C09D11/38 , C23C24/08 , C23C26/00 , H01B1/02 , H01L51/00 , H05K1/09 , C08K3/08 , C08K9/04
CPC分类号： C09D11/03 , B22F1/0018 , B22F1/0022 , B22F1/0062 , B22F9/24 , B82Y30/00 , C01P2002/84 , C01P2004/62 , C01P2004/64 , C08K3/08 , C08K9/04 , C09D7/62 , C09D7/67 , C09D11/00 , C09D11/38 , C23C24/08 , C23C26/00 , H01B1/02 , H01L51/0022 , H05K1/097 , H05K2201/0224 , Y10T428/2982 , Y10T428/2991
摘要： Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
摘要翻译：提供颗粒和颗粒膜。在某些实例中，由单相工艺生产的颗粒可用于提供用于诸如印刷线路板的装置的颗粒的工业规模合成。

55. 发明申请

US20150366074A1 Conductive Formulations For Use In Electrical, Electronic And RF Applications 审中-公开
标题翻译：导电配方用于电气，电子和射频应用
公开(公告)号：US20150366074A1
公开(公告)日：2015-12-17
申请号：US14675438
申请日：2015-03-31
申请人： University of Massachusetts Lowell
发明人： Ramaswamy Nagarajan , Sharavanan Balasubramanian , Julie Chen , Joey Mead
IPC分类号： H05K3/12 , H05K1/16 , H05K1/09
CPC分类号： H05K3/1216 , H05K1/092 , H05K1/097 , H05K1/162 , H05K1/165 , H05K3/105 , H05K3/1283 , H05K2201/0245 , H05K2201/10151 , H05K2203/121
摘要： Metal flakes, an organic metal precursor, an organic solvent and either no binder, or a volatile or a thermally decomposable binder are combined to form a paste. The paste is deposited in a circuit pattern on a substrate and the circuit pattern is cured. While curing, the organic metal precursor decomposes to leave an electrically conductive path, and the printed circuit is thus formed. A precursor to an electrically conductive circuit material includes an organic metal precursor, metal microparticles, and an organic solvent. The method can be employed to form printed circuits, for a variety of electrical, electronic and sensing application, such as crack detection in ceramic, plastics, concrete, wood, fabric, leather, rubber or paper and composite materials.
摘要翻译：金属薄片，有机金属前体，有机溶剂和不含粘合剂，或挥发性或热分解粘合剂组合形成糊状物。糊料以电路图案沉积在基底上，并且电路图案被固化。在固化的同时，有机金属前体分解留下导电路径，由此形成印刷电路。导电电路材料的前体包括有机金属前体，金属微粒和有机溶剂。该方法可以用于形成印刷电路，用于各种电气，电子和感测应用，例如陶瓷，塑料，混凝土，木材，织物，皮革，橡胶或纸和复合材料中的裂纹检测。

56. 发明申请

US20150313009A1 THIN-FILM MULTI-LAYER MICRO-WIRE STRUCTURE 有权
标题翻译：薄膜多层微结构
公开(公告)号：US20150313009A1
公开(公告)日：2015-10-29
申请号：US14264499
申请日：2014-04-29
申请人： ROGER G. MARKHAM , Ronald Steven Cok , Yongcai Wang , Mitchell Lawrence Wright
发明人： ROGER G. MARKHAM , Ronald Steven Cok , Yongcai Wang , Mitchell Lawrence Wright
IPC分类号： H05K1/02 , H05K3/10 , H05K3/18 , H01B1/02
CPC分类号： H05K1/0298 , H01B1/02 , H05K1/0293 , H05K1/097 , H05K1/165 , H05K3/103 , H05K3/107 , H05K3/1258 , H05K3/181 , H05K3/246 , H05K3/247 , H05K2201/0317 , H05K2201/0338 , H05K2201/0341 , H05K2201/0344 , H05K2201/0347 , H05K2201/035 , H05K2201/09036 , H05K2201/10098 , H05K2203/1476 , H05K2203/173
摘要： A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
摘要翻译：薄膜多层微线结构包括衬底和位于衬底上或形成衬底的一部分的层。一个或多个微通道位于该层中。每个微通道具有小于或等于20微米的宽度。固化的导电微线仅位于每个微通道内。微线具有小于或等于20微米的厚度，包括银纳米颗粒，并且银的百分比大于或等于40重量％。无电镀层至少部分地位于微线和层表面之间的每个微通道内并与微线电接触。电镀层的厚度小于微线的厚度，使得微线和镀层形成薄膜多层微线。

57. 发明申请

US20150313008A1 MULTI-LAYER MICRO-WIRE STRUCTURE 有权
标题翻译：多层微结构
公开(公告)号：US20150313008A1
公开(公告)日：2015-10-29
申请号：US14261465
申请日：2014-04-25
申请人： Todd Mathew Spath , Ronald Steven Cok
发明人： Todd Mathew Spath , Ronald Steven Cok
IPC分类号： H05K1/02 , G06F3/044 , H05K1/09 , G06F3/041
CPC分类号： H05K1/097 , G06F3/047 , G06F2203/04103 , G06F2203/04112 , H05K1/189 , H05K3/1258 , H05K3/247 , H05K2201/0108 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0376 , H05K2201/09036 , H05K2203/0108 , H05K2203/1545
摘要： A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking
摘要翻译：一种耐裂纹的多层微线结构，包括具有表面的基底，在基底中形成的一个或多个微通道，形成位于每个微通道中的第一层的导电第一材料组合物，以及导电第二材料组合物具有比形成位于每个微通道中的第二层的第一材料组合物更大的拉伸延展性，第一材料组合物和第二材料组合物电接触以在每个微通道中形成导电多层微线通道，由此多层微线耐开裂

58. 发明申请

US20150305166A1 LASER PATTERNING OF DUAL SIDED TRANSPARENT CONDUCTIVE FILMS 审中-公开
标题翻译：双面透明导电膜的激光图案
公开(公告)号：US20150305166A1
公开(公告)日：2015-10-22
申请号：US14667742
申请日：2015-03-25
申请人： Carestream Health, Inc.
发明人： Andrew T. Fried , Jeffrey P. Treptau , Michael G. Steward , Eric L. Granstrom , Robert J. Monson , Kiarash Vakhshouri
IPC分类号： H05K3/10 , B23K26/00 , H05K1/09
CPC分类号： H05K3/105 , B23K26/352 , B23K26/50 , B82Y40/00 , G06F3/045 , G06F2203/04103 , H01B1/22 , H01L29/413 , H05K1/097 , H05K2201/026
摘要： A method of patterning an unpatterned transparent conductive film, the unpatterned transparent conductive film comprising: a transparent substrate, a first conductive layer disposed on a first surface of the transparent substrate, and a second conductive layer disposed on a second surface of the transparent substrate, the first and second surfaces being disposed on two opposing sides of the unpatterned transparent conductive film, the first conductive layer comprising a first set of metal nanostructures, and the second conductive layer comprising a second set of metal nanostructures, the method comprising irradiating the first conductive layer with at least one first laser to form a patterned transparent conductive film, where the irradiation of the first conductive layer patterns the first conductive layer with a first pattern without also patterning the second conductive layer with the first pattern, and also where the unpatterned transparent conductive film and the patterned transparent conductive film both exhibit total visible light transmissions of at least about 90%.
摘要翻译：一种图案化未图案化的透明导电膜的方法，所述未图案化的透明导电膜包括：透明基板，设置在所述透明基板的第一表面上的第一导电层和设置在所述透明基板的第二表面上的第二导电层，所述第一和第二表面设置在所述未图案化的透明导电膜的两个相对侧上，所述第一导电层包括第一组金属纳米结构，所述第二导电层包括第二组金属纳米结构，所述方法包括：层，其具有至少一个第一激光器以形成图案化的透明导电膜，其中第一导电层的照射以第一图案图案化第一导电层，而不用第一图案图案化第二导电层，并且其中未图案的透明导电膜和图案化透明导电膜都表现出至少约90％的总可见光透射率。

59. 发明授权

US09167684B2 Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels 有权
标题翻译：使用流体储存器和连接的流体通道形成印刷电路板的装置和方法
公开(公告)号：US09167684B2
公开(公告)日：2015-10-20
申请号：US13902149
申请日：2013-05-24
申请人： Nokia Corporation
发明人： Mark Lee Allen , Chris Bower , Darryl Cotton
IPC分类号： H05K1/16 , H05K1/11 , H05K1/02 , H05K1/09 , H01L23/00 , H05K3/10
CPC分类号： H05K1/0272 , H01L23/52 , H01L24/00 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/83 , H01L24/92 , H01L2224/24101 , H01L2224/24226 , H01L2224/24997 , H01L2224/25171 , H01L2224/25175 , H01L2224/2919 , H01L2224/82101 , H01L2224/82138 , H01L2224/8284 , H01L2224/82862 , H01L2224/82874 , H01L2224/82877 , H01L2224/82986 , H01L2224/8385 , H01L2224/92144 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H05K1/092 , H05K1/097 , H05K3/101 , H05K3/107 , H05K2201/0257 , H05K2201/0302 , H05K2201/09036 , H05K2201/09227 , H05K2201/10674 , H05K2203/1469 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： A substrate including a fluid reservoir and a connected fluid channel, the fluid reservoir positioned away from a component region of the substrate, the fluid channel configured to extend from the fluid reservoir to guide an electrically conductive fluid from the fluid reservoir at a reservoir end of the fluid channel through the fluid channel to a component end of the fluid channel, the component end extending to the component region of the substrate to enable the formation of an electrical connection to a connector of an electronic component appropriately positioned in the component region, formation of the electrical connection allowing the electronic component to be interconnected to other electronic components using one or more of the fluid reservoir and fluid channel.
摘要翻译：包括流体储存器和连接的流体通道的基板，所述流体储存器远离所述基板的部件区域定位，所述流体通道被配置为从所述流体储存器延伸以在所述流体储存器的储存器端部处从所述流体储存器引导导电流体通过流体通道的流体通道流到流体通道的部件端，部件端部延伸到基板的部件区域，以使得能够形成与适当地定位在部件区域中的电子部件的连接器的电连接，形成的电连接，允许使用一个或多个流体储存器和流体通道将电子部件互连到其他电子部件。

60. 发明授权

US09137902B2 Process to form highly conductive feature from silver nanoparticles with reduced processing temperature 有权
标题翻译：具有降低加工温度的银纳米颗粒形成高导电特征的工艺
公开(公告)号：US09137902B2
公开(公告)日：2015-09-15
申请号：US12541644
申请日：2009-08-14
申请人： Yiliang Wu , Ping Liu , Nan-Xing Hu
发明人： Yiliang Wu , Ping Liu , Nan-Xing Hu
IPC分类号： B32B5/00 , H05K3/12 , C09D11/52 , C23C24/08 , C23C26/00 , H05K1/09
CPC分类号： H05K3/1283 , C09D11/52 , C23C24/08 , C23C26/00 , H05K1/097 , H05K2203/0789 , H05K2203/1131 , H05K2203/122 , Y10T428/265 , Y10T428/31504
摘要： Exemplary embodiments provide materials and methods for forming highly-conductive features including stabilized silver-containing nanoparticles at low processing temperatures of no more than about 140° C.
摘要翻译：示例性实施例提供用于形成高导电特征的材料和方法，包括在不超过约140℃的低加工温度下的稳定的含银纳米颗粒

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