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51. 发明申请

US20150279719A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE TRANSPORTING DEVICE, AND SEMICONDUCTOR MANUFACTURING APPARATUS 有权
标题翻译：基板保持机构，基板运输装置和半导体制造装置
公开(公告)号：US20150279719A1
公开(公告)日：2015-10-01
申请号：US14670749
申请日：2015-03-27
申请人： EBARA CORPORATION
发明人： Hiroaki NISHIDA
IPC分类号： H01L21/687 , B25J15/00 , B25J11/00
CPC分类号： H01L21/68707 , H01L21/68728
摘要： A substrate holding mechanism includes a substrate holding claw for holding the substrate. The substrate holding claw includes a slant face for sliding the substrate thereon. Height of the slant face is increased from the inside of a space for holding the substrate toward the outside of the space. A crossing angle formed by a direction in which a machining mark is formed on the slant face and a direction in which the substrate is slid is not less than 0 degree and not more than 45 degrees at least in a partial region of the slant face.
摘要翻译：基板保持机构包括用于保持基板的基板保持爪。基板保持爪包括用于在其上滑动基板的倾斜面。倾斜面的高度从用于保持基板朝向空间的外部的空间的内部增加。由倾斜面上形成加工标记的方向和基板滑动方向形成的交叉角度至少在倾斜面的部分区域中为0度以上且45度以下。

52. 发明申请

US20150243542A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理装置和基板处理方法
公开(公告)号：US20150243542A1
公开(公告)日：2015-08-27
申请号：US14632500
申请日：2015-02-26
申请人： SCREEN Holdings Co., Ltd.
发明人： Naohiko YOSHIHARA , Kenji KOBAYASHI , Manabu OKUTANI
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/68764 , B05C11/08 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H01L21/68728 , H01L21/68742
摘要： A substrate processing apparatus includes a substrate heating unit arranged to heat the underside of a substrate while supporting the substrate thereon and an attitude changing unit arranged to cause the substrate heating unit to undergo an attitude change between a horizontal attitude and a tilted attitude. In an organic solvent removing step to be performed following a substrate heating step of heating the substrate, the substrate heating unit undergoes an attitude change to the tilted attitude so that the upper surface of the substrate becomes tilted with respect to the horizontal surface.
摘要翻译：基板处理装置包括基板加热单元，其被布置成在支撑基板的同时加热基板的下侧，并且布置成使基板加热单元在水平姿态和倾斜姿态之间经历姿态变化的姿态改变单元。在加热基板的基板加热工序后进行的有机溶剂除去工序中，基板加热单元对倾斜姿态进行姿态改变，使得基板的上表面相对于水平面倾斜。

53. 发明授权

US09038262B2 Device for holding disk-shaped articles and method thereof 有权
标题翻译：用于保持盘形制品的装置及其方法
公开(公告)号：US09038262B2
公开(公告)日：2015-05-26
申请号：US13701939
申请日：2012-06-13
申请人： Yi Wu , Hao Wang , Wei Li , Ruiting Wang , Bao Zhang
发明人： Yi Wu , Hao Wang , Wei Li , Ruiting Wang , Bao Zhang
IPC分类号： H01L21/687 , B23Q7/00 , B23B31/103 , B23B31/24
CPC分类号： H01L21/68728 , B23B31/103 , B23B31/24 , Y10T29/49998 , Y10T279/12 , Y10T279/18
摘要： A device for holding disk-shaped articles and a method thereof are provided. The device comprises a rotatable chuck body and at least two groups of clamping elements arranged at the edge of the chuck body. Each of the clamping elements is mounted to a pivot with the chuck body respectively by means of the rotation of the clamping element with respect to the chuck body. A radial compression spring is connected between the bottom of the clamping element and the chuck body to provide a clamping force for the clamping element. The clamping elements in the same group are provided with magnets with the same polarity, while the clamping elements in different groups are provided with magnets with the opposite polarity. Two sets of electromagnets are arranged on the chuck body and spaced apart evenly.
摘要翻译：提供了一种用于保持盘状物品的装置及其方法。该装置包括可旋转卡盘主体和布置在卡盘主体的边缘处的至少两组夹紧元件。每个夹紧元件通过夹紧元件相对于卡盘主体的旋转分别安装到具有卡盘主体的枢轴上。径向压缩弹簧连接在夹紧元件的底部和卡盘体之间，以为夹紧元件提供夹紧力。同一组中的夹紧元件设置有具有相同极性的磁体，而不同组中的夹紧元件设置有相反极性的磁体。两组电磁铁布置在卡盘主体上并均匀间隔开。

54. 发明申请

US20150131073A1 ORIGINAL HOLDING APPARATUS, EXPOSURE APPARATUS, METHOD OF MANUFACTURING ARTICLE AND ORIGINAL HOLDING METHOD 有权
标题翻译：原装控制装置，曝光装置，制造方法和原始保存方法
公开(公告)号：US20150131073A1
公开(公告)日：2015-05-14
申请号：US14532601
申请日：2014-11-04
申请人： CANON KABUSHIKI KAISHA
发明人： Yuuhei MATSUMURA
IPC分类号： G03F7/20
CPC分类号： G03F7/707 , H01L21/687 , H01L21/68728
摘要： The present invention provides an original holding apparatus which holds an original, comprising a first holding unit configured to hold the original, a second holding unit configured to hold the original, a fixing unit configured to fix the second holding unit, and an adjustment unit configured to perform adjustment of an holding force of at least one of the first holding unit and the second holding unit, wherein the adjustment unit performs the adjustment such that the holding force of the second holding unit before fixing the second holding unit is smaller than the holding force of the first holding unit before fixing the second holding unit, and performs the adjustment such that the holding force of the second holding unit after fixing the second holding unit is larger than that before fixing the second holding unit.
摘要翻译：本发明提供了一种保持原稿的原始保持装置，包括：构造成保持原稿的第一保持单元，被配置为保持原稿的第二保持单元，被配置为固定第二保持单元的定影单元和配置成以进行所述第一保持单元和所述第二保持单元中的至少一个的保持力的调整，其中所述调整单元执行所述调整，使得所述第二保持单元在固定所述第二保持单元之前的保持力小于所述保持在固定第二保持单元之前第一保持单元的力，并且进行调整，使得第二保持单元在固定第二保持单元之后的保持力大于固定第二保持单元之前的保持力。

55. 发明授权

US08941968B2 Heated electrostatic chuck including mechanical clamp capability at high temperature 有权
标题翻译：加热静电卡盘包括高温下的机械夹紧能力
公开(公告)号：US08941968B2
公开(公告)日：2015-01-27
申请号：US13152735
申请日：2011-06-03
申请人： Perry J. I. Justesen , Allan D. Weed , William Davis Lee , Ashwin M. Purohit , Robert D. Rathmell , Gary M. Cook
发明人： Perry J. I. Justesen , Allan D. Weed , William Davis Lee , Ashwin M. Purohit , Robert D. Rathmell , Gary M. Cook
IPC分类号： H01L21/687 , H01L21/683
CPC分类号： H01L21/68728 , H01L21/6831
摘要： An electrostatic clamp is provided, having a clamping plate, wherein a clamping surface of the clamping plate is configured to contact the workpiece. A voltage applied to one or more electrodes selectively electrostatically attracts the workpiece to the clamping surface. One or more auxiliary clamping members are further provided wherein the one or more auxiliary clamping members are configured to selectively secure at least a portion of the workpiece to the clamping surface. A temperature monitoring device configured to determine a temperature of the workpiece is provided, and a controller is configured to selectively clamp the workpiece to the clamping surface via a control of the voltage to the one or more electrodes and the one or more auxiliary clamping members, based, at least in part, on the temperature of the workpiece.
摘要翻译：提供了一种具有夹板的静电夹具，其中夹持板的夹紧表面构造成接触工件。施加到一个或多个电极的电压选择性地静电将工件吸引到夹紧表面。还提供了一个或多个辅助夹紧构件，其中一个或多个辅助夹紧构件构造成选择性地将至少一部分工件固定到夹紧表面。提供了一种被配置为确定工件的温度的温度监视装置，并且控制器被配置为经由对一个或多个电极和一个或多个辅助夹紧构件的电压的控制来选择性地将工件夹紧到夹紧表面，至少部分地基于工件的温度。

56. 发明授权

US08918989B2 Device for aligning and pre-fixing a wafer 有权
标题翻译：用于对准和预定晶片的装置
公开(公告)号：US08918989B2
公开(公告)日：2014-12-30
申请号：US13138906
申请日：2010-03-31
申请人： Jürgen Burggraf , Friedrich Paul Lindner , Stefan Pargfrieder , Daniel Burgstaller
发明人： Jürgen Burggraf , Friedrich Paul Lindner , Stefan Pargfrieder , Daniel Burgstaller
IPC分类号： H05K13/04 , H05K13/00 , H01L21/687 , H01L21/67 , H01L21/68
CPC分类号： H01L21/68 , H01L21/67132 , H01L21/68728 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49902 , Y10T29/53091 , Y10T29/53174 , Y10T29/53978
摘要： A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
摘要翻译：一种用于对准和前缀载体基底上的平坦基底的装置，用于进一步处理基底。该装置包括对准装置，用于通过接合基板的外部轮廓来相对于载体基板的外部轮廓对准基板的外部轮廓。衬底的对准沿着平行于衬底的接触表面的衬底平面E进行。提供了用于载体基板上对准的衬底的至少部分前缀的附接装置。

57. 发明申请

US20140373289A1 SUBSTRATE HOLDING APPARATUS AND SUBSTRATE CLEANING APPARATUS 有权
标题翻译：基板保持装置和基板清洁装置
公开(公告)号：US20140373289A1
公开(公告)日：2014-12-25
申请号：US14309287
申请日：2014-06-19
申请人： Ebara Corporation
发明人： Mitsuru Miyazaki , Takuya Inoue
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/67046 , H01L21/67051 , H01L21/687 , H01L21/68728
摘要： A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus includes: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate.
摘要翻译：公开了能够减少诸如晶片的基板的偏转量的基板保持装置。基板保持装置包括：多个卡盘，其构造成保持基板的周边边缘; 设置在所述基板下方的至少一个支撑构件; 以及致动装置，其构造成使得所述卡盘与所述基板的周边边缘接触，同时升高所述支撑构件以使所述支撑构件与所述基板的下表面接触，并且构造成使所述卡盘沿远离所述基板的方向移动同时降低支撑构件以将支撑构件分离离开衬底的下表面。

58. 发明申请

US20140331927A1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板加工设备
公开(公告)号：US20140331927A1
公开(公告)日：2014-11-13
申请号：US14273689
申请日：2014-05-09
申请人： DAINIPPON SCREEN MFG. CO., LTD.
发明人： Akiyoshi NAKANO , Kurumi YAGI
IPC分类号： B05C13/00
CPC分类号： H01L21/00 , H01L21/02052 , H01L21/67017 , H01L21/68728 , H01L21/68735
摘要： A substrate processing apparatus includes a plurality of chuck pins and a heat source. The chuck pin includes a conductive member made of a material containing carbon, and a pin cover that covers the conductive member. The conductive member includes a gripping portion softer than the substrate, the gripping portion to be pressed onto a peripheral edge portion of the substrate, and protrudes outward from an outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate. The pin cover covers, in a plan view, the entire region of a part of the conductive member protruding outward from the outer peripheral edge of the substrate in a plan view in a state where the gripping portion is pressed onto the peripheral edge portion of the substrate.
摘要翻译：基板处理装置包括多个卡盘销和热源。卡盘销包括由包含碳的材料制成的导电构件和覆盖导电构件的销盖。所述导电构件包括比所述基板更软的夹持部，所述抓握部被压在所述基板的周缘部上，并且在所述夹持部是所述夹持部的状态下，从所述基板的外周缘向平面图向外侧突出压在基板的周边部分上。销盖在平面图中以平面图的方式从导电构件的外周边缘向外突出的一部分导电构件的整个区域覆盖，其中夹持部被按压到基板的周边部分的状态基质。

59. 发明申请

US20140322919A1 SEMICONDUCTOR WAFER CHUCK AND METHOD 有权
公开(公告)号：US20140322919A1
公开(公告)日：2014-10-30
申请号：US14261281
申请日：2014-04-24
申请人： JST Manufacturing Inc.
发明人： Jacob Stafford , David Campion , Travis Deleve , Jason Boyd
IPC分类号： H01L21/687 , H01L21/288 , H01L21/02
CPC分类号： H01L21/288 , G03F7/162 , H01L21/67051 , H01L21/68728 , H01L21/68792
摘要： A semiconductor wafer spinning chuck includes a rotatable base, a plurality of arms, upstanding from the base, a selectively releasable clamping mechanism, associated with the arms, and a spray nozzle, extending through the base. The clamping mechanism has a first portion configured to mechanically clamp an edge of a first semiconductor wafer and hold the first wafer in a substantially horizontal orientation upon all of the arms, with a backside of the first wafer facing down. The spray nozzle is oriented to direct a spray of fluid at the backside of the first wafer.
摘要翻译：半导体晶片旋转卡盘包括可旋转基座，从基座直立的多个臂，与臂相关联的可选择性地释放的夹紧机构，以及延伸穿过基座的喷嘴。夹持机构具有第一部分，其构造成机械地夹持第一半导体晶片的边缘，并且将所述第一晶片的背面朝下放置在所有臂上的基本上水平的方向上。喷嘴被定向成在第一晶片的背面引导流体喷射。

60. 发明授权

US08863808B2 Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device 有权
标题翻译：一对基板支架，基板支架，基板接合装置及其制造方法
公开(公告)号：US08863808B2
公开(公告)日：2014-10-21
申请号：US13524820
申请日：2012-06-15
申请人： Daisuke Yuki , Takahiro Miike , Hiroshi Mori
发明人： Daisuke Yuki , Takahiro Miike , Hiroshi Mori
IPC分类号： B32B38/18 , H01L21/18 , H01L21/687 , H01L21/67 , H01L21/683
CPC分类号： H01L21/68721 , B32B38/18 , H01L21/187 , H01L21/67092 , H01L21/6833 , H01L21/68728 , H01L21/68764 , H01L21/68785 , Y10T156/10
摘要： A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.
摘要翻译：一种衬底保持器对，包括第一衬底保持器和保持第一衬底和第二衬底的第二衬底保持器，第一衬底和第二衬底在其自身与第一衬底保持器之间彼此接合。第一衬底保持器包括压力接收部分，当第一衬底保持器与第二衬底保持器分离时，被按压构件按压，并且第二衬底保持器包括通过部分的通过部分，以使得能够按压的压力接收部分。

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