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51. 发明授权

US4642161A Method of bonding copper and resin 失效
标题翻译：铜和树脂的接合方法
公开(公告)号：US4642161A
公开(公告)日：1987-02-10
申请号：US823003
申请日：1986-01-27
申请人： Haruo Akahoshi , Kanji Murakami , Motoyo Wajima , Kiyonori Kogawa , Ritsuji Toba , Takeshi Shimazaki
发明人： Haruo Akahoshi , Kanji Murakami , Motoyo Wajima , Kiyonori Kogawa , Ritsuji Toba , Takeshi Shimazaki
IPC分类号： B32B15/08 , B32B15/088 , B32B15/092 , C08J5/12 , C23C18/40 , C23C22/05 , C23C22/63 , C23C22/83 , H05K3/38 , H05K3/42 , H05K3/46 , C23F1/02 , B31B31/26 , B44C1/22
CPC分类号： B32B15/08 , C23C18/40 , C23C22/63 , C23C22/83 , H05K3/385 , H05K2203/0315 , H05K2203/1157 , H05K3/4611
摘要： A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.
摘要翻译：公开了一种将铜和树脂接合在一起的方法，其包括在铜的表面上形成氧化铜层以与树脂接合，将还原溶液将氧化铜层还原为金属铜，并将金属铜和树脂在一起。根据该方法，可以获得接合界面的良好的耐酸性和足够高的接合强度。

52. 发明授权

US4409037A Adhesion promoter for printed circuits 失效
标题翻译：印刷电路用粘合促进剂
公开(公告)号：US4409037A
公开(公告)日：1983-10-11
申请号：US365645
申请日：1982-04-05
申请人： Adela Landau
发明人： Adela Landau
IPC分类号： C23C22/63 , H05K3/38 , H05K3/46 , C23C1/10
CPC分类号： C23C22/63 , H05K3/385 , H05K2201/0355 , H05K2203/0315 , H05K3/4611
摘要： It is among the principal objects of invention to provide a composition and a method for improving the adhesion between a copper foil and a printed circuit substrate by the provision of an adhesion promoting copper oxide layer on the copper film.The provision of copper oxide layers on the surface of copper films by immersion in a chlorite-hydroxide bath as conventionally conducted presents problems of safety and reproducibility. This process is improved by employing an oxidizing solution containing an alkali or alkaline earth metal chlorite at a concentration of from 100 grams per liter to complete saturation, and sodium or potassium hydroxide at a concentration of from 5 to 25 grams per liter. The process preferably forms an adhesion improving copper oxide film within commercially practical periods of time, on the order of 7 minutes or less, at practically low temperatures, on the order of from 80.degree. F. to 200.degree. F., and preferably less than about 140.degree. F. The solution can be sprayed by conventional spray etchers.The copper oxide films produced according to the most preferred conditions are brown in coloration and provide adhesion values according to the standard peel test of greater than about 5 pounds per inch with contact times of from about 3 to about 5 minutes.
摘要翻译：本发明的主要目的是提供一种通过在铜膜上提供粘附促进铜氧化物层来提高铜箔和印刷电路衬底之间的粘附性的组合物和方法。通过浸渍在常规方法的亚氯酸盐氢氧化物浴中在铜膜的表面上提供氧化铜层提出了安全性和再现性的问题。通过使用含有浓度为100克/升的碱金属或碱土金属亚氯酸盐以完成饱和的氧化溶液和浓度为5至25克/升的氢氧化钠或氢氧化钾来改进该方法。该方法优选在商业实用的时间段内在几乎低的温度下在约80分钟至200°F的条件下形成约7分钟或更短的粘附改善氧化铜膜，优选小于约140°F。该溶液可以用常规喷雾器喷涂。根据最优选的条件生产的氧化铜膜是着色的棕色，并根据标准剥离试验提供大于约5磅/英寸的粘合值，接触时间为约3至约5分钟。

53. 发明授权

US4305791A Method for the manufacture of capacitive electronic discs 失效
标题翻译：电容电子盘的制造方法
公开(公告)号：US4305791A
公开(公告)日：1981-12-15
申请号：US184522
申请日：1980-09-05
申请人： Marshal L. Whitehurst
发明人： Marshal L. Whitehurst
IPC分类号： C23G1/14 , C23C22/60 , C23C22/63 , C25D1/10 , C23F9/00
CPC分类号： C25D1/10 , C23C22/60 , C23C22/63
摘要： A method for passivating the surface of a recorded metal substrate in which the substrate is immersed for 5-30 minutes in a 35.degree. C.-85.degree. C. aqueous bath containing from about 5 to 30 g/l of an alkaline cleaner and from about 2.5 to 20 g/l of sodium dichromate, potassium dichromate, sodium permanganate, potassium permanganate, or mixtures thereof.
摘要翻译：将基板浸渍在含有约5〜30g / l碱性清洁剂的35℃-85℃水浴中的记录金属基材的表面钝化5-30分钟的方法，重铬酸钠，重铬酸钾，高锰酸钠，高锰酸钾或其混合物约2.5至20g / l。

54. 发明授权

US3839098A Composition and method for producing black coating on brass 失效
标题翻译：用于生产黄铜黑色涂料的组合物和方法
公开(公告)号：US3839098A
公开(公告)日：1974-10-01
申请号：US30496672
申请日：1972-11-09
申请人： CONVERSION CHEM CORP
发明人： BECKWITH M
IPC分类号： C23C22/63 , C23F5/02
CPC分类号： C23C22/63
摘要： An aqueous bath for imparting a black surface coating to brass workpieces is provided by an aqueous solution of cupric carbonate, an organic color intensifier, and ammonium hydroxide in an amount sufficient to provide a pH of about 11.0 to 12.5. The workpieces are immersed in the bath, preferably at ambient temperature, for a period of time sufficient to develop a uniform, deep black finish thereon. The color intensifier may be aliphatic and aromatic ketones, aliphatic and aromatic amines, aliphatic alcohols, oxidation-resistant hydroxybenzene compounds, aromatic phosphonic and sulfonic acids, and mixtures thereof.
摘要翻译：用于赋予黄铜工件黑色表面涂层的水浴由碳酸钙，有机颜色增强剂和氢氧化铵的水溶液提供，其量足以提供约11.0至12.5的pH。将工件浸入浴中，优选在环境温度下浸泡足以在其上形成均匀的深黑色涂层的时间。增色剂可以是脂族和芳族酮，脂族和芳族胺，脂族醇，抗氧化羟基苯化合物，芳族膦酸和磺酸，以及它们的混合物。

55. 发明授权

US3657023A Composition for blackening copper 失效
标题翻译：黑色组合物
公开(公告)号：US3657023A
公开(公告)日：1972-04-18
申请号：US3657023D
申请日：1970-05-15
申请人： JOHN J GRUNWALD , EDMUND E HORNER
发明人： GRUNWALD JOHN J , HORNER EDMUND E
IPC分类号： C23C22/63 , C23F7/12
CPC分类号： C23C22/63
摘要： Novel blackening compositions comprising a peroxydiphosphate compound and an alkali metal hydroxide are utilized to produce on copper surfaces a soft, velvet-black coating which can be mechanically rubbed to form a smooth, black finish. The coating process is carried out by immersing the copper article in the aqueous blackening bath at a temperature of about 150* to about 210* F. for about 3 to about 30 minutes.
摘要翻译：使用包含过氧化二磷酸酯化合物和碱金属氢氧化物的新型黑化组合物在铜表面上生产柔软的天鹅绒黑色涂层，其可机械摩擦以形成光滑的黑色整理剂。涂覆方法是通过将铜制品浸入含水黑化浴中在约150°至约210°F的温度下进行约3至约30分钟。

56. 发明授权

US3107197A Method of bonding a metal to a plastic and the article produced thereby 失效
标题翻译：将金属与塑料接合的方法及其制造的制品
公开(公告)号：US3107197A
公开(公告)日：1963-10-15
申请号：US66384157
申请日：1957-06-05
申请人： INT RESISTANCE CO
发明人： STEIN SIDNEY J , ALLEN LOUIS B
IPC分类号： B29C63/48 , B32B15/08 , B32B27/00 , C23C22/63 , H01B1/00 , H01B3/00 , H01B3/30 , H01B7/28 , H01G2/12 , H01G4/228 , H05K1/03 , H05K3/28 , H05K3/38
CPC分类号： H01G4/228 , B29C63/48 , B32B15/08 , B32B27/00 , C23C22/63 , H01B1/00 , H01B3/004 , H01B3/308 , H01B7/28 , H01G2/12 , H05K1/034 , H05K3/281 , H05K3/382 , H05K3/385 , H05K2201/015 , H05K2201/0355 , H05K2203/0315 , Y10T428/31544

57. 发明授权

US3014817A Process for covering metal consisting of cadmium or copper with an extremely thin protecting chromiferous layer 失效
标题翻译：包含镉或铜的金属与极薄的保护性含铬层的工艺
公开(公告)号：US3014817A
公开(公告)日：1961-12-26
申请号：US647960
申请日：1960-02-03
申请人： PHILIPS CORP
发明人： LEENDERT MELSE JAN , PETRUS BAEYENS
IPC分类号： C23C22/60 , C23C22/63 , C23C22/68
CPC分类号： C23C22/68 , C23C22/60 , C23C22/63 , Y10S428/936 , Y10T428/12785 , Y10T428/12847 , Y10T428/12903

58. 发明授权

US2884161A Composite articles of metal and elastomer and method of fabrication 失效
标题翻译：金属和弹性体的复合制品和制造方法
公开(公告)号：US2884161A
公开(公告)日：1959-04-28
申请号：US31149452
申请日：1952-09-25
申请人： GEN ELECTRIC
发明人： HURD DALLAS T , FINHOLT ROBERT W
IPC分类号： B29C70/68
CPC分类号： B32B15/08 , B29C35/02 , B29C65/02 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/7375 , B29C66/73755 , B29C66/7394 , B29C66/742 , B29K2007/00 , B29K2021/00 , B29K2105/246 , B29K2305/00 , B29K2305/10 , B29K2305/12 , B29L2009/003 , B29L2031/712 , C09J5/02 , C09J2205/306 , C23C22/63 , Y10S220/917 , Y10T428/31826

59. 发明授权

US2417885A Process for coating copper with vinyl resins 失效
标题翻译：用乙烯基树脂涂覆铜的工艺
公开(公告)号：US2417885A
公开(公告)日：1947-03-25
申请号：US50471443
申请日：1943-10-02
申请人： CARBIDE & CARBON CHEM CORP
发明人： POWELL GEORGE M , CARLSTON EARL F
IPC分类号： B05D7/16 , C23C22/63
CPC分类号： B05D7/16 , C23C22/63 , Y10T428/31692

60. 发明申请

US20180139848A1 PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE 审中-公开
公开(公告)号：US20180139848A1
公开(公告)日：2018-05-17
申请号：US15570846
申请日：2017-01-31
申请人： MITSUI MINING & SMELTING CO., LTD.
发明人： Ayumu TATEOKA , Makoto HOSOKAWA , Shota KAWAGUCHI
IPC分类号： H05K3/02 , B32B15/085 , B32B27/32 , C23C22/63 , C25D3/38 , B32B7/12 , B32B37/14
CPC分类号： H05K3/022 , B29C66/45 , B29C66/472 , B29C66/7352 , B29C66/7392 , B32B7/12 , B32B15/08 , B32B15/085 , B32B15/20 , B32B27/322 , B32B37/144 , B32B38/0012 , B32B2255/24 , B32B2309/105 , B32B2327/18 , B32B2398/20 , B32B2457/08 , C23C22/52 , C23C22/63 , C25D1/04 , C25D3/38 , H05K3/385 , H05K3/389 , H05K2203/0307
摘要： There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.

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