基本信息:
- 专利标题： PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE
- 申请号：US15570846 申请日：2017-01-31
- 公开(公告)号：US20180139848A1 公开(公告)日：2018-05-17
- 发明人： Ayumu TATEOKA , Makoto HOSOKAWA , Shota KAWAGUCHI
- 申请人： MITSUI MINING & SMELTING CO., LTD.
- 申请人地址： JP Tokyo
- 专利权人： MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人： MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2016-040795 20160303; JPPCT/JP2016/082658 20161102
- 国际申请： PCT/JP2017/003344 WO 20170131
- 主分类号： H05K3/02
- IPC分类号： H05K3/02 ; B32B15/085 ; B32B27/32 ; C23C22/63 ; C25D3/38 ; B32B7/12 ; B32B37/14
摘要：
There is provided a method of producing a copper clad laminate having a copper foil and a resin bonded at high adhesive force despite the use of a thermoplastic resin having a low dielectric constant. This method includes the steps of: providing a roughened copper foil having at least one roughened surface having fine irregularities composed of acicular crystals containing cupric oxide and cuprous oxide; and bonding a sheet-shaped thermoplastic resin to the roughened surface of the roughened copper foil to provide a copper clad laminate. The roughened surface has a cupric oxide thickness of 1 to 20 nm and a cuprous oxide thickness of 15 to 70 nm, both determined by sequential electrochemical reduction analysis (SERA) at the time of bonding the thermoplastic resin.
公开/授权文献:
- US10244635B2 Production method for copper-clad laminate plate 公开/授权日：2019-03-26
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K3/00 | 用于制造印刷电路的设备或方法 |
| --------H05K3/02 | .其中将导电材料敷至绝缘支承物的表面上，而后再将其导电材料从不希望让电流通导或屏蔽的表面区域中去除的 |