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51. 发明授权

US09567688B2 Metallic materials with embedded luminescent particles 有权
标题翻译：带有嵌入式发光颗粒的金属材料
公开(公告)号：US09567688B2
公开(公告)日：2017-02-14
申请号：US14881349
申请日：2015-10-13
申请人： The Royal Mint Limited
发明人： Jeffrey L. Conroy , Philip B. Forshee , James A. Shearer
IPC分类号： G07D7/12 , G07D5/00 , C25D7/00 , C25D5/02 , C25D3/38 , C25D5/10 , C25D15/00 , C25D17/16 , C23C18/31 , C25D3/58 , C23C18/36 , B32B15/01 , C25D3/12 , C25D3/22 , G07F7/08 , C23C18/16
CPC分类号： C25D7/00 , B32B15/01 , C23C18/1637 , C23C18/1646 , C23C18/1653 , C23C18/1662 , C23C18/31 , C23C18/36 , C25D3/12 , C25D3/22 , C25D3/38 , C25D3/58 , C25D5/02 , C25D5/10 , C25D7/005 , C25D15/00 , C25D17/16 , G07D5/00 , G07D7/12 , G07F7/0813 , Y10T428/12493
摘要： Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.
摘要翻译：通过在金属基底上沉积具有嵌入的颗粒的金属层来形成认证元件，其中嵌入的颗粒被配置成将能量从一个波长转换成另一个波长。嵌入的颗粒可以是上变频器，下变频器或磷光荧光体，其可以在沉积在金属层中时用分析设备检测和测量。金属基底可以包括造币。

52. 发明申请

US20170042040A1 COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS ON COPPER, AND A COATED COMPONENT THEREFROM 有权
标题翻译：磷酸铜电镀的组合物和方法及其涂层组分
公开(公告)号：US20170042040A1
公开(公告)日：2017-02-09
申请号：US14819150
申请日：2015-08-05
申请人： UYEMURA INTERNATIONAL CORPORATION
发明人： JON E. BENGSTON
IPC分类号： H05K3/18 , C23C18/16 , C23C18/44
CPC分类号： C23C18/44 , C23C18/1637 , C23C18/1651 , C23C18/54 , H05K1/09 , H05K1/118 , H05K3/187 , H05K3/244 , H05K2201/0338
摘要： A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
摘要翻译：已经发现包含钯化合物和聚氨基羧酸化合物的溶液适合作为用于在铜上无电镀钯的浴。使用这种溶液产生包含铜表面和厚度在0.01微米（μm）和5μm之间的镀钯涂层的镀层组分。在组分的铜表面上无电镀钯的方法包括制备具有钯化合物和多氨基羧酸化合物的浴。将铜组分浸没在浴中以在组件的铜表面上镀钯层。由镀覆方法得到的成分在铜表面上镀钯层。

53. 发明授权

US09556523B2 Method for coating metallic surfaces of substrates, and objects coated according to said method 有权
标题翻译：用于涂覆基材的金属表面的方法，以及根据所述方法涂覆的物体
公开(公告)号：US09556523B2
公开(公告)日：2017-01-31
申请号：US14377048
申请日：2013-02-07
申请人： Chemetall GmbH
发明人： Daniel Wasserfallen , Michael Schwamb , Aliaksandr Frenkel , Vera Sotke , Wolfgang Bremser , Martin Droll , Oliver Seewald , Ron Eilinghoff , Stephanie Gerold , Evgenija Niesen , Lars Schachtsiek , Manuel Traut
IPC分类号： C23C18/16 , B05D7/16 , C09D5/08 , C09D133/14 , C23C18/18 , B05D7/14 , B05D1/18
CPC分类号： C23C18/1637 , B05D1/18 , B05D7/14 , B05D7/142 , B05D7/16 , C09D5/088 , C09D133/14 , C23C18/1692 , C23C18/1803
摘要： A method and composition for coating surfaces, a corresponding coating and the use of objects coated according to said method. A cleaned, metallic surface is contacted with an aqueous composition that is a dispersion or suspension, and drying and/or baking the organic coating or optionally, drying the organic coating and coating with an equivalent or additional coating composition prior to a drying and/or baking. The aqueous composition has a pH of 4 to 11 and contains an anionic polyelectrolyte in a quantity of 0.01 to 5.0 wt. % relative to the total mass of the composition, which may have a solids content of from 2 to 40 wt. %. The solids have an average particle size from 10 to 1000 nm. A coating forms on the basis of an ionogenic gel which binds cations released from the metallic surface that originate from a pretreatment stage or from the contacting.
摘要翻译：用于涂覆表面的方法和组合物，相应的涂层以及根据所述方法涂覆的物体的使用。将清洁的金属表面与作为分散体或悬浮液的水性组合物接触，并干燥和/或烘烤有机涂层或任选地在干燥之前干燥有机涂层和用相当的或附加的涂料组合物涂覆和/或烘烤水性组合物的pH为4〜11，含有0.01〜5.0重量％的阴离子性聚电解质。相对于组合物的总质量，其可以具有2至40重量％的固体含量。％。固体的平均粒度为10〜1000nm。基于结合起始于预处理阶段或接触的金属表面释放的阳离子的离子发生凝胶形成涂层。

54. 发明申请

US20160222518A1 ANISOTROPIC ETCHING OF METALLIC SUBSTRATES 有权
标题翻译：金属基板的各向异性蚀刻
公开(公告)号：US20160222518A1
公开(公告)日：2016-08-04
申请号：US14642171
申请日：2015-03-09
申请人： Rolls-Royce North American Technologies, Inc.
发明人： James Carl Loebig
IPC分类号： C23C18/16 , G03F7/30 , C23C16/44 , C23F1/00 , C23C14/22
CPC分类号： C25F3/14 , C23C14/22 , C23C16/44 , C23C18/1637 , C23F1/00 , G03F7/3007
摘要： In some examples, a method includes forming a photoresist layer on a surface of a metallic substrate and developing the photoresist layer to define a pattern exposing a portion of the surface of the metallic substrate. The method also may include forming an electrically conductive layer on a surface of the photoresist layer and the exposed portions of the surface of the metallic substrate. The electrically conductive layer contacts the exposed portions of the surface of the metallic substrate. The method may further include submerging the substrate, the photoresist layer, and the electrically conductive layer in an electrolyte solution; and applying a voltage to between a cathode and an anode submerged in the electrolyte solution to anisotropically etch the metallic substrate where the electrically conductive layer contacts the exposed portions of the surface of the metallic substrate to form at least one feature in the metallic substrate.
摘要翻译：在一些实例中，一种方法包括在金属基底的表面上形成光致抗蚀剂层并使该光致抗蚀剂层显影以限定暴露金属基底表面的一部分的图案。该方法还可以包括在光致抗蚀剂层的表面和金属基底的表面的暴露部分上形成导电层。导电层接触金属基底表面的暴露部分。该方法可以进一步包括将基底，光致抗蚀剂层和导电层浸没在电解质溶液中; 以及向沉积在电解液中的阴极和阳极之间施加电压以各向异性地蚀刻金属基底，其中导电层与金属基底的表面的暴露部分接触以形成金属基底中的至少一个特征。

55. 发明申请

US20160145444A1 COATING COMPOSITION FOR METAL SURFACE PRE-TREATMENT, ITS PREPARATION AND USE THEREOF 审中-公开
标题翻译：金属表面处理用涂料组合物及其制备及其用途
公开(公告)号：US20160145444A1
公开(公告)日：2016-05-26
申请号：US15012905
申请日：2016-02-02
申请人： Henkel AG & Co. KGaA
发明人： Xueting Qiu
IPC分类号： C09D5/08 , C23C18/42 , C23C18/16 , C09J183/04
CPC分类号： C09D5/082 , C08F220/18 , C08G65/336 , C08G77/26 , C08G77/58 , C09D5/084 , C09D5/086 , C09D133/08 , C09D183/08 , C09D183/14 , C09J183/04 , C23C18/122 , C23C18/1241 , C23C18/1291 , C23C18/1295 , C23C18/1637 , C23C18/42 , C23C22/34 , C23C2222/20 , C08F2220/1825 , C08F212/08 , C08F2220/1858 , C08F220/34 , C08F230/08 , C08L75/04
摘要： This invention provided an aqueous coating composition for metal surface pre-treatment comprising: (i) at least one organosilane with at least one hydrolyzable substituent; (ii) at least one water soluble and/or water dispersible silane-functional oligomer; (iii) at least one water-soluble compound of the elements Zr and/or Ti; The resultant sol-gel coating composition reveals an extended shelf life and after surface pre-treatment using the invented coating compositions the metal substrates have higher resistance to corrosion, humidity and solvent and at the same time have better surface conductivity and paintability.
摘要翻译：本发明提供了一种用于金属表面预处理的水性涂料组合物，其包含：（i）至少一种具有至少一个可水解取代基的有机硅烷; （ii）至少一种水溶性和/或水分散性硅烷官能低聚物; （iii）至少一种元素Zr和/或Ti的水溶性化合物; 所得溶胶 - 凝胶涂层组合物显示出延长的保存期限，并且在使用本发明的涂料组合物进行表面预处理之后，金属基材具有较高的耐腐蚀性，湿度和溶剂性，同时具有更好的表面导电性和可涂饰性。

56. 发明申请

US20160032477A1 Metallic Materials with Embedded Luminescent Particles 审中-公开
标题翻译：嵌入式发光粒子的金属材料
公开(公告)号：US20160032477A1
公开(公告)日：2016-02-04
申请号：US14881349
申请日：2015-10-13
申请人： The Royal Mint Limited
发明人： Jeffrey L. Conroy , Philip B. Forshee , James A. Shearer
IPC分类号： C25D7/00 , B32B15/01 , C25D15/00
CPC分类号： C25D7/00 , B32B15/01 , C23C18/1637 , C23C18/1646 , C23C18/1653 , C23C18/1662 , C23C18/31 , C23C18/36 , C25D3/12 , C25D3/22 , C25D3/38 , C25D3/58 , C25D5/02 , C25D5/10 , C25D7/005 , C25D15/00 , C25D17/16 , G07D5/00 , G07D7/12 , G07F7/0813 , Y10T428/12493
摘要： Formation of an authentication element by deposition of a metal layer with embedded particles on a metal substrate, wherein the embedded particles are configured to convert energy from one wavelength to another. The embedded particles may be upconverters, downconverters, or phosphorescent phosphors, which can be detected and measured with analytical equipment when deposited in the metal layer. A metal substrate may include coinage.
摘要翻译：通过在金属基底上沉积具有嵌入的颗粒的金属层来形成认证元件，其中嵌入的颗粒被配置成将能量从一个波长转换成另一个波长。嵌入的颗粒可以是上变频器，下变频器或磷光荧光体，其可以在沉积在金属层中时用分析设备检测和测量。金属基底可以包括造币。

57. 发明申请

US20150159717A1 NI-CU PLATED HIGH-CARBON STEEL WIRE FOR SPRINGS AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于弹簧的NI-CU镀覆高碳钢丝及其制造方法
公开(公告)号：US20150159717A1
公开(公告)日：2015-06-11
申请号：US14412807
申请日：2013-07-04
申请人： Kiswire Ltd.
发明人： Jin Young Jung , Lee Seok Hong , Sung Young Lim
IPC分类号： F16F1/02 , C23C18/38 , C23C18/32 , B32B15/01 , C23C18/16
CPC分类号： F16F1/021 , B32B15/015 , C23C18/1637 , C23C18/32 , C23C18/38 , C25D3/12 , C25D3/38 , C25D5/12 , C25D5/48 , C25D5/50 , C25D7/0607 , Y10T428/12937
摘要： Provided is a nickel (Ni)-copper (Cu) plated high-carbon steel wire for springs. The Ni—Cu plated high-carbon steel wire includes a core wire that includes a high-carbon steel wire; and a Ni-plating layer and a Cu player which are sequentially plated on a surface of the core wire and then are drawn.
摘要翻译：提供一种用于弹簧的镍（Ni） - 铜（Cu）电镀的高碳钢丝。 Ni-Cu镀覆的高碳钢丝包括：包含高碳钢丝的芯线; 以及依次镀在芯线的表面上然后被拉出的镀镍层和铜合金。

58. 发明授权

US09023137B2 Electroless deposition of platinum on copper 有权
标题翻译：铂在铜上的无电沉积
公开(公告)号：US09023137B2
公开(公告)日：2015-05-05
申请号：US14013760
申请日：2013-08-29
申请人： Intermolecular, Inc.
发明人： Bob Kong , Igor Ivanov , Zhi-Wen Sun , Jinhong Tong
IPC分类号： C23C18/44 , H01L21/02 , H01L21/033 , H01L21/288 , H01L21/3105 , H01L21/768 , C23C18/18 , C23C18/16 , H01L27/105 , H01L49/02
CPC分类号： C23C18/44 , C23C18/1605 , C23C18/1607 , C23C18/1637 , C23C18/1844 , H01L21/02068 , H01L21/0332 , H01L21/288 , H01L21/3105 , H01L21/76814 , H01L21/76849 , H01L21/7687 , H01L27/1052 , H01L28/65 , Y10T428/12493 , Y10T428/12875 , Y10T428/12903 , Y10T428/24917
摘要： Embodiments of the current invention describe a method of plating platinum selectively on a copper film using a self-initiated electroless process. In particular, platinum films are plated onto very thin copper films having a thickness of less than 300 angstroms. The electroless plating solution and the resulting structure are also described. This process has applications in the semiconductor processing of logic devices, memory devices, and photovoltaic devices.
摘要翻译：本发明的实施方案描述了使用自引发的无电镀方法在铂膜上选择性镀铂的方法。特别地，铂膜被镀在厚度小于300埃的非常薄的铜膜上。还描述了化学镀溶液和所得结构。该方法在逻辑器件，存储器件和光伏器件的半导体处理中具有应用。

59. 发明申请

US20150072066A1 Antimicrobial Silver Compositions 有权
标题翻译：抗菌银组合物
公开(公告)号：US20150072066A1
公开(公告)日：2015-03-12
申请号：US14546038
申请日：2014-11-18
申请人： Avent, Inc.
发明人： Bhalchandra M. Karandikar , Bruce L. Gibbins , Kenneth A. Cornell
IPC分类号： A01N59/16 , C23C18/44 , C23C18/16 , A61L29/10 , C08J7/04 , A61L27/30 , A61L27/54 , A61L15/18 , A61L15/42 , A01N25/34 , A61L29/16
CPC分类号： A01N59/16 , A01N25/34 , A61K33/38 , A61L15/18 , A61L15/42 , A61L15/46 , A61L27/306 , A61L27/54 , A61L29/106 , A61L29/16 , A61L2300/104 , A61L2300/404 , A61L2300/624 , A61L2400/12 , C08J7/04 , C08J2323/12 , C08J2327/06 , C08J2327/18 , C08J2375/04 , C08J2377/02 , C23C18/1637 , C23C18/1639 , C23C18/1641 , C23C18/1646 , C23C18/1689 , C23C18/44 , D06M11/83 , D06M16/00 , D06M23/08 , Y10S977/906 , A01N25/02 , A01N25/10 , A01N25/22 , A01N25/30 , A01N2300/00 , A01N37/06 , A01N43/50 , A01N43/80
摘要： The present invention comprises methods and compositions for antimicrobial silver compositions comprising silver nanoparticles. The present invention further comprises compositions for preparing silver nanoparticles comprising at least one stabilizing agent, one or more silver compounds, at least one reducing agent and a solvent. In one aspect, the stabilizing agent comprises a surfactant or a polymer. The polymer may comprise polymers such as polyacrylamides, polyurethanes, and polyamides. In one aspect, the silver compound comprises a salt comprising a silver cation and an anion. The anion may comprise saccharinate derivatives, long chain fatty acids, and alkyl dicarboxylates. The methods of the present invention comprise treating devices with the silver nanoparticle compositions, including, but not limited to, such devices as woven wound care materials, catheters, patient care devices, and collagen matrices. The present invention further comprises treatment of humans and animals wacr6ith the antimicrobial devices described herein.
摘要翻译：本发明包括包含银纳米颗粒的抗微生物银组合物的方法和组合物。本发明还包括用于制备包含至少一种稳定剂，一种或多种银化合物，至少一种还原剂和溶剂的银纳米颗粒的组合物。一方面，稳定剂包括表面活性剂或聚合物。聚合物可以包括聚合物，例如聚丙烯酰胺，聚氨酯和聚酰胺。在一个方面，银化合物包括包含银阳离子和阴离子的盐。阴离子可以包含糖精衍生物，长链脂肪酸和二羧酸烷基酯。本发明的方法包括用银纳米颗粒组合物处理装置，包括但不限于诸如编织伤口护理材料，导管，患者护理装置和胶原基质之类的装置。本发明还包括用本文所述的抗微生物装置处理人和动物。

60. 发明申请

US20150044374A1 Electroless Nickel Plating Solution and Method 审中-公开
标题翻译：化学镀镍溶液及方法
公开(公告)号：US20150044374A1
公开(公告)日：2015-02-12
申请号：US13961018
申请日：2013-08-07
申请人： MacDermid Acumen, Inc.
发明人： Robert Janik , Nicole J. Micyus
IPC分类号： C23C18/16 , C23C18/20 , C23C18/36 , C23C18/18
CPC分类号： C23C18/1646 , C23C18/1637 , C23C18/1639 , C23C18/1641 , C23C18/1824 , C23C18/1844 , C23C18/1893 , C23C18/2046 , C23C18/2086 , C23C18/34 , C23C18/36
摘要： An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
摘要翻译：描述了一种无电镀镍溶液及其使用方法。化学镀镍溶液包括（i）镍离子源; （ii）还原剂; （iii）一种或多种络合剂; （iv）一种或多种浴液稳定剂; （v）增白剂，所述增白剂包含具有磺酸或磺酸盐基团的磺化化合物; 和（vi）任选的一种或多种另外的添加剂。磺化化合物增白剂的使用导致在具有高光泽度的各种基材上的亮化学镀镍。

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