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    • 54. 发明授权
    • Methods for forming semiconductor materials by atomic layer deposition using halide precursors
    • 通过使用卤化物前体的原子层沉积形成半导体材料的方法
    • US08785316B2
    • 2014-07-22
    • US13933855
    • 2013-07-02
    • Soitec
    • Christiaan J. Werkhoven
    • H01L21/28
    • H01L21/0262C23C16/301C23C16/4488C23C16/45551C23C16/545H01L21/02538H01L21/0254
    • Methods of depositing a III-V semiconductor material on a substrate include sequentially introducing a gaseous precursor of a group III element and a gaseous precursor of a group V element to the substrate by altering spatial positioning of the substrate with respect to a plurality of gas columns. For example, the substrate may be moved relative to a plurality of substantially aligned gas columns, each disposing a different precursor. Thermalizing gas injectors for generating the precursors may include an inlet, a thermalizing conduit, a liquid container configured to hold a liquid reagent therein, and an outlet. Deposition systems for forming one or more III-V semiconductor materials on a surface of the substrate may include one or more such thermalizing gas injectors configured to direct the precursor to the substrate via the plurality of gas columns.
    • 将III-V族半导体材料沉积在衬底上的方法包括通过相对于多个气体柱改变衬底的空间定位,将III族元素的气态前体和V族元素的气态前体顺序地引入衬底 。 例如,衬底可以相对于多个基本排列的气体柱移动,每个气体柱设置不同的前体。 用于产生前体的热化气体注入器可以包括入口,热化管道,配置成将液体试剂保持在其中的液体容器和出口。 用于在衬底的表面上形成一个或多个III-V半导体材料的沉积系统可以包括一个或多个这样的热化气体注入器,其构造成经由多个气体柱将前体引导到衬底。
    • 56. 发明授权
    • Position controller for flexible substrate
    • 位置控制器用于柔性基板
    • US08746309B2
    • 2014-06-10
    • US13381051
    • 2010-12-21
    • Takanori YamadaShoji Yokoyama
    • Takanori YamadaShoji Yokoyama
    • B32B37/00B29C65/00
    • B29C66/95B29C66/90C23C14/562C23C16/545H01L21/67259H01L21/67706H01L21/67721H01L21/6776H01L31/206Y02E10/50Y02P70/521Y10T156/17Y10T156/1741
    • Provided is a position controller for a flexible substrate (100) provided in a processing apparatus conveying a band-shaped flexible substrate (1) in a longitudinal position, in the lateral direction and processing the substrate in a processing unit (20) installed on a conveying path of the substrate. The position controller for the flexible substrate includes a pair of sandwiching rollers (131 and 132) that sandwiches an upper edge of the substrate; a supporting mechanism (140) that supports the pair of sandwiching rollers so as to be rotatable and movable close to or away from each other; an urging device (150) that applies a pressing force to the pair of sandwiching rollers through the supporting mechanism; and a pressing force adjusting device (160) adjusting the pressing force from the urging device, wherein each roller constituting the pair of sandwiching rollers is a conical roller having a circumferential surface inclined with respect to the axial direction, and is supported to the supporting mechanism so that a small diameter side of each conical roller is located at a center side of the substrate in the lateral direction and the rotation direction of a sandwiching surface of the substrate is the same as the conveying direction of the substrate.
    • 提供了一种用于柔性基板(100)的位置控制器,该柔性基板设置在沿横向方向沿纵向位置传送带状柔性基板(1)的处理设备中,并且在处理单元(20)中处理基板,所述处理单元(20)安装在 衬底的输送路径。 用于柔性基板的位置控制器包括夹持基板的上边缘的一对夹持辊(131和132) 支撑机构(140),其支撑所述一对夹持辊以能够彼此靠近或远离地旋转和移动; 推动装置(150),其通过所述支撑机构对所述一对夹持辊施加按压力; 以及调整来自推动装置的按压力的按压力调节装置(160),其中构成所述一对夹持辊的每个辊是具有相对于轴向倾斜的周向表面的圆锥形辊,并且支撑在支撑机构 使得每个圆锥形辊的小直径侧在横向方向上位于基板的中心侧,并且基板的夹持表面的旋转方向与基板的输送方向相同。