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    • 56. 发明授权
    • Surface Mountable transformer
    • 表面贴装变压器
    • US5805431A
    • 1998-09-08
    • US588074
    • 1996-01-17
    • Shankar R. JoshiMeta Rohde
    • Shankar R. JoshiMeta Rohde
    • H01F27/29H05K3/34H01F27/30H01F27/04
    • H01F27/292H05K3/3442H05K2201/09472Y02P70/613Y10S439/931
    • A surface mount package particularly suitable for transformers and other components having numerous windings of fragile, difficult to handle wire has a housing which includes openings along the lower edge, the housing being plated with an electrically conductive material on portions of the lower edge and in areas surrounding the opening. A component is held within the housing, and the leads of the component are disposed in the openings at a point above the lower edge of the housing, and the leads are electrically connected to the plating surrounding the openings and the plating at the flat portions of the lower edge. The plating on the flat portions of the lower edge can be at any suitable location, i.e., remote from or adjacent to the openings. Additional components can be stacked on the exterior of the housing, as connected to the plating surrounding the openings. Also, the walls and/or the top of the housing can be plated to provide for versatility in connecting the housed component, or any other components, on and around the housing. The plating on the housing may be connected to the plating surrounding the openings and the plating at the flat portions of the lower edge, or may entirely independent of the housed electronic component.
    • 特别适用于具有易碎,难以处理的线的多个绕组的变压器和其它部件的表面安装封装具有壳体,该壳体包括沿着下边缘的开口,该壳体在下边缘的部分和区域中被电镀有导电材料 围绕开幕。 部件被保持在壳体内,并且部件的引线在壳体的下边缘上方的点处设置在开口中,并且引线电连接到围绕开口的电镀和在平坦部分的电镀 下边缘。 在下边缘的平坦部分上的电镀可以在任何合适的位置,即远离或邻近开口。 附加部件可以堆叠在外壳的外部,连接到围绕开口的电镀层。 此外,外壳的壁和/或顶部可以被电镀以提供在壳体上和周围连接容纳部件或任何其它部件的多功能性。 壳体上的电镀可以连接到围绕开口的电镀和在下边缘的平坦部分处的电镀,或者可以完全独立于所容纳的电子部件。
    • 58. 发明授权
    • Universal surface mount package
    • 通用表面贴装包装
    • US5160810A
    • 1992-11-03
    • US823374
    • 1992-01-21
    • Meta RohdeShankar R. Joshi
    • Meta RohdeShankar R. Joshi
    • H01L23/10H05K3/34
    • H01L23/10H01L2924/0002H05K3/3421
    • A hermetically sealed surface mount electronic component package can be manufactured by converting standard, readily available flat-packs. The package has a base, with an opening through which a primary transmission lead extends, a glass-to-metal seal surrounding the transmission lead in the opening, and a secondary transmission lead extends from the primary transmission lead so that it is spaced from the base and its end is at least flush with the bottom of the base. An insulator can be provided between the primary transmission lead and the secondary transmission lead. A method of converting a standard flat-pack by providing a composite piece having a dielectric insulator, a secondary transmission lead for connection to the transmission lead of the flat-pack, and a connecting member for connecting the insulator and secondary transmission lead to the base of the flat-pack is also described.
    • 密封的表面贴装电子元件封装可以通过转换标准的易于使用的扁平封装来制造。 该封装具有一个底座,一个主传动导线通过该开口延伸,围绕该开口中的传动引线的玻璃 - 金属密封件,并且一次传动引线从该主传动引线延伸,使其与 底部至少与底部的底部齐平。 可以在主传动引线和次传输引线之间设置绝缘体。 一种通过提供具有电介质绝缘体的复合片,用于连接到扁平封装的传输引线的二次传输引线和用于将绝缘体和次级传输引线连接到基座的连接构件来转换标准平板组件的方法 还描述了平板组件。