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    • 53. 发明授权
    • Dual insulating layer diode with asymmetric interface state and method of fabrication
    • 具有非对称界面状态和制造方法的双重绝缘层二极管
    • US07897453B2
    • 2011-03-01
    • US12336410
    • 2008-12-16
    • Xiying ChenDeepak Chandra SekarMark ClarkDat NguyenTanmay Kumar
    • Xiying ChenDeepak Chandra SekarMark ClarkDat NguyenTanmay Kumar
    • H01L21/8234
    • H01L27/2481H01L27/2418H01L45/00
    • An integrated circuit including vertically oriented diode structures between conductors and methods of fabricating the same are provided. The diode is a metal-insulator diode having a first metal layer, a first insulating layer, a second insulating layer and a second metal layer. At least one asymmetric interface state is provided at the intersection of at least two of the layers to increase the ratio of the diode's on-current to its reverse bias leakage current. In various examples, the asymmetric interface state is formed by a positive or negative sheet charge that alters the barrier height and/or electric field at one or more portions of the diode. Two-terminal devices such as passive element memory cells can utilize the diode as a steering element in series with a state change element. The devices can be formed using pillar structures at the intersections of upper and lower conductors.
    • 提供了一种在导体之间包括垂直取向的二极管结构的集成电路及其制造方法。 二极管是具有第一金属层,第一绝缘层,第二绝缘层和第二金属层的金属绝缘体二极管。 在至少两个层的交叉处提供至少一个非对称界面状态,以增加二极管的导通电流与其反向偏置漏电流的比率。 在各种示例中,非对称界面状态由改变二极管的一个或多个部分处的势垒高度和/或电场的正或负片电荷形成。 诸如无源元件存储单元的两端器件可以将二极管用作与状态改变元件串联的转向元件。 可以在上下导体的交点处使用支柱结构形成装置。
    • 55. 发明申请
    • Dual Insulating Layer Diode With Asymmetric Interface State And Method Of Fabrication
    • 双绝缘层二极管与不对称接口状态及制作方法
    • US20100148324A1
    • 2010-06-17
    • US12336410
    • 2008-12-16
    • Xiying ChenDeepak Chandra SekarMark ClarkDat NguyenTanmay Kumar
    • Xiying ChenDeepak Chandra SekarMark ClarkDat NguyenTanmay Kumar
    • H01L29/868
    • H01L27/2481H01L27/2418H01L45/00
    • An integrated circuit including vertically oriented diode structures between conductors and methods of fabricating the same are provided. The diode is a metal-insulator diode having a first metal layer, a first insulating layer, a second insulating layer and a second metal layer. At least one asymmetric interface state is provided at the intersection of at least two of the layers to increase the ratio of the diode's on-current to its reverse bias leakage current. In various examples, the asymmetric interface state is formed by a positive or negative sheet charge that alters the barrier height and/or electric field at one or more portions of the diode. Two-terminal devices such as passive element memory cells can utilize the diode as a steering element in series with a state change element. The devices can be formed using pillar structures at the intersections of upper and lower conductors.
    • 提供了一种在导体之间包括垂直取向的二极管结构的集成电路及其制造方法。 二极管是具有第一金属层,第一绝缘层,第二绝缘层和第二金属层的金属绝缘体二极管。 在至少两个层的交叉处提供至少一个非对称界面状态,以增加二极管的导通电流与其反向偏置漏电流的比率。 在各种示例中,非对称界面状态由改变二极管的一个或多个部分处的势垒高度和/或电场的正或负片电荷形成。 诸如无源元件存储单元的两端器件可以将二极管用作与状态改变元件串联的转向元件。 可以在上下导体的交点处使用支柱结构形成装置。
    • 56. 发明授权
    • Large capacity one-time programmable memory cell using metal oxides
    • 大容量一次性可编程存储单元,使用金属氧化物
    • US07706169B2
    • 2010-04-27
    • US12005277
    • 2007-12-27
    • Tanmay Kumar
    • Tanmay Kumar
    • G11C11/00
    • G11C11/5685G11C11/5692G11C13/0007G11C13/0069G11C17/16G11C17/165G11C2013/0078G11C2013/009G11C2213/31G11C2213/32G11C2213/71G11C2213/72
    • A method of programming a nonvolatile memory device includes (i) providing a nonvolatile memory cell comprising a diode in series with at least one metal oxide, (ii) applying a first forward bias to change a resistivity state of the metal oxide from a first state to a second state; (iii) applying a second forward bias to change a resistivity state of the metal oxide from a second state to a third state; and (iv) applying a third forward bias to change a resistivity state of the metal oxide from a third state to a fourth state. The fourth resistivity state is higher than the third resistivity state, the third resistivity state is lower than the second resistivity state, and the second resistivity state is lower than the first resistivity state.
    • 非易失性存储器件的编程方法包括:(i)提供包括与至少一种金属氧化物串联的二极管的非易失性存储单元,(ii)施加第一正向偏压以从第一状态改变金属氧化物的电阻率状态 到第二个状态 (iii)施加第二正向偏压以将金属氧化物的电阻率状态从第二状态改变到第三状态; 和(iv)施加第三正向偏压以将金属氧化物的电阻率状态从第三状态改变到第四状态。 第四电阻率状态高于第三电阻率状态,第三电阻率状态低于第二电阻率状态,第二电阻率状态低于第一电阻率状态。
    • 60. 发明授权
    • Systems for reverse bias trim operations in non-volatile memory
    • 用于非易失性存储器中的反向偏置调整操作的系统
    • US07492630B2
    • 2009-02-17
    • US11461431
    • 2006-07-31
    • Roy E. ScheuerleinTanmay Kumar
    • Roy E. ScheuerleinTanmay Kumar
    • G11C13/04
    • G11C8/08G11C5/02G11C11/56G11C13/0023G11C13/0028G11C13/0038G11C13/0069G11C13/0097G11C17/16G11C17/18G11C2213/71G11C2213/72
    • A reverse bias trim operation for the reset state of a non-volatile memory system is disclosed. Non-volatile memory cells including a resistance change element undergo a reverse bias reset operation to change their resistance from a set state at a first level of resistance to a reset state at a second level of resistance. Certain memory cells in a set of cells that was reset may be deeply reset to a level of resistance beyond a target level for the reset state. A second reverse bias is applied to the set of memory cells to move the resistance of each cell that was deeply reset toward the target level of the reset state. A smaller reverse bias than used for the reset operation can shift the resistance of the cells back toward the set level and out of their deeply reset condition. The operation is self-limiting in that cells stop their resistance shifts upon reaching the target level. Cells that were not deeply reset are not affected.
    • 公开了一种用于非易失性存储器系统的复位状态的反偏压调整操作。 包括电阻变化元件的非易失性存储单元经历反向偏置复位操作,以在第二电阻电平下将其电阻从第一电阻上的设定状态改变为复位状态。 复位的一组单元格中的某些存储单元可能被重新设置为超出复位状态的目标电平的电阻水平。 第二反向偏压被施加到存储器单元组,以将每个单元的电阻移动到复位状态的目标电平。 与用于复位操作相比较小的反向偏压可以将电池的电阻转移回设定电平并脱离它们的深度复位状态。 操作是自限制的,因为细胞在达到目标水平时停止其阻力位移。 未重新设置的单元格不受影响。