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    • 57. 发明授权
    • Voltage controlled oscillator (VCO) circuit with integrated compensation of thermally caused frequency drift
    • 压控振荡器(VCO)电路具有集成补偿的热引起的频率漂移
    • US08289094B2
    • 2012-10-16
    • US12997102
    • 2008-06-26
    • Peter WennekersHao LiYi Yin
    • Peter WennekersHao LiYi Yin
    • H03B5/08
    • H03B5/04H03B5/1218H03B5/1231H03B5/1243H03B5/1293H03L1/023H03L7/099H03L7/18
    • A voltage controlled oscillator circuit comprises a VCO resonator circuit having a first plurality of varactors for varying a frequency of the VCO resonator circuit, the VCO resonator circuit being symmetrical with respect to VCO circuit ground and providing a signal having a frequency, the frequency depending on a tuning voltage applied to the first plurality of varactors, and a second plurality of varactors for compensating a drift of the frequency depending on a compensation voltage, a temperature sensor circuit sensing an ambient temperature of the VCO resonator circuit and providing a temperature dependent signal, and a temperature compensation circuit providing the compensation voltage depending on the temperature dependent signal. Furthermore, a phase locked loop (PLL) circuit, an automotive radar device and a method for compensating a frequency drift of a VCO resonator circuit are presented.
    • 压控振荡器电路包括具有用于改变VCO谐振电路的频率的第一多个变容二极管的VCO谐振电路,VCO谐振电路相对于VCO电路接地对称,并提供具有频率的信号,频率取决于 施加到第一多个变容二极管的调谐电压,以及用于补偿根据补偿电压的频率漂移的第二多个变容二极管,感测VCO谐振电路的环境温度并提供与温度相关的信号的温度传感器电路, 以及温度补偿电路,其根据与温度相关的信号提供补偿电压。 此外,提出了锁相环(PLL)电路,汽车雷达装置和用于补偿VCO谐振电路的频率漂移的方法。
    • 60. 发明授权
    • Heat dissipation device having a back plate unit
    • 具有背板单元的散热装置
    • US07903419B2
    • 2011-03-08
    • US11845735
    • 2007-08-27
    • Hao LiJun LongTao Li
    • Hao LiJun LongTao Li
    • H05K7/20H01L23/34F28F7/00
    • H01L23/4093H01L23/40H01L2023/4081H01L2023/4087H01L2924/0002Y10T24/44026Y10T24/44034Y10T24/44556H01L2924/00
    • A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.
    • 一种用于从安装在印刷电路板(10)上的电子部件(12)散热的散热装置,包括搁置在印刷电路板上的保持模块(30),设置在保持模块上的散热片(20) 电子部件,用于将散热器固定到保持模块的夹子(40),以及安装在印刷电路板下方的用于与保持模块接合并支撑电子部件的背板单元。 背板单元包括背板(50),与背板接合的垫圈(62)和夹在垫圈和背板之间的托架(64)。 垫圈具有接触印刷电路板的环形顶面和与背板接触的多个块(6202),由此垫圈可以向电子部件提供足够且均匀的支撑。