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51. 发明申请

US20070079086A1 System for archival storage of data 审中-公开
标题翻译：数据存档系统
公开(公告)号：US20070079086A1
公开(公告)日：2007-04-05
申请号：US11540494
申请日：2006-09-28
申请人： You Wang , Steven Hartung , Kenneth Merry , Thomas Gabrysch
发明人： You Wang , Steven Hartung , Kenneth Merry , Thomas Gabrysch
IPC分类号： G06F12/16
CPC分类号： G06F3/0634 , G06F3/0625 , G06F3/0689 , G06F11/1448 , G06F11/2089 , G06F11/2094 , G06F11/2097 , G06F16/113 , Y02D10/154
摘要： A secondary storage system for maintaining data units transferred from a primary storage system is provided. The secondary storage system includes secondary storage media. Not all of the secondary storage media are powered on at the same time. The secondary storage media includes at least one storage medium that is always in the powered-on mode. Metadata is stored in one or more of at least the one storage medium in the powered-on mode. The metadata includes at least one attribute of a data unit stored in a secondary storage medium that is in the lower power mode of operation than at least the one storage medium that is always in the powered-on mode.
摘要翻译：提供了用于维护从主存储系统传送的数据单元的辅助存储系统。辅助存储系统包括辅助存储介质。并非所有辅助存储介质都同时打开。辅助存储介质包括总是处于通电模式的至少一个存储介质。在加电模式下，元数据被存储在至少一个存储介质中的一个或多个中。元数据包括存储在次要存储介质中的数据单元的至少一个属性，该属性处于处于较低功率操作模式的数据单元，而不是至少一个始终处于通电模式的存储介质。

52. 发明申请

US20050284755A1 Substrate support element for an electrochemical plating cell 失效
标题翻译：用于电化学电镀单元的基板支撑元件
公开(公告)号：US20050284755A1
公开(公告)日：2005-12-29
申请号：US10879668
申请日：2004-06-28
申请人： You Wang , Anzhong Chang , John Dukovic
发明人： You Wang , Anzhong Chang , John Dukovic
IPC分类号： C25D5/00 , C25D7/12 , C25D17/06
CPC分类号： H01L21/6723 , C25D17/001 , C25D17/06
摘要： A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.
摘要翻译：提供了用于电化学电镀系统的接触环。所述接触环包括环形基板支撑构件，从所述基板支撑构件延伸的多个径向定位的导电基板接触销，附接到所述基板支撑构件的环形导电小窃贼元件以及与所述基板支撑构件电连接的至少一个电力源触针和导电小窃贼元件。

53. 发明申请

US20050145499A1 Plating of a thin metal seed layer 审中-公开
标题翻译：电镀薄金属种子层
公开(公告)号：US20050145499A1
公开(公告)日：2005-07-07
申请号：US11072473
申请日：2005-03-03
申请人： Nicolay Kovarsky , You Wang , John Dukovic , Ivan Rodriguez
发明人： Nicolay Kovarsky , You Wang , John Dukovic , Ivan Rodriguez
IPC分类号： C25D5/18
CPC分类号： C25D17/10 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/007 , H01L21/2885 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： A method and apparatus for plating a metal layer onto a substrate is provided. The plating apparatus includes two or more segments of an anode and an auxiliary electrode. The plating method includes a first stage of plating a thin metal seed uniformly in the center of the substrate and near the edges of the substrate before metal gap filling and bulk metal plating are performed. The thin metal seed is plated on the substrate surface by applying a current pulse provided by a first power supply and a second power supply which are in electrical communication in reverse polarity with one segment of the anode and the auxiliary electrode. Thereafter, gap filling of features is performed by applying a second current pulse where current is provided to all segments of the anode.
摘要翻译：提供了一种用于将金属层电镀到基底上的方法和装置。电镀装置包括阳极和辅助电极的两个或更多个区段。电镀方法包括在执行金属间隙填充和块状金属电镀之前，在基板的中心和基板的边缘附近均匀地电镀薄金属种子的第一阶段。通过施加由与阳极和辅助电极的一个部分相反极性电连通的第一电源和第二电源提供的电流脉冲，将薄金属种子电镀在基板表面上。此后，通过施加第二电流脉冲来执行特征的间隙填充，其中电流被提供给阳极的所有段。

54. 发明授权

US06490146B2 Electrostatic chuck bonded to base with a bond layer and method 失效
公开(公告)号：US06490146B2
公开(公告)日：2002-12-03
申请号：US09929806
申请日：2001-08-13
申请人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
发明人： You Wang , Shamouil Shamouilian , Arnold Kholodenko , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Wing L. Cheng , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： C04B37/026 , C04B37/006 , C04B37/021 , C04B2237/121 , C04B2237/122 , C04B2237/123 , C04B2237/124 , C04B2237/341 , C04B2237/343 , C04B2237/348 , C04B2237/36 , C04B2237/365 , C04B2237/366 , C04B2237/368 , C04B2237/401 , C04B2237/402 , C04B2237/403 , C04B2237/406 , C04B2237/407 , C04B2237/61 , C04B2237/62 , C04B2237/64 , C04B2237/74 , H01L21/6831 , H01L21/6833
摘要： An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.

55. 发明授权

US5194138A Method for creating a corrosion-resistant aluminum surface 失效
标题翻译：制造耐腐蚀铝表面的方法
公开(公告)号：US5194138A
公开(公告)日：1993-03-16
申请号：US556109
申请日：1990-07-20
申请人： Florian B. Mansfeld , Hong Shih , You Wang
发明人： Florian B. Mansfeld , Hong Shih , You Wang
IPC分类号： C23C22/56
CPC分类号： C23C22/56
摘要： A method for treating the surface of an aluminum-based material so as to make the surface resistant to corrosion includes the steps of contacting the surface with an aqueous cerium non-halide solution and then contacting the surface with an aqueous cerium halide solution. These steps may optionally be followed by a step of positively charging the metal surface while in contact with an aqueous molybdenum solution.
摘要翻译：用于处理铝基材料的表面以使表面耐腐蚀的方法包括使表面与无水卤化铈水溶液接触，然后使表面与卤化铈水溶液接触的步骤。这些步骤可以任选地在与钼水溶液接触的同时对金属表面进行正电充电的步骤。

56. 发明授权

US09073169B2 Feedback control of polishing using optical detection of clearance 有权
标题翻译：使用光学检测间隙的抛光反馈控制
公开(公告)号：US09073169B2
公开(公告)日：2015-07-07
申请号：US13223159
申请日：2011-08-31
申请人： Kun Xu , Ingemar Carlsson , Feng Q. Liu , David Maxwell Gage , You Wang , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Pierre Fontarensky , Wen-Chiang Tu , Lakshmanan Karuppiah
发明人： Kun Xu , Ingemar Carlsson , Feng Q. Liu , David Maxwell Gage , You Wang , Dominic J. Benvegnu , Boguslaw A. Swedek , Yuchun Wang , Pierre Fontarensky , Wen-Chiang Tu , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00 , B24B37/005 , B24B37/04 , B24B37/10 , B24B37/30 , B24B49/12 , G01B11/06
CPC分类号： B24B37/005 , B24B37/042 , B24B37/107 , B24B37/30 , B24B49/12 , G01B11/0683
摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.
摘要翻译：控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。在抛光期间，用原位监测系统监测基底以产生测量序列。测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。使用至少一个调整的抛光压力来抛光第二基底。

57. 发明申请

US20140221662A1 INTERMEDIATE COMPOUNDS OF TAMIFLU, METHODS OF PREPARATION AND USES THEREOF 有权
标题翻译： TAMIFLU的中间体化合物，其制备方法及其用途
公开(公告)号：US20140221662A1
公开(公告)日：2014-08-07
申请号：US14123870
申请日：2010-12-17
申请人： Dawei Ma , Shaolin Zhu , Shouyun Yu , You Wang , Qianghui Zhou
发明人： Dawei Ma , Shaolin Zhu , Shouyun Yu , You Wang , Qianghui Zhou
IPC分类号： C07C319/12 , C07D207/14 , C07D213/73 , C07C227/16 , C07C229/66 , C07C227/14
CPC分类号： C07C319/12 , C07B2200/07 , C07C227/14 , C07C227/16 , C07C229/66 , C07C233/31 , C07C271/18 , C07C323/61 , C07C2601/14 , C07C2601/16 , C07D207/14 , C07D209/48 , C07D213/73 , C07D401/04 , C07D403/04
摘要： Chiral amino compounds, methods of preparation and uses thereof. Tamiflu can be obtained from the said compounds. Multi-substituted chiral tetrahydropyrrolyl amine which can be used as intermediate compounds of medicament can also be produced by the said compounds.
摘要翻译：手性氨基化合物，其制备方法及其应用。可以从所述化合物获得达菲。可以用作药物的中间体化合物的多取代手性四氢吡咯胺也可以由所述化合物制备。

58. 发明申请

US20130189843A1 SLURRY FOR PLANARIZING PHOTORESIST 审中-公开
标题翻译：用于平面化光刻胶的浆料
公开(公告)号：US20130189843A1
公开(公告)日：2013-07-25
申请号：US13747825
申请日：2013-01-23
申请人： You Wang , Wen-Chiang Tu , Lakshmanan Karuppiah , Yufei Chen
发明人： You Wang , Wen-Chiang Tu , Lakshmanan Karuppiah , Yufei Chen
IPC分类号： H01L21/306
CPC分类号： H01L21/30625 , C09G1/02 , H01L21/31058
摘要： A slurry for planarization of a photoresist includes abrasive particles, an oxidizer, a surface activation chemical, and a solvent.
摘要翻译：用于平版化光致抗蚀剂的浆料包括磨料颗粒，氧化剂，表面活化化学品和溶剂。

59. 发明申请

US20130186850A1 SLURRY FOR COBALT APPLICATIONS 审中-公开
标题翻译：浆料应用
公开(公告)号：US20130186850A1
公开(公告)日：2013-07-25
申请号：US13357535
申请日：2012-01-24
申请人： You Wang , Chenhao Ge , Yufei Chen , Yuchun Wang , Wen-Chiang Tu , Lakshmanan Karuppiah
发明人： You Wang , Chenhao Ge , Yufei Chen , Yuchun Wang , Wen-Chiang Tu , Lakshmanan Karuppiah
IPC分类号： C09K13/00 , C09K13/02 , H05K3/26
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/3212 , H01L23/53238 , H01L23/53257 , H01L2924/0002 , H05K3/045 , H05K3/107 , H01L2924/00
摘要： A slurry for chemical mechanical of a cobalt layer or a conductive layer over a cobalt layer includes abrasive particles, an organic complexing compound for Cu or Co ion complexion, a Co corrosion inhibitor that is 0.01-1.0 wt % of the slurry, an oxidizer, and a solvent. The slurry has a pH of 7-12.
摘要翻译：用于钴层或钴层上的导电层的化学机械的浆料包括磨料颗粒，用于Cu或Co离子表面的有机络合化合物，作为浆料的0.01-1.0重量％的Co腐蚀抑制剂，氧化剂，和溶剂。浆液的pH为7-12。

60. 发明授权

US08403226B2 Chip card holder 失效
标题翻译：芯片卡座
公开(公告)号：US08403226B2
公开(公告)日：2013-03-26
申请号：US12850720
申请日：2010-08-05
申请人： You Wang
发明人： You Wang
IPC分类号： G06K7/00 , G06K7/08 , G06K19/00 , H04M1/00 , H05K1/14
CPC分类号： G06K7/0021
摘要： An exemplary chip card holder for holding a chip card includes a base member, a card receiving frame and a cover. The card receiving frame is mounted on the base member and defines an accommodating space for receiving the chip card therein. The accommodating space has an inserting opening for inserting the chip card into and removing the chip card out from the accommodating space. The cover includes a resisting block protruding therefrom. The cover is detachably latched to the base member in such a way that the resisting block is aligned with the inserting opening and located adjacent to an end of the chip card to hold the chip card within the accommodating space.
摘要翻译：用于保持芯片卡的示例性芯片卡保持器包括基座构件，卡片接收框架和盖子。卡接收框架安装在基座构件上并且限定用于在其中接收芯片卡的容纳空间。容纳空间具有插入开口，用于将芯片卡插入存放空间中并将其从芯片卡中取出。盖子包括从其突出的抵抗块。盖子可拆卸地锁定到基座构件上，使得抵抗块与插入口对准并且位于与芯片卡的一端相邻并且将芯片卡保持在容纳空间内。

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