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51. 外观设计

USD267351S Electric light 失效
公开(公告)号：USD267351S
公开(公告)日：1982-12-21
申请号：US161566
申请日：1980-06-20
申请人： Yoshikazu Suzuki
设计人： Yoshikazu Suzuki

52. 发明授权

US09059145B2 Power module, method for manufacturing power module, and molding die 有权
标题翻译：电源模块，电源模块制造方法和成型模具
公开(公告)号：US09059145B2
公开(公告)日：2015-06-16
申请号：US13590707
申请日：2012-08-21
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H05K7/20 , H01L23/433 , H01L23/051 , H01L25/07 , H01L23/473 , H01L23/31 , H01L21/56
CPC分类号： H01L23/4334 , H01L21/565 , H01L23/051 , H01L23/3107 , H01L25/071 , H01L2224/33 , H01L2924/0002 , H01L2924/181 , Y10T29/49002 , H01L2924/00 , H01L2924/00012
摘要： A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.
摘要翻译：公开了一种功率模块，其包括半导体元件，第一冷却构件和被配置为将半导体元件夹在其间的第二冷却构件，构造成将半导体元件支撑在第一冷却构件和第二冷却构件之间的框架构件和模制树脂设置在第一冷却构件和第二冷却构件之间，其中框架构件包括调节构件，其调节第一冷却构件和第二冷却构件之间的距离。

53. 发明授权

US09014536B2 Content data transmission system and content data transmission method 有权
标题翻译：内容数据传输系统和内容数据传输方式
公开(公告)号：US09014536B2
公开(公告)日：2015-04-21
申请号：US14235880
申请日：2012-07-27
申请人： Yoshikazu Suzuki
发明人： Yoshikazu Suzuki
IPC分类号： H04N5/932 , H04N5/765 , G11B20/10 , H04N21/43 , H04N21/432 , H04N21/4363 , H04N5/04
CPC分类号： H04N5/765 , G11B20/10009 , G11B20/10222 , H04N5/04 , H04N5/76 , H04N21/4307 , H04N21/4325 , H04N21/43632
摘要： [Problem] In a system for transmitting content data from a content reproducing apparatus to a content output apparatus, no complicated signal processing is required, setting change operations can be simplified, and the degradation of sound quality and the degradation of picture quality of video data are prevented. [Solution] There are included: a content reproducing apparatus that receives an operation clock signal from a content output apparatus via an operation clock transmission cable, operates on the basis of the operation clock signal, and transmits content data, which has been reproduced by a reproducing unit, to the content output apparatus via a multimedia transmission cable; and the content output apparatus that generates, on the basis of an output apparatus operation clock signal, the operation clock signal to be transmitted to the content reproducing apparatus, transmits the operation clock signal to the content reproducing apparatus reproducing apparatus via the operation clock transmission cable, receives the content data from the content reproducing apparatus via the multimedia transmission cable, and performs a signal processing of the received content data for output to an external apparatus.
摘要翻译：在从内容再现装置向内容输出装置发送内容数据的系统中，不需要复杂的信号处理，能够简化设定变更动作，声音质量下降，视频数据的图像质量下降被阻止 [解决方案]包括：经由操作时钟传输电缆从内容输出装置接收操作时钟信号的内容再现装置，基于操作时钟信号进行操作，并发送已被再现单元经由多媒体传输电缆连接到内容输出设备; 以及内容输出装置，其基于输出装置操作时钟信号生成要发送到内容再现装置的操作时钟信号，经由操作时钟传输电缆将操作时钟信号发送到内容再现装置再现装置经由多媒体传输电缆从内容再现装置接收内容数据，并且对接收的内容数据执行信号处理以输出到外部设备。

54. 发明授权

US08878347B2 Power module 有权
标题翻译：电源模块
公开(公告)号：US08878347B2
公开(公告)日：2014-11-04
申请号：US14117165
申请日：2011-05-16
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Takanori Kawashima
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Takanori Kawashima
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L21/565 , H01L23/3107 , H01L23/492 , H01L23/49524 , H01L23/49562 , H01L24/33 , H01L24/45 , H01L25/18 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/4917 , H01L2224/73265 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A power module configured to arrange a first electrode on a surface of which a first switching device is bonded, a second electrode on a surface of which a second switching device is bonded, and a third electrode by stacking the first electrode, the first switching device, the second electrode, the second switching device, and the third electrode in this order from the bottom in a stacking direction, characterized by first through third electrode pieces each connected to the first through third electrodes, first and second signal lines each connected to the first and second switching devices, wherein the first through third electrode pieces and the first and second signal lines are provided extending outward in the same plane as the second electrode.
摘要翻译：一种电源模块，被配置为在其表面上结合有第一开关装置的第一电极，在其表面上接合第二开关装置的第二电极和通过堆叠所述第一电极的第三电极，所述第一开关装置，第二电极，第二开关器件和第三电极，从堆叠方向的底部开始，其特征在于，第一至第三电极片分别连接到第一至第三电极，第一和第二信号线各自连接到第一和第二开关器件，其中第一至第三电极片以及第一和第二信号线设置在与第二电极相同的平面内向外延伸。

55. 发明授权

US08810026B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US08810026B2
公开(公告)日：2014-08-19
申请号：US13819221
申请日：2010-09-02
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/36 , H01L23/4006 , H01L23/4334 , H01L23/473 , H01L23/49537 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L25/115 , H01L25/117 , H01L2224/29099 , H01L2224/30181 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40247 , H01L2224/45124 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73215 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/01013 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor module which includes a semiconductor device; a wiring member that is connected to the semiconductor device; a cooling plate that includes a first surface on a side of the semiconductor device and a second surface on a side opposite to the first surface and has a fastening portion at an end thereof in a first direction; and a molded portion that is formed by molding a resin on the semiconductor device, the wiring member and the cooling plate, wherein the fastening portion is exposed out of the molded portion, and a terminal portion of the wiring member is exposed out of the molded portion such that the terminal portion of the wiring member extends in a second direction which is substantially perpendicular to the first direction.
摘要翻译：一种半导体模块，包括半导体器件; 连接到所述半导体器件的布线构件; 冷却板，其包括在所述半导体器件的一侧上的第一表面和与所述第一表面相对的一侧上的第二表面，并且在其第一方向的端部具有紧固部分; 以及通过在半导体器件，布线构件和冷却板上模制树脂而形成的模制部分，其中紧固部分从模制部分露出，并且布线构件的端子部分露出模制使得布线构件的端子部分沿着基本上垂直于第一方向的第二方向延伸。

56. 发明申请

US20130154084A1 SEMICONDUCTOR MODULE 有权
标题翻译：半导体模块
公开(公告)号：US20130154084A1
公开(公告)日：2013-06-20
申请号：US13819209
申请日：2010-09-02
申请人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
发明人： Takuya Kadoguchi , Yoshikazu Suzuki , Masaya Kaji , Kiyofumi Nakajima , Tatsuya Miyoshi , Takanori Kawashima , Tomomi Okumura
IPC分类号： H01L23/40
CPC分类号： H01L23/40 , G01N29/07 , G01N2291/044 , G01N2291/2697 , H01L23/3121 , H01L23/3735 , H01L23/4006 , H01L23/4334 , H01L23/473 , H01L23/49548 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/371 , H01L2224/40095 , H01L2224/40225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01029 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a semiconductor device; a metal plate portion that includes a first surface on a side of the semiconductor device and has a fastening portion at an end thereof; a molded portion that is formed by molding a resin on the semiconductor device and the metal plate portion, a cooling plate portion that is a separate member from the metal plate portion, is provided on a side opposite to the first surface on the side of the semiconductor device, and includes fins on a side opposite to the side of the metal plate portion; wherein the fastening portion of the metal plate portion is exposed out of the molded portion, and the cooling plate portion includes a fastening portion at a position that corresponds to a position of the fastening portion of the metal plate portion.
摘要翻译：半导体模块包括半导体器件; 金属板部，其包括在半导体器件的一侧上的第一表面，并且在其端部具有紧固部分; 通过在半导体器件和金属板部分上模制树脂而形成的模制部分，作为与金属板部分分离的部件的冷却板部分设置在与金属板部分的侧面上的第一表面相对的一侧上半导体器件，并且在与金属板部分的侧面相对的一侧包括翅片; 其特征在于，所述金属板部的所述固定部从所述模制部露出，所述冷却板部在与所述金属板部的所述固定部的位置对应的位置包括紧固部。

57. 发明授权

US08100068B2 Threader of sewing machine 有权
标题翻译：缝纫机穿线机
公开(公告)号：US08100068B2
公开(公告)日：2012-01-24
申请号：US12524155
申请日：2007-11-13
申请人： Yoshikazu Suzuki
发明人： Yoshikazu Suzuki
IPC分类号： D05B87/02
CPC分类号： D05B87/02 , D05D2205/02
摘要： The present invention provides a threader of a sewing machine in which the entire head portion can be made compact and the operator can perform threading work with one hand. The threader comprises: a threading shaft approaching a needle bar for moving a supporting sewing needle vertically; a threading hook for moving a hook portion in and out of a needle hole; a positioning member for regulating a lowermost position of the threading shaft to a position where the height of the hook portion matches that of the needle hole; a first rotary mechanism for rotating by a predetermined angle near the lowermost point of the threading shaft so that the hook portion is inserted into the needle hole of the sewing needle; and a thread-guiding member for guiding the top thread to the hook portion at a near lowermost point of the threading shaft. The threader further comprises a second rotary mechanism for rotating by a predetermined angle so that a thread-catching portion of the thread-guiding member passes through the position of the needle hole of the sewing needle at a near lowermost point of the threading shaft, and the first rotary mechanism and the second rotary mechanism rotate the threading hook and the thread-guiding member in opposite directions.
摘要翻译：本发明提供了一种缝纫机的穿线机，其中整个头部部分可以制造得紧凑，并且操作者可以用一只手进行螺纹加工。穿线器包括：接近针杆的穿线轴，用于垂直移动支撑缝纫针; 用于将钩部移入和移出针孔的螺纹钩; 定位构件，用于将所述穿线轴的最下位置调节到所述钩部的高度与所述针孔的高度相匹配的位置; 第一旋转机构，用于在穿线轴的最下点附近旋转预定角度，使得钩部插入到缝纫针的针孔中; 以及用于在所述穿线轴的最接近的最低点处将所述顶线引导到所述钩部的线引导构件。穿线器进一步包括第二旋转机构，用于以预定角度旋转，使得导纱件的止线部分在穿刺轴的最接近的最低点穿过缝纫针的针孔的位置，并且第一旋转机构和第二旋转机构沿相反方向旋转穿线钩和导纱构件。

58. 发明授权

US07617583B2 Method for producing hot-dip coated metal belt 有权
公开(公告)号：US07617583B2
公开(公告)日：2009-11-17
申请号：US10508375
申请日：2003-09-09
申请人： Hideyuki Takahashi , Yoshikazu Suzuki , Munehiro Ishioka , Fumio Fujita , Yoichi Miyakawa , Akira Gamou , Kazuhisa Kabeya
发明人： Hideyuki Takahashi , Yoshikazu Suzuki , Munehiro Ishioka , Fumio Fujita , Yoichi Miyakawa , Akira Gamou , Kazuhisa Kabeya
IPC分类号： B23P25/00 , B21B1/00
CPC分类号： C23C2/40 , C21D8/0278 , C21D9/564 , C23C2/02 , Y10T29/49885 , Y10T29/49982 , Y10T29/49986 , Y10T29/49991
摘要： The invention provides a method for producing a hot-dip plated metal strip comprising the steps of: annealing a metal strip; imparting plastic strain to the metal strip; drawing the metal strip into a molten metal bath for plating; drawing up the metal strip out of the molten metal bath without contacting the molten metal with a roll in the molten metal bath after turning around the metal strip upward with adhering the molten metal on the metal strip; and controlling the coating weight of the molten metal adhered on the metal strip with a wiper. According to the method of the invention, a hot-dip plated metal strip can be produced, in which buckling does not occur, lateral evenness of coating weight is excellent, and dross defects are few.

59. 发明申请

US20090068865A1 Case with Connector and Manufacturing Method Thereof 有权
标题翻译：连接器及其制造方法的案例
公开(公告)号：US20090068865A1
公开(公告)日：2009-03-12
申请号：US12087544
申请日：2007-03-01
申请人： Yoshikazu Suzuki , Akira Ishimaru , Tomokiyo Suzuki , Hironao Hayashi , Shigeru Hayashida , Osamu Kuriyagawa , Iori Kobayashi , Kensuke Nakanishi , Toru Takahashi , Yuki Yamakawa , Masanori Sumida
发明人： Yoshikazu Suzuki , Akira Ishimaru , Tomokiyo Suzuki , Hironao Hayashi , Shigeru Hayashida , Osamu Kuriyagawa , Iori Kobayashi , Kensuke Nakanishi , Toru Takahashi , Yuki Yamakawa , Masanori Sumida
IPC分类号： H01R4/66 , B23P17/04
CPC分类号： H01R13/6597 , H01R24/68 , H01R43/24 , H01R2103/00 , Y10T29/49
摘要： A case with a connector integrally formed with a resin connector, and can be manufactured with a small number of processes is provided. The connector case includes a housing, a resin connector, and a ground terminal extending along an outer periphery of the connector. A terminal-side fixing portion extending backward from the ground terminal is crimped to or pressed over a housing-side fixing portion. When molds are closed after the housing and the ground terminal are placed in the molds for injection molding of the resin connector, a pressing portion formed on the mold presses the terminal-side fixing portion against the housing-side fixing portion to crimp or press the terminal-side fixing portion to or over the housing-side fixing portion. As a result, in the process for the injection molding of the connector, the ground terminal is fixed to the housing at the same time. The connector case with the ground terminal fixed to the housing can be manufactured in a small number of processes.
摘要翻译：具有与树脂连接器一体形成的连接器的壳体，并且可以以少量的工艺制造。连接器壳体包括壳体，树脂连接器和沿着连接器的外周延伸的接地端子。从接地端子向后延伸的端子侧固定部分被压接或挤压在壳体侧固定部分上。在壳体和接地端子被放置在用于树脂连接器的注射成型的模具中之后，当模具关闭时，形成在模具上的按压部分将端子侧固定部分压靠在壳体侧固定部分上以压紧或按压端子侧固定部分到壳体侧固定部分上方或上方。结果，在连接器的注射成型的过程中，接地端子同时固定到壳体。具有固定到壳体的接地端子的连接器壳体可以以少量的工艺制造。

60. 发明授权

US07485374B2 Heat exchanger and fin material for the heat exchanger 有权
标题翻译：用于热交换器的热交换器和翅片材料
公开(公告)号：US07485374B2
公开(公告)日：2009-02-03
申请号：US11336272
申请日：2006-01-20
申请人： Yoshikazu Suzuki , Nobuyuki Kakimoto , Junji Ninomiya , Yoshiyuki Oya
发明人： Yoshikazu Suzuki , Nobuyuki Kakimoto , Junji Ninomiya , Yoshiyuki Oya
IPC分类号： B32B15/20
CPC分类号： F28F21/084 , Y10S165/905 , Y10T428/12764
摘要： A heat exchanger which has i) a fin material comprising a triple-layer clad material constituted of a core material composed of an aluminum alloy containing from 0.5 to 1.8% by weight of Mn and from 0.5 to 3.0% by weight of Zn and, provided on both sides of the core material, a brazing filler material composed of an Al—Si alloy containing from 6.5 to 13.0% by weight of Si and from 0.15 to 0.60% by weight of Cu and ii) an aluminum alloy tube having a Zn concentrated surface; the both having been brazed with each other; wherein, after brazing, recrystallized grains of the core material have an average length of from 100 to 1,000 μm in the lengthwise section of a fin and the recrystallized grains of the core material are 4 or less in average number in the thickness direction of that lengthwise section. This heat exchanger is improved in the durability of fin joints and fins themselves and their strength after corrosion.
摘要翻译：一种热交换器，其具有包括由包含0.5〜1.8重量％的Mn和0.5〜3.0重量％的Zn的铝合金构成的芯材构成的三层包覆材料的翅片材料，在芯材的两侧，由含有6.5〜13.0重量％的Si和0.15〜0.60重量％的Cu的Al-Si合金构成的钎料，以及ii）具有Zn浓缩的铝合金管表面; 两者相互钎焊; 其中，在钎焊后，芯材的再结晶晶粒在翅片的长度方向上的平均长度为100〜1000μm，芯材的再结晶晶粒的长度方向的平均数为4个以下部分。该热交换器改善了翅片接头和翅片本身的耐久性及其腐蚀后的强度。

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