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    • 52. 发明授权
    • SOI Semiconductor devices
    • SOI半导体器件
    • US5841171A
    • 1998-11-24
    • US746951
    • 1996-11-18
    • Toshiaki IwamatsuTakashi IpposhiYasuo Inoue
    • Toshiaki IwamatsuTakashi IpposhiYasuo Inoue
    • H01L21/316H01L21/76H01L21/762H01L21/84H01L27/12H01L29/786H01L29/00
    • H01L21/84H01L27/1203H01L29/78609H01L29/78654
    • In forming an element isolating region in a silicon semiconductor layer of an SOI substrate, a silicon nitride film of a predetermined thickness is deposited over an oxide film formed on a SOI layer. The silicon nitride film is patterned in a design size of active regions, and side walls of a silicon nitride film are formed on the side surfaces of the patterned silicon nitride film. A first LOCOS process is carried out using the nitride film as an oxidation mask. A LOCOS film formed by the first LOCOS process is removed to form narrower concavities under the side walls. Then, another silicon nitride film is deposited, and is removed leaving portions thereof forming the concavities. Then, a second LOCOS process is carried out to form a LOCOS film as an element isolating region. The second LOCOS process uses the oxidation mask having the narrow cavities, so that stress at the boundary of the active region and the element isolation region is reduced, and the growth of bird's beaks can be suppressed.
    • 在形成SOI衬底的硅半导体层中的元件隔离区域时,在形成于SOI层上的氧化物膜上沉积预定厚度的氮化硅膜。 以活性区域的设计尺寸对氮化硅膜进行构图,并且在图案化的氮化硅膜的侧表面上形成氮化硅膜的侧壁。 使用氮化物膜作为氧化掩模进行第一LOCOS工艺。 去除由第一LOCOS工艺形成的LOCOS膜,以在侧壁下形成更窄的凹面。 然后,沉积另一个氮化硅膜,并除去形成凹部的部分。 然后,进行第二LOCOS工艺以形成LOCOS膜作为元件隔离区。 第二LOCOS工艺使用具有窄腔的氧化掩模,使得有源区域和元件隔离区域的边界处的应力减小,并且可以抑制鸟喙的生长。
    • 53. 发明授权
    • Device having a high concentration region under the channel
    • 在通道下具有高浓度区域的奇偶装置
    • US5641980A
    • 1997-06-24
    • US557558
    • 1995-11-14
    • Yasuo YamaguchiHans-Oliver JoachimYasuo Inoue
    • Yasuo YamaguchiHans-Oliver JoachimYasuo Inoue
    • H01L29/40H01L21/336H01L27/12H01L29/417H01L29/78H01L29/786
    • H01L29/66757H01L27/1203H01L29/78606H01L29/78609H01L29/78621
    • It is an object to obtain a semiconductor device with the LDD structure having both operational stability and high speed and a manufacturing method thereof. A high concentration region (11) with boron of about 1.times.10.sup.18 /cm.sup.3 introduced therein is formed extending from under a channel formation region (4) to under a drain region (6) and a source region (6') in a silicon substrate (1). The high concentration region (11) is formed in the surface of the silicon substrate (1) under the channel formation region (4), and is formed at a predetermined depth from the surface of the silicon substrate (1) under the drain region (6) and the source region (6'). A low concentration region (10) is formed in the surface of the silicon substrate (1) under the drain region (6) and the source region (6'). The formation of the high concentration region only in the surface of the semiconductor substrate under the channel formation region surely suppresses an increase in the leakage current and an increase in the drain capacitance.
    • 本发明的目的是获得具有操作稳定性和高速度的LDD结构的半导体器件及其制造方法。 导入其中引入了约1×10 18 / cm 3的硼的高浓度区域(11)形成在沟道形成区域(4)下方延伸到漏极区域(6)下方的硅衬底(1)中的源极区域(6') )。 在硅衬底(1)的沟道形成区域(4)的表面上形成高浓度区域(11),并且形成在与硅衬底(1)的漏极区域 6)和源极区(6')。 在漏极区域(6)和源极区域(6')的下方的硅衬底(1)的表面中形成低浓度区域(10)。 仅在沟道形成区域的半导体衬底的表面形成高浓度区域确实地抑制了漏电流的增加和漏极电容的增加。
    • 54. 发明授权
    • Storage controller and bus control method for use therewith
    • 存储控制器和总线控制方法
    • US5640600A
    • 1997-06-17
    • US381560
    • 1995-01-31
    • Takao SatohHisaharu TakeuchiYasuo InoueAkira Yamamoto
    • Takao SatohHisaharu TakeuchiYasuo InoueAkira Yamamoto
    • G06F13/16G06F3/06G06F11/34G06F13/12G06F13/36H01J3/00
    • G06F13/124G06F11/349G06F11/3409G06F2201/88G06F2201/885
    • A storage controller comprising a storage device adapter, a channel adapter, a cache memory, a control memory, and a plurality of buses connecting therebetween. The channel adapter communicates with a processor and processes input/output requests issued by the processor. The storage device adapter controls a storage device and data transfer between the storage device and the cache memory. The channel adapter and the storage device adapter exchanges control information via the control memory. The buses are used to transfer the data and the control information between the cache memory and the control memory, and the channel adapter and the storage device adapter. The controller also comprises bus load estimating means and bus mode selecting means. The bus load estimating means estimates bus load characteristics as an index based on the amount of data transfer during sequential access to the storage device. The bus mode selecting means determines a bus mode of bus utilization based on the index. Each of the channel adapter and the storage device adapter has bus access means for accessing the buses in accordance with the bus mode selected by the bus mode selecting means.
    • 存储控制器,包括存储设备适配器,信道适配器,高速缓冲存储器,控制存储器以及连接在它们之间的多个总线。 信道适配器与处理器通信并处理由处理器发出的输入/输出请求。 存储设备适配器控制存储设备和存储设备与高速缓冲存储器之间的数据传输。 通道适配器和存储设备适配器通过控制存储器交换控制信息。 总线用于将数据和控制信息传输到缓存存储器和控制存储器之间,以及通道适配器和存储设备适配器。 控制器还包括总线负载估计装置和总线模式选择装置。 总线负载估计装置基于在顺序访问存储设备期间的数据传输量来估计总线负载特性作为索引。 总线模式选择装置根据该索引确定总线利用的总线模式。 每个通道适配器和存储设备适配器具有总线访问装置,用于根据由总线模式选择装置选择的总线模式访问总线。
    • 58. 发明授权
    • Stacked semiconductor device
    • 堆叠半导体器件
    • US5128732A
    • 1992-07-07
    • US199439
    • 1988-05-27
    • Kazuyuki SugaharaTadashi NishimuraShigeru KusunokiYasuo InoueYasuo Yamaguchi
    • Kazuyuki SugaharaTadashi NishimuraShigeru KusunokiYasuo InoueYasuo Yamaguchi
    • H01L27/06
    • H01L27/0688
    • A stacked semiconductor device has three-dimensional alternate layers of iconductor elements and insulating layers each electrically insulating the adjacent upper and lower layers of semiconductor elements, formed on a single crystal semiconductor substrate. A semiconductor is deposited in openings formed respectively in the insulating layers to form single crystal semiconductor layers each having the same crystal axis as the single crystal semiconductor substrate respectively over the insulating layers, and semiconductor elements are formed respectively in a plurality of layers. The opening formed through the upper insulating layer reaches the lower layer of the semiconductor element immediately below the same upper insulating layer, and is formed at a position spaced apart horizontally from the opening formed through the lower insulating layer immediately below the same upper insulating layer. A semiconductor for forming the upper layer of a semiconductor having the same crystal axis as the lower layer of a semiconductor is deposited in the opening of the upper insulating layer so that satisfactory lateral epitaxial growth will occur over the insulating layer.
    • 叠层半导体器件具有三维交替层的半导体元件和绝缘层,每个绝缘层将形成在单晶半导体衬底上的相邻的半导体元件的上层和下层电绝缘。 分别在绝缘层中形成的开口中沉积半导体,以形成分别在绝缘层上分别与单晶半导体衬底相同的晶轴的单晶半导体层,并分别形成多个半导体元件。 通过上绝缘层形成的开口到达同一上绝缘层正下方的半导体元件的下层,并形成在与通过同一上绝缘层正下方的下绝缘层形成的开口水平间隔开的位置处。 用于形成具有与半导体的下层相同的晶轴的半导体的上层的半导体被沉积在上绝缘层的开口中,使得在绝缘层上将发生令人满意的横向外延生长。
    • 59. 发明授权
    • Digital signal recording and playback apparatus
    • 数字信号记录和播放装置
    • US5083225A
    • 1992-01-21
    • US310530
    • 1989-02-15
    • Kazuhiko MorisakiYasuo Inoue
    • Kazuhiko MorisakiYasuo Inoue
    • G11B5/09G11B5/008G11B5/53G11B15/12G11B15/18G11B15/467G11B27/032
    • G11B5/0086G11B15/125G11B15/1875G11B15/4671G11B27/032G11B5/534G11B2220/90G11B2220/913
    • A digital signal recording and playback apparatus having a rotary heads mounted on a rotary drum capable of recording/reproducing a digital signal onto/from a magnetic tape at a tape speed which is N times as much as the standard speed while conforming to the standard track angle and length. The number of the rotary heads are increased from the standard two heads whereas the drum speed is made one half of N times standard speed and the drum diameter is made slightly larger from the standard so that the relative speed between the running tape and the rotating heads becomes equal to the standard in the double tape speed mode, and becomes twice that in the quadruple tape speed mode. Alternatively, the tape is wound around the drum having two heads, over the angular range of 180 degrees instead of the standard 90 degrees, the drum diameter is made smaller than the standard, and the drum speed is N times the standard so that the relative speed of the heads becomes equal to the standard in the double tape speed mode.
    • 一种数字信号记录和重放装置,其具有安装在旋转磁鼓上的旋转磁头,其能够以符合标准磁道的标准速度的N倍的磁带速度将数字信号记录到磁带上/从磁带重放数字信号 角度和长度。 旋转头的数量从标准的两个头增加,而鼓速度是标准速度的N倍的一半,并且鼓的直径从标准形成为稍大,使得行走带和旋转头之间的相对速度 变为双带速度模式中的标准,并且变为四倍速带速度模式下的两倍。 或者,磁带卷绕在具有两个磁头的磁鼓上,角度范围为180度,而不是标准90度,磁鼓直径小于标准,鼓速度是标准的N倍,使得相对 磁头速度等于双磁带速度模式下的标准。
    • 60. 发明授权
    • Multiple layer static random access memory device
    • 多层静态随机存取存储器件
    • US5001539A
    • 1991-03-19
    • US337702
    • 1989-04-13
    • Yasuo InoueTadashi Nishimura
    • Yasuo InoueTadashi Nishimura
    • G11C11/412H01L21/8244H01L27/00H01L27/06H01L27/11
    • H01L27/1104H01L27/0688H01L27/1108Y10S257/903
    • A stacked static random access memory SRAM having a plurality of memory cells is disclosed. Individual memory cell has a portion formed in an upper active element layer in the device structure and a portion formed in a lower active element layer in the device structure separated from the upper layer by an intermediate insulating layer. A word line, a bit line and access transistors are formed in the same upper active element layer, eliminating the need for interconnecting them through the insulating layer. The elimination of the inter-layer connections helps to reduce the number of through-holes required to be made in the insulating layer. This in turn reduces the area to be occupied by the memory cell and leads to a simplified manufacturing process of the SRAM.
    • 公开了一种具有多个存储单元的堆叠静态随机存取存储器SRAM。 单个存储单元具有形成在器件结构中的上有源元件层中的部分,以及通过中间绝缘层与器件结构中的下有源元件层中形成的部分形成在上层中的部分。 在相同的上部有源元件层中形成字线,位线和存取晶体管,消除了通过绝缘层将它们互连的需要。 层间连接的消除有助于减少在绝缘层中制造的通孔的数量。 这又减少了由存储器单元占用的面积,并导致了SRAM的简化制造过程。