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51. 发明授权

US07061100B2 Semiconductor built-in millimeter-wave band module 有权
标题翻译：半导体内置毫米波段模块
公开(公告)号：US07061100B2
公开(公告)日：2006-06-13
申请号：US10405524
申请日：2003-04-02
申请人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
发明人： Hideki Iwaki , Yutaka Taguchi , Tetsuyosi Ogura , Yasuhiro Sugaya , Toshiyuki Asahi , Tousaku Nishiyama , Yoshinobu Idogawa
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/66 , H01L21/481 , H01L21/56 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/162 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/1305 , H01L2924/14 , H01L2924/1423 , H01L2924/1532 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/20752
摘要： A semiconductor built-in millimeter-wave band module includes: an insulating substrate made of a mixture containing an inorganic filler and a thermosetting resin; a high thermal conductivity substrate made of a dielectric material having thermal conductivity higher than the insulating substrate and laminated on one surface of the insulating substrate; a plurality of wiring patterns formed on the high thermal conductivity substrate and the insulating substrate; a semiconductor device operating at millimeter-wave band, which is arranged inside of the insulating substrate, is packaged on the high thermal conductivity substrate in a face-up manner, and is connected electrically with the wiring patterns; and a distributed constant circuit element and an active element provided on the semiconductor device. In this module, a void is provided inside of the insulating substrate and in the vicinity of a surface of the distributed constant circuit element and the active element. With this configuration, heat from the semiconductor device operating at a millimeter-wave band can be dissipated effectively and the semiconductor and other circuit components can be packaged with high density.
摘要翻译：半导体内置毫米波段模块包括：绝缘基板，由含有无机填料和热固性树脂的混合物制成; 高导热性衬底，其由具有高于绝缘衬底的导热率的电介质材料制成并且层压在绝缘衬底的一个表面上; 形成在高导热性基板和绝缘基板上的多个布线图案; 布置在绝缘基板内部的以毫米波段工作的半导体器件以面朝上的方式封装在高导热性基板上，并与布线图形电连接; 以及设置在半导体器件上的分布常数电路元件和有源元件。在该模块中，在绝缘基板内部和分布常数电路元件和有源元件的表面附近设置有空隙。利用这种结构，可以有效地消耗来自在毫米波段工作的半导体器件的热量，并可以高密度地封装半导体和其它电路部件。

52. 发明授权

US09730320B2 Prepreg, laminate, metal foil-clad laminate, circuit board and LED module 有权
公开(公告)号：US09730320B2
公开(公告)日：2017-08-08
申请号：US13882126
申请日：2011-10-27
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Naoyuki Tani , Yoshito Kitagawa
IPC分类号： H05K1/03 , C08J5/24 , C08K3/00 , C08K3/22
CPC分类号： H05K1/038 , C08J5/24 , C08K3/013 , C08K3/22 , C08K2003/2217 , C08K2003/2227 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0209 , Y10T442/20 , Y10T442/3415 , Y10T442/3472 , Y10T442/656 , Y10T442/659
摘要： A laminate with superior thermal conductivity, heat resistance, drill workability, and fire retardancy is provided. In a prepreg obtained by impregnating a woven or nonwoven fabric base with a thermosetting resin composition, the thermosetting resin composition contains 80 to 200 parts by volume of an inorganic filler per 100 parts by volume of a thermosetting resin, the inorganic filler contains (A) gibbsite type aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm and (B) magnesium oxide having an average particle diameter (D50) of 0.5 to 15 μm, and a compounding ratio (volume ratio) of the gibbsite type aluminum hydroxide particles (A) to the magnesium oxide (B) is 1:0.3 to 3.

53. 发明申请

US20110125803A1 USABILITY EVALUATION APPARATUS, USABILITY EVALUATION METHOD, AND PROGRAM 审中-公开
标题翻译：可用性评估装置，可用性评估方法和程序
公开(公告)号：US20110125803A1
公开(公告)日：2011-05-26
申请号：US13055716
申请日：2009-07-16
申请人： Toshiyuki Asahi
发明人： Toshiyuki Asahi
IPC分类号： G06F17/30
CPC分类号： G06T11/206
摘要： A usability evaluation apparatus evaluates usability of evaluation objects by evaluation items (201 and 202) that have a hierarchical structure that is divided into a plurality of hierarchies and supplies usability evaluation points (206) that are the evaluation results to an output element. The output element is caused to supply as output a tree map in which are represented rectangular regions that have shapes that accord with degrees of importance (203 and 204) that indicate the relative importance of evaluation items (201 and 202) in the hierarchy and that indicate the evaluation items (201 and 202) such that the hierarchical structure can be distinguished and graphs that indicate the absolute values of usability evaluation points (206) such that the graphs are depicted in rectangular regions (501) that indicate the lowest-level evaluation items on the tree map according to the shape of the rectangular regions (501).
摘要翻译：可用性评价装置通过评价项目（201,202）来评价评价对象的可用性，所述评价项目具有被分成多个层级的层次结构，并将作为评价结果的可用性评价点（206）提供给输出要素。输出元素作为输出提供树形图，其中表示具有符合重要程度（203和204）的形状的矩形区域，其表示评估项目（201和202）在层次中的相对重要性，并且指示评估项目（201和202），使得可以区分分级结构，以及指示可用性评估点（206）的绝对值的图表，使得图形被描绘在指示最低级别评估的矩形区域（501）中根据矩形区域（501）的形状，树图上的项目。

54. 发明授权

US08603624B2 Prepreg, laminate, metal clad laminate, circuit board, and circuit board for LED mounting 有权
标题翻译：预浸料，层压板，金属复合层压板，电路板和LED安装电路板
公开(公告)号：US08603624B2
公开(公告)日：2013-12-10
申请号：US13510770
申请日：2010-10-29
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
IPC分类号： B32B15/00
CPC分类号： H05K1/0373 , B32B5/28 , B32B15/14 , C08G59/38 , C08G59/4021 , C08G59/621 , C08J5/24 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , H05K2201/0266 , Y10T428/24917 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257 , Y10T442/20 , Y10T442/3455
摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.
摘要翻译：公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子，平均粒径（D50）为2〜15μm，并且含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自一组的无机成分（B）的配合比（体积比）勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

55. 发明授权

US08465666B2 Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition 有权
标题翻译：导热组合物，散热板，散热基板和使用导热组合物的电路模块，以及制作导热组合物的方法
公开(公告)号：US08465666B2
公开(公告)日：2013-06-18
申请号：US13146666
申请日：2010-02-23
申请人： Toshiyuki Asahi , Yukihiro Shimasaki , Koji Shimoyama
发明人： Toshiyuki Asahi , Yukihiro Shimasaki , Koji Shimoyama
IPC分类号： C09K5/08 , C08K3/10 , C08K3/14 , C08L63/00 , H01L23/36 , H01L23/373
CPC分类号： C09K5/14 , C08G59/64 , C08K3/013 , C08L55/04 , C08L63/00 , H01L23/3735 , H01L23/3737 , H01L23/49861 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/09118 , Y10T428/24917 , Y10T428/25 , Y10T428/254 , Y10T428/31511 , Y10T428/31529 , C08L2666/24 , H01L2924/00
摘要： A thermally conductive composition is made to contain a cured thermosetting resin containing a crystalline epoxy resin component, and an inorganic filler. The content by percentage of the inorganic filler in the thermally conductive composition is 66% or more and 90% or less by volume. This thermally conductive composition has a main portion made mainly of the inorganic filler, and a surface layer portion made mainly of the crystalline epoxy component and formed on the main portion to be continuous to the main portion.
摘要翻译：导热组合物被制成含有含有结晶环氧树脂组分的固化的热固性树脂和无机填料。导热组合物中无机填料的含量百分比为66体积％以上且90体积％以下。该导热性组合物具有主要由无机填料形成的主体部分和主要由结晶环氧树脂组分形成的表面层部分，并形成在与主要部分连续的主要部分上。

56. 发明申请

US20120228010A1 PREPREG, LAMINATE, METAL-FOIL-CLAD LAMINATE, CIRCUIT BOARD, AND CIRCUIT BOARD FOR LED MOUNTING 有权
标题翻译： PREPREG，层压板，金属箔层压板，电路板和LED电路板电路板
公开(公告)号：US20120228010A1
公开(公告)日：2012-09-13
申请号：US13510770
申请日：2010-10-29
申请人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
发明人： Takashi Matsuda , Kiyotaka Komori , Akiyoshi Nozue , Takayuki Suzue , Mitsuyoshi Nishino , Toshiyuki Asahi , Yoshito Kitagawa , Naoyuki Tani
IPC分类号： H05K1/03 , B32B15/08 , B32B5/28
CPC分类号： H05K1/0373 , B32B5/28 , B32B15/14 , C08G59/38 , C08G59/4021 , C08G59/621 , C08J5/24 , H05K1/0366 , H05K2201/012 , H05K2201/0209 , H05K2201/0266 , Y10T428/24917 , Y10T428/24994 , Y10T428/25 , Y10T428/252 , Y10T428/254 , Y10T428/257 , Y10T442/20 , Y10T442/3455
摘要： Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 μm, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 μm and inorganic particles that have an average particle diameter (D50) of 2 to 15 μm and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 μm or smaller, the compounded ratio (volume ratio) of the gibbsite aluminum hydroxide particles (A), the at least one inorganic component (B) selected from the group consisting of the boehmite particles and the inorganic particles, and the aluminum oxide particles (C) being 1:0.1 to 2.5:0.1 to 1.
摘要翻译：公开了一种通过用热固性树脂组合物浸渍机织织物基底而获得的预浸料，其中热硬化性树脂组合物每100体积份热固性树脂含有80〜200体积份的无机填料，无机填料含有（A）三水铝矿平均粒径（D50）为2〜15μm的氢氧化铝粒子，（B）至少一种选自平均粒径（D50）为2〜15μm的勃姆石粒子的无机成分和无机粒子，具有2〜15μm的平均粒径（D50），含有剥离开始温度为400℃以上或不含结晶水的结晶水，（C）平均粒径（D50）的氧化铝粒子）为1.5μm以下，三水铝石氢氧化铝粒子（A），至少一种选自基团的无机成分（B）的配合比（体积比）勃姆石粒子和无机粒子，氧化铝粒子（C）的比例为1:0.1〜2.5:0.1:1。

57. 发明申请

US20120152599A1 PRINTED WIRING BOARD, BUILD-UP MULTI-LAYER BOARD, AND PRODUCTION METHOD THEREFOR 有权
标题翻译：印刷线路板，建筑多层板及其生产方法
公开(公告)号：US20120152599A1
公开(公告)日：2012-06-21
申请号：US13392554
申请日：2010-09-02
申请人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
发明人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
IPC分类号： H05K1/09 , H05K3/06
CPC分类号： H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/2072 , H05K2203/0773 , Y10T29/49128
摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.
摘要翻译：多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

58. 发明授权

US07418603B2 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program 失效
标题翻译：移动终端，电路板，电路板设计辅助设备和方法，设计辅助程序，以及存储在其中的存储介质设计辅助程序
公开(公告)号：US07418603B2
公开(公告)日：2008-08-26
申请号：US10959987
申请日：2004-10-08
申请人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
发明人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
IPC分类号： G06F12/14
CPC分类号： G06F21/87 , G06F17/5068 , H01L2224/16225 , H05K1/0275 , H05K1/186 , H05K3/0005 , H05K2201/10151
摘要： The present invention provides a tamper resistant circuit board, an apparatus and method for aiding the design of the circuit board, a computer readable storage medium having stored therein a program for performing the method, and a mobile terminal containing the circuit board. The tamper resistant circuit board has a multilayer structure, including outermost substrates and an internal layer between the outermost substrates, and a signal line through which a confidential signal flows. The signal line is wired such as the confidential signal does not appear on the outer surfaces of the outermost substrates of the multilayer structure of the circuit board.
摘要翻译：本发明提供一种用于辅助电路板设计的防篡改电路板，装置和方法，其中存储有用于执行该方法的程序的计算机可读存储介质和包含电路板的移动终端。防篡改电路板具有包括最外层基板和最外层基板之间的内层的多层结构以及机密信号通过其的信号线。信号线被布线，例如机密信号不出现在电路板的多层结构的最外面的基板的外表面上。

59. 发明申请

US20050081049A1 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program 失效
标题翻译：移动终端，电路板，电路板设计辅助设备和方法，设计辅助程序，以及存储在其中的存储介质设计辅助程序
公开(公告)号：US20050081049A1
公开(公告)日：2005-04-14
申请号：US10959987
申请日：2004-10-08
申请人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
发明人： Takeshi Nakayama , Yoshiyuki Saito , Toshiyuki Asahi
IPC分类号： G06F17/50 , G06F21/87 , H05K1/02 , H05K1/18 , H05K3/00 , H04L9/00
CPC分类号： G06F21/87 , G06F17/5068 , H01L2224/16225 , H05K1/0275 , H05K1/186 , H05K3/0005 , H05K2201/10151
摘要： A circuit board is provided in which tamper resistance is improved by making probing by third parties difficult, while solving problems associated with the current techniques and manufacturing costs. A signal line through which a confidential signal requiring tamper resistance flows and components 32 and 33 connected to the signal line 21 by the terminals thereof, are laid out in a component-containing layer 13 of a circuit board 10. Only a confidential signal having been encrypted through a predetermined component 31 is outputted to an observation point 34 provided on a surface of the circuit board 10. External observation and control of the confidential signal is performed by decoding a cipher provided by the component 31 to the signal which appears at the observation point 34.
摘要翻译：提供了一种电路板，其中通过使第三方的探测困难，同时解决与当前技术和制造成本相关的问题，提高了防篡改性。要求篡改电阻的机密信号流过的信号线和其端子与信号线21连接的部件32和33布置在电路板10的部件含有层13中。只有机密信号已被通过预定部件31加密的信号被输出到设置在电路板10的表面上的观察点34.机密信号的外部观察和控制是通过将由部件31提供的密码解码为在观察时出现的信号点34。

60. 发明授权

US08866022B2 Printed wiring board, build-up multi-layer board, and production method therefor 有权
标题翻译：印刷线路板，积层多层板及其制造方法
公开(公告)号：US08866022B2
公开(公告)日：2014-10-21
申请号：US13392554
申请日：2010-09-02
申请人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
发明人： Yoshito Kitagawa , Naoyuki Tani , Toshiyuki Asahi
IPC分类号： H05K1/00 , H05K3/00 , H05K3/38 , H05K3/46
CPC分类号： H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/2072 , H05K2203/0773 , Y10T29/49128
摘要： A multi-layer printed-wiring-board is used in densely packaging electronic components such as semiconductors having improved function, and a production method therefor, and more specifically it achieves a multi-layer printed-wiring-board having excellent copper-foil-peel-strength and high connection-reliability in which occurrence of structural defects such as delamination (interlayer peeling) is prevented, and a production method therefor. Because of thinning of the printed-wiring-board or diversification of insulating layers constituting the printed-wiring-board, peeling such as delamination may occur between the insulating layers or in an interface between the insulating layer and the plated conductor. By providing pores in substantially the same plane as wiring patterns in the printed-wiring-board including insulating layers, wiring pattern layers made of copper foil alternately laminated on the insulating layers, and pores provided between the wiring patterns, a printed-wiring-board having high connection reliability free from delamination or cracks during heating or in heat cycle conditions.
摘要翻译：多层印刷电路板用于密封地包装具有改进功能的半导体的电子部件及其制造方法，更具体地说，实现了具有优异的铜箔剥离性的多层印刷电路板 - 防止出现分层（层间剥离）等结构缺陷的强度和高连接可靠性及其制造方法。由于印刷电路板的薄化或构成印刷电路板的绝缘层的多样化，可能会在绝缘层之间或绝缘层与电镀导体之间的界面中发生分层剥离。通过在包括绝缘层的印刷电路板中的布线图案的基本相同的平面上设置孔，在交替层叠在绝缘层上的由铜箔制成的布线图案层和设置在布线图案之间的孔，印刷布线板具有高的连接可靠性，在加热或热循环条件下不会发生分层或裂纹。

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