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51. 发明授权

US08853872B2 Water-based data center 有权
标题翻译：水基数据中心
公开(公告)号：US08853872B2
公开(公告)日：2014-10-07
申请号：US12431639
申请日：2009-04-28
申请人： Jimmy Clidaras , David W. Stiver
发明人： Jimmy Clidaras , David W. Stiver
IPC分类号： F25D23/12
CPC分类号： G06F1/20 , F03B13/20 , F28D15/00 , H05K7/1497 , H05K7/2079 , Y02E10/38
摘要： A system includes a cooling water intake conduit having a water intake in a submerged area of an open natural body of water, a first water-to-water heat exchanger having a first side in fluid communication with the cooling water intake conduit, and a closed water loop in fluid communication with a second side of the water-to-water heat exchanger and arranged to route water to cooling structures at a computer data center.
摘要翻译：一种系统包括：在开放天然水体的淹没区域中具有进水口的冷却水进入导管，具有与冷却水进入导管流体连通的第一侧的第一水 - 水热交换器，以及封闭水回路与水对水热交换器的第二侧流体连通并布置成将水路向计算机数据中心的冷却结构进行排水。

52. 发明授权

US08453469B1 Changing data center cooling modes 有权
标题翻译：更改数据中心冷却模式
公开(公告)号：US08453469B1
公开(公告)日：2013-06-04
申请号：US13172092
申请日：2011-06-29
申请人： Andrew B. Carlson , Jimmy Clidaras
发明人： Andrew B. Carlson , Jimmy Clidaras
IPC分类号： F25D17/06
CPC分类号： H05K7/2079 , H05K7/20827
摘要： A method of providing utilities to a computer data center is discussed. The method includes initially connecting one or more non-evaporative cooling units to a data center as primary cooling plants, obtaining a government-issued water permit, and after obtaining the government-issued water permit, transitioning primary cooling for the data center to one or more evaporative cooling towers.
摘要翻译：讨论了向计算机数据中心提供实用程序的方法。该方法包括首先将一个或多个非蒸发冷却单元连接到作为主要冷却设备的数据中心，获得政府颁发的水许可证，并且在获得政府颁发的水许可证之后，将数据中心的主要冷却转换为一个或更多蒸发冷却塔。

53. 发明申请

US20080204999A1 Targeted Cooling for Datacenters 有权
标题翻译：数据中心目标冷却
公开(公告)号：US20080204999A1
公开(公告)日：2008-08-28
申请号：US11679024
申请日：2007-02-26
申请人： Jimmy Clidaras , Winnie Leung
发明人： Jimmy Clidaras , Winnie Leung
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , H05K7/20745 , H05K7/20836
摘要： A method of cooling electronic equipment is disclosed and includes substantially continuously circulating ambient air across a plurality of rack-mounted electronic devices, monitoring the temperature of air in or around a group of devices in the plurality of rack-mounted electronic devices, and providing substantially cooler-than-ambient air to the group of devices when the monitored air temperatures rises above a set value.
摘要翻译：公开了一种冷却电子设备的方法，并且包括在多个机架安装的电子设备中基本上连续地循环环境空气，监测多个机架安装的电子设备中的一组设备内或周围的空气的温度，当监测到的空气温度升高到设定值以上时，比该组设备冷却至大气的空气。

54. 发明申请

US20080158818A1 Motherboards with Integrated Cooling 有权
标题翻译：集成冷却主板
公开(公告)号：US20080158818A1
公开(公告)日：2008-07-03
申请号：US11618611
申请日：2006-12-29
申请人： Jimmy Clidaras , Winnie Leung
发明人： Jimmy Clidaras , Winnie Leung
IPC分类号： H05K7/20
CPC分类号： H05K7/20727 , G06F1/206 , G06F2200/201 , H05K7/20772
摘要： A computer apparatus includes a first motherboard having a top surface and a bottom surface, a second motherboard having a top surface and a bottom surface, and a heat sink in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the motherboards.
摘要翻译：计算机装置包括具有顶表面和底表面的第一母板，具有顶表面和底表面的第二母板以及与第一和第二母板的顶表面导电热接触的散热器。产生高热负荷的计算机部件被安装到主板的顶表面，并且产生低热负载的计算机部件被安装到一个或多个主板的底表面。

55. 发明申请

US20050002166A1 Modular computer system mechanical interconnection 有权
标题翻译：模块化计算机系统机械互连
公开(公告)号：US20050002166A1
公开(公告)日：2005-01-06
申请号：US10910472
申请日：2004-08-03
申请人： Jimmy Clidaras , Kenneth Kitlas
发明人： Jimmy Clidaras , Kenneth Kitlas
IPC分类号： G06F1/18 , H05K7/14 , H05K7/00
CPC分类号： H05K7/1429 , G06F1/181
摘要： A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
摘要翻译：模块化计算机系统机械互连包括具有第一开口的主底架和附接到主底架并具有第二开口的辅助底盘，其中第一开口和第二开口大致对准。该装置还包括覆盖对齐的第一开口和第二开口的背板。

56. 发明授权

US06781844B2 Modular computer system mechanical interconnection 有权
标题翻译：模块化计算机系统机械互连
公开(公告)号：US06781844B2
公开(公告)日：2004-08-24
申请号：US10277561
申请日：2002-10-22
申请人： Jimmy Clidaras , Kenneth Kitlas
发明人： Jimmy Clidaras , Kenneth Kitlas
IPC分类号： H05K502
CPC分类号： H05K7/1429 , G06F1/181
摘要： A modular computer system mechanical interconnection includes a primary chassis having a first opening and a secondary chassis attached to the primary chassis and having a second opening, wherein the first opening and the second opening are generally aligned. The apparatus further includes a backplate covering the aligned first opening and second opening.
摘要翻译：模块化计算机系统机械互连包括具有第一开口的主底架和附接到主底架并具有第二开口的辅助底盘，其中第一开口和第二开口大致对准。该装置还包括覆盖对齐的第一开口和第二开口的背板。

57. 发明授权

US09003821B2 Blended water-based data center cooling 有权
标题翻译：混合水基数据中心冷却
公开(公告)号：US09003821B2
公开(公告)日：2015-04-14
申请号：US13058576
申请日：2011-02-01
申请人： Christopher G. Malone , Jimmy Clidaras , Michael C. Ryan
发明人： Christopher G. Malone , Jimmy Clidaras , Michael C. Ryan
IPC分类号： F25D23/12 , H05K7/20
CPC分类号： H05K7/2079
摘要： A method of providing cooling by a cooling system to a computer data center. The method includes providing a plurality of air-and-water radiators and one or more chillers, the chillers each having a first side in fluid communication with a chilled water loop and a second side in communication with a condenser water loop. The method also includes circulating a first portion of return water coming from the computer data center to a first subset of the air-and-water radiators and through the condenser water loop, circulating a second portion of the return water from the computer data center to a second subset of the air-and-water radiators and through the chilled water loop, and circulating the first portion and the second portion of the return water to the computer data center as cooled supply water.
摘要翻译：一种通过冷却系统向计算机数据中心提供冷却的方法。该方法包括提供多个空气 - 水分散器和一个或多个冷却器，所述冷却器各自具有与冷水循环流体连通的第一侧和与冷凝器水回路连通的第二侧。该方法还包括将来自计算机数据中心的回流水的第一部分循环到空气和水 - 水散热器的第一子集，并通过冷凝器水循环，将第二部分回水从计算机数据中心循环到空气和水分散热器的第二子集，并通过冷水循环，并将回水的第一部分和第二部分循环到计算机数据中心作为冷却的供水。

58. 发明授权

US07564685B2 Motherboards with integrated cooling 有权
标题翻译：集成冷却主板
公开(公告)号：US07564685B2
公开(公告)日：2009-07-21
申请号：US11618611
申请日：2006-12-29
申请人： Jimmy Clidaras , Winnie Leung
发明人： Jimmy Clidaras , Winnie Leung
IPC分类号： H02K7/20 , F28F7/00
CPC分类号： H05K7/20727 , G06F1/206 , G06F2200/201 , H05K7/20772
摘要： A computer apparatus includes a first motherboard having a top surface and a bottom surface and a second motherboard having a top surface and a bottom surface. The motherboards each have mounted thereto components that generate high thermal loads and components that generate low thermal loads. A heat sink is in conductive thermal contact with the top surfaces of the first and second motherboards. Computer components generating high thermal loads are mounted to the top surfaces of the first and second motherboards, and computer components generating low thermal loads are mounted to the bottom surface of one or more of the first and second motherboards.
摘要翻译：计算机装置包括具有顶表面和底表面的第一母板和具有顶表面和底表面的第二母板。主板各自安装有产生高热负荷的部件和产生低热负荷的部件。散热器与第一和第二主板的顶表面导电热接触。产生高热负荷的计算机部件被安装到第一和第二母板的顶表面，并且产生低热负荷的计算机部件安装到第一和第二主板中的一个或多个的底表面。

59. 发明授权

US06636421B2 Method and apparatus for datum sharing between modular computer system components 有权
公开(公告)号：US06636421B2
公开(公告)日：2003-10-21
申请号：US09846809
申请日：2001-05-01
申请人： Jimmy Clidaras , Matthew Schutte
发明人： Jimmy Clidaras , Matthew Schutte
IPC分类号： G06F116
CPC分类号： G06F1/184 , G06F1/206
摘要： A method for datum sharing between modular computer system components, includes determining a position and orientation of a motherboard, defining at least one datum feature in a primary chassis describing the position and orientation of the motherboard, and defining at least one datum feature in a secondary chassis corresponding to the at least one datum feature in the primary chassis. An apparatus for datum sharing includes at least one datum feature of the primary chassis, at least one datum feature of the motherboard, wherein a location of the at least one datum feature of the primary chassis is based upon the at least one datum feature of the motherboard, and at least one datum feature of the secondary chassis, wherein a location of the at least one datum feature of the secondary chassis is based upon the location of the at least one datum feature of the primary chassis.

60. 发明授权

US08590333B2 Data center cooling 有权
标题翻译：数据中心冷却
公开(公告)号：US08590333B2
公开(公告)日：2013-11-26
申请号：US13372100
申请日：2012-02-13
申请人： Andrew B. Carlson , Jimmy Clidaras
发明人： Andrew B. Carlson , Jimmy Clidaras
IPC分类号： F25D23/12
CPC分类号： F25D16/00 , F25B2500/06 , H05K7/20836
摘要： A system for cooling air in a data center includes a data center having electronic equipment in operation, a cooling water source, and a plurality of on-floor cooling units. The cooling water source is configured to retain at maximum capacity a total amount of water. Each on-floor cooling unit is configured to cool air heated by a portion of the electronic equipment in the data center using water from the cooling water source. The total amount of water is insufficient to maintain a leaving air temperature of each on-floor cooling unit below an inside setpoint when a temperature outside of the data center is above a predetermined external temperature.
摘要翻译：用于在数据中心中冷却空气的系统包括具有运行中的电子设备的数据中心，冷却水源和多个地板上的冷却单元。冷却水源构造成以最大容量保持总量的水。每个地面上的冷却单元被配置为使用来自冷却水源的水来冷却由数据中心中的电子设备的一部分加热的空气。当数据中心外的温度高于预定的外部温度时，水的总量不足以将每个地板上冷却单元的离开空气温度保持在内部设定值以下。

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