会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 53. 发明授权
    • Microstructure array, and methods of fabricating a microstructure array, a mold for forming a microstructure array, and a microlens array
    • 微结构阵列和微结构阵列的制造方法,用于形成微结构阵列的模具和微透镜阵列
    • US06503384B1
    • 2003-01-07
    • US09536128
    • 2000-03-28
    • Takayuki TeshimaTakayuki Yagi
    • Takayuki TeshimaTakayuki Yagi
    • C25D502
    • G02B3/0031G02B3/0012G02B3/0056
    • In a method for fabricating an array of microstructures, a substrate with an electrically-conductive portion is provided, an insulating mask layer is formed on the electrically-conductive portion of the substrate, a plurality of openings are formed in the insulating mask layer to expose the electrically-conductive portion, and a first plated or electrodeposited layer is deposited in the openings and on the insulating mask layer by electro- or electroless-plating, or electrodeposition. At least a surface of the first plated or electrodeposited layer is made electrically conductive. After that, the insulating mask layer is removed, and a second plated layer is formed on the first plated or electrodeposited layer and on the electrically-conductive portion by electroplating to firmly fix the first plated or electrodeposited layer to the substrate.
    • 在制造微结构阵列的方法中,提供具有导电部分的衬底,在衬底的导电部分上形成绝缘掩模层,在绝缘掩模层中形成多个开口以露出 导电部分和第一电镀或电沉积层通过电镀或无电镀或电沉积沉积在开口中和绝缘掩模层上。 至少第一电镀或电沉积层的表面被制成导电的。 之后,去除绝缘掩模层,并且通过电镀在第一镀层或电沉积层上和导电部分上形成第二镀层,以将第一镀层或电沉积层牢固地固定在衬底上。