专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US07651932B2 Method for manufacturing antenna and method for manufacturing semiconductor device 有权
标题翻译：制造天线的方法及制造半导体器件的方法
公开(公告)号：US07651932B2
公开(公告)日：2010-01-26
申请号：US11433546
申请日：2006-05-15
申请人： Tomoyuki Aoki , Daiki Yamada
发明人： Tomoyuki Aoki , Daiki Yamada
IPC分类号： H01L21/20 , H01L21/36
CPC分类号： H01L27/1266 , H01L21/6835 , H01L21/6836 , H01L21/76826 , H01L21/76856 , H01L23/5227 , H01L24/83 , H01L27/1285 , H01L27/1292 , H01L27/13 , H01L2221/68327 , H01L2221/6834 , H01L2221/6835 , H01L2221/68363 , H01L2223/6677 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01012 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01Q1/2225 , H05K1/095 , H05K3/02 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides an antenna with low resistance and a semiconductor device having an antenna whose communication distance is improved. A fluid containing conductive particles is applied over an object. After curing the fluid containing the conductive particles, the fluid is irradiated with a laser to form an antenna. As a method for applying the fluid containing the conductive particles, screen printing, spin coating, dipping, or a droplet discharging method is used. Further, a solid laser having a wavelength of 1 nm or more and 380 nm or less is used as the laser.
摘要翻译：本发明提供一种具有低电阻的天线和具有提高通信距离的天线的半导体器件。含有导电颗粒的流体被施加在物体上。在固化含有导电颗粒的流体之后，用激光照射流体以形成天线。作为施加含有导电性粒子的流体的方法，使用丝网印刷，旋涂，浸渍或液滴喷射法。此外，使用波长为1nm以上且380nm以下的固体激光器作为激光。

52. 发明授权

US07632740B2 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device 有权
标题翻译：具有功能的层，具有该层的柔性基板的形成方法以及半导体装置的制造方法
公开(公告)号：US07632740B2
公开(公告)日：2009-12-15
申请号：US11592249
申请日：2006-11-03
申请人： Tomoyuki Aoki , Takuya Tsurume
发明人： Tomoyuki Aoki , Takuya Tsurume
IPC分类号： H01L21/46 , H01L21/469 , H01L21/31 , H01L21/84 , H01L21/205 , H01L21/331 , H01L21/336
CPC分类号： H01Q7/00 , G02F1/133305 , G02F1/1362 , G02F2001/13613 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/0106 , H01L2924/01067 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/38 , H05K3/207 , H05K3/28 , H05K2203/016 , H05K2203/0531 , H01L2224/81 , H01L2924/00
摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
摘要翻译：本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。然后，将粘合剂附着到具有功能性的层上。此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

53. 发明申请

US20090065588A1 Semiconductor Device, Manufacturing Method Thereof, and Manufacturing Method of Antenna 有权
标题翻译：半导体器件及其制造方法及其制造方法
公开(公告)号：US20090065588A1
公开(公告)日：2009-03-12
申请号：US11920273
申请日：2006-05-29
申请人： Tomoyuki Aoki , Yuugo Goto
发明人： Tomoyuki Aoki , Yuugo Goto
IPC分类号： G06K19/077 , B41M1/12 , H01L21/44
CPC分类号： G06K19/07749 , H01L23/49855 , H01L23/5227 , H01L23/5328 , H01L27/12 , H01L27/1292 , H01L27/13 , H01L2924/0002 , H01Q1/38 , H01Q7/00 , H01Q9/27 , H01Q23/00 , H05K3/1216 , H01L2924/00
摘要： An element group having a transistor is formed over a substrate and a conductive film to be a dummy pattern is formed over the element group by pushing out a paste including conductive particles from a first opening portion, and then a conductive film functioning as an antenna is formed continuously thereafter so as to electrically connect with the transistor, by pushing out a paste including conductive particles from a second opening portion. Therefore, an element group having a transistor, provided over a substrate; a first conductive film functioning as an antenna provided over the element group and is electrically connected to the transistor; a second conductive film to be a dummy pattern provided to be adjacent to the first conductive film and is not electrically connected to the transistor; are included.
摘要翻译：在基板上形成具有晶体管的元件组，并且通过从第一开口部分推出包括导电粒子的浆料，在元件组上形成作为虚设图案的导电膜，然后，用作天线的导电膜为随后通过从第二开口部分推出包括导电粒子的浆料，从而与晶体管电连接。因此，设置在基板上的具有晶体管的元件组; 用作天线的第一导电膜，设置在元件组上并电连接到晶体管; 第二导电膜为与第一导电膜相邻且不与晶体管电连接的虚设图案; 包括在内。

54. 发明申请

US20090057875A1 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US20090057875A1
公开(公告)日：2009-03-05
申请号：US12230484
申请日：2008-08-29
申请人： Tomoyuki Aoki , Takuya Tsurume , Hiroki Adachi , Hisashi Ohtani
发明人： Tomoyuki Aoki , Takuya Tsurume , Hiroki Adachi , Hisashi Ohtani
IPC分类号： H01L23/14
CPC分类号： H01L23/49855 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： A highly reliable semiconductor device which is not damaged by local pressing force from the outside and in which unevenness of a portion where an antenna and an element overlap with each other is reduced. The semiconductor device includes a chip and an antenna. The chip includes a semiconductor element layer including a thin film transistor; a conductive resin electrically connected to the semiconductor element layer; and a sealing layer. The sealing layer in which a fiber body is impregnated with an organic resin covers the semiconductor element layer and the conductive resin, and has a thickness of 10 to 100 μm. The antenna has a depressed portion and is electrically connected to the semiconductor element layer through the conductive resin. The chip is embedded inside the depressed portion. The thickness of the chip is equal to the depth of the depressed portion.
摘要翻译：不会受到来自外部的局部按压力的损害，天线和元件相互重叠的部分的不均匀性降低的高度可靠的半导体装置。半导体器件包括芯片和天线。该芯片包括：包括薄膜晶体管的半导体元件层; 电连接到半导体元件层的导电树脂; 和密封层。纤维体浸渍有机树脂的密封层覆盖半导体元件层和导电性树脂，其厚度为10〜100μm。天线具有凹部，并且通过导电树脂与半导体元件层电连接。芯片嵌入凹陷部分内。芯片的厚度等于凹陷部分的深度。

55. 发明申请

US20070296037A1 Semiconductor device and manufacturing method of semiconductor device 有权
标题翻译：半导体器件及半导体器件的制造方法
公开(公告)号：US20070296037A1
公开(公告)日：2007-12-27
申请号：US11812813
申请日：2007-06-21
申请人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Eiji Sugiyama , Kaori Ogita , Naoto Kusumoto
发明人： Yoshitaka Dozen , Tomoyuki Aoki , Hidekazu Takahashi , Daiki Yamada , Eiji Sugiyama , Kaori Ogita , Naoto Kusumoto
IPC分类号： H01L27/12 , H01L21/84
CPC分类号： H01L23/293 , H01L23/49855 , H01L23/66 , H01L27/1248 , H01L27/1266 , H01L27/13 , H01L28/10 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by an insulating layer which serves as a substrate for protection. In the semiconductor device, the insulating layer is formed over a conductive layer serving as an antenna such that the value in the thickness ratio of the insulating layer in a portion not covering the conductive layer to the conductive layer is at least 1.2, and the value in the thickness ratio of the insulating layer formed over the conductive layer to the conductive layer is at least 0.2. Further, not the conductive layer but the insulating layer is exposed in the side face of the semiconductor device, and the insulating layer covers a TFT and the conductive layer. In addition, a substrate covering an element formation layer side is a substrate having a support on its surface is used in the manufacturing process.
摘要翻译：本发明提供了利用半导体器件中使用的柔性衬底的优点的薄且可弯曲的半导体器件以及半导体器件的制造方法。半导体器件具有被绝缘层覆盖的至少一个表面，该绝缘层用作用于保护的衬底。在半导体器件中，绝缘层形成在用作天线的导电层上，使得不覆盖导电层的部分中的绝缘层的厚度比值至少为1.2，并且该值在导电层上形成的绝缘层与导电层的厚度比为至少0.2。此外，导电层而不是绝缘层不会在半导体器件的侧面露出，并且绝缘层覆盖TFT和导电层。此外，在制造过程中使用覆盖元件形成层侧的基板是其表面上具有支撑体的基板。

56. 发明申请

US20060170077A1 Substrate having pattern and method for manufacturing the same, and semiconductor device and method for manufacturing the same 有权
标题翻译：具有图案的基板及其制造方法，以及半导体装置及其制造方法
公开(公告)号：US20060170077A1
公开(公告)日：2006-08-03
申请号：US11334474
申请日：2006-01-19
申请人： Tomoyuki Aoki , Koji Dairiki
发明人： Tomoyuki Aoki , Koji Dairiki
IPC分类号： H01L23/58
CPC分类号： H01L23/49894 , C03C17/3649 , G02F1/13439 , H01L21/4867 , H01L21/6835 , H01L27/3244 , H01L27/3281 , H01L27/3297 , H01L51/0021 , H01L51/524 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H01L2924/00
摘要： The present invention provides a method for manufacturing a substrate having a pattern that is capable of controlling the distance between adjacent film patterns, and also provides a method for manufacturing a substrate, particularly, having a pattern with a narrow width and a thickness that is capable of controlling the width between the film patterns. The present invention provides a method for manufacturing a substrate having a conductive film that serves as an antenna with a little variation in inductance and has a large electromotive force, and provides a method for manufacturing a semiconductor device with high yield. After forming a film in which silicon and oxygen are combined and an inactive group is combined with the silicon over a substrate, an insulating film, or a conductive film, a composition is printed by the printing method thereover, and is baked to form a film pattern.
摘要翻译：本发明提供了一种制造具有能够控制相邻膜图案之间的距离的图案的基板的制造方法，并且还提供了一种制造基板的方法，特别是具有窄的宽度和厚度的图案控制胶片图案之间的宽度。本发明提供一种制造具有导电膜的基板的方法，该导电膜用作具有小的电感变化的天线，并且具有大的电动势，并且提供了一种以高产率制造半导体器件的方法。在其中组合硅和氧并且非活性基团与硅在基底，绝缘膜或导电膜上组合的膜之后，通过其上的印刷方法印刷组合物，并且被烘烤以形成膜模式。

57. 发明授权

US09284410B2 Polyamide production method 有权
标题翻译：聚酰胺生产方法
公开(公告)号：US09284410B2
公开(公告)日：2016-03-15
申请号：US14406607
申请日：2012-06-19
申请人： Taku Ishimaru , Katsumi Akaike , Daisuke Kikuno , Tomoyuki Aoki , Minoru Noda , Yasunori Tsuda
发明人： Taku Ishimaru , Katsumi Akaike , Daisuke Kikuno , Tomoyuki Aoki , Minoru Noda , Yasunori Tsuda
IPC分类号： C08G69/26 , C08L77/06 , C08G69/36 , C08G69/28 , B29C47/10 , B29C47/36 , D01F6/90 , C08L77/00
CPC分类号： C08G69/26 , B29C47/1063 , B29C47/364 , C08G69/265 , C08G69/28 , C08G69/36 , C08L77/00 , C08L77/06 , D01F6/90
摘要： A method of producing a polyamide includes (i) polycondensating a polyamide precursor containing a salt made from a dicarboxylic acid and a diamine under pressure in a pre-polymerization tank to obtain a prepolymer, and (ii) highly polymerizing the prepolymer with an extruder, wherein when the prepolymer in a molten state which is obtained in the step (i) is fed, by a pump, to the low-pressure extruder from the pre-polymerization tank through a discharge side pipe disposed downstream of the pump, the prepolymer is fed such that the length L [cm] of the discharge side pipe and the linear velocity of discharge v [cm/s] of the prepolymer by the pump satisfy the relationship expressed by the equation, 0.1 [s]≦L/v
摘要翻译：制备聚酰胺的方法包括：（i）在预聚合槽中将压缩下由二羧酸和二胺制成的盐的聚酰胺前体缩聚得到预聚物，和（ii）用挤出机使聚合物高度聚合，其中当步骤（i）中获得的处于熔融状态的预聚物通过泵从预聚合槽通过布置在泵下游的排放侧管被泵送到低压挤出机中时，预聚物是进料使得排出侧管的长度L [cm]和泵的预定液体的线速度v [cm / s]满足由式表示的关系：0.1 [s]＆nlE; L / v < 10 [s]。

58. 发明授权

US09155204B2 Method for manufacturing a wiring board 有权
标题翻译：线路板制造方法
公开(公告)号：US09155204B2
公开(公告)日：2015-10-06
申请号：US12690992
申请日：2010-01-21
申请人： Junya Maruyama , Tomoyuki Aoki
发明人： Junya Maruyama , Tomoyuki Aoki
IPC分类号： H05K3/30 , H05K3/20 , H05K3/24
CPC分类号： H05K3/205 , H01L2224/11 , H01L2924/12044 , H05K3/245 , H05K2203/0117 , Y10T29/49016 , Y10T29/49018 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155 , Y10T29/49224 , H01L2924/00
摘要： A manufacturing method of a wiring board and a semiconductor device at low cost and by a simple process, without performing complicated steps many times is proposed. Furthermore, a manufacturing method of a wiring board at low cost and with fewer adverse effects on the environment, and a manufacturing method of a semiconductor device using the wiring board are proposed. A pattern of a conductive material is formed over a first substrate, a conductive film is formed over the pattern by an electrolytic plating process, the pattern and the conductive film are separated, an IC chip including at least one thin film transistor is formed over a second substrate, and the conductive film is electrically connected to the IC chip.
摘要翻译：提出了一种以低成本和简单的方法制造布线板和半导体器件的方法，而不需要多次复杂的步骤。此外，提出了一种低成本并且对环境的不利影响较少的布线板的制造方法以及使用该布线板的半导体装置的制造方法。导电材料的图形形成在第一基板上，通过电解电镀工艺在图案上形成导电膜，图案和导电膜被分离，包括至少一个薄膜晶体管的IC芯片形成在第二基板，并且导电膜电连接到IC芯片。

59. 发明授权

US08242585B2 Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US08242585B2
公开(公告)日：2012-08-14
申请号：US12965367
申请日：2010-12-10
申请人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
发明人： Kazuo Nishi , Hiroki Adachi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara , Tomoyuki Aoki , Eiji Sugiyama , Hironobu Takahashi
IPC分类号： H01L29/06 , H01L31/0352
CPC分类号： H01L31/0203 , H01L27/1446 , H01L27/14618 , H01L31/048 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： The present invention provides a semiconductor device formed over an insulating substrate, typically a semiconductor device having a structure in which mounting strength to a wiring board can be increased in an optical sensor, a solar battery, or a circuit using a TFT, and which can make it mount on a wiring board with high density, and further a method for manufacturing the same. According to the present invention, in a semiconductor device, a semiconductor element is formed on an insulating substrate, a concave portion is formed on a side face of the semiconductor device, and a conductive film electrically connected to the semiconductor element is formed in the concave portion.
摘要翻译：本发明提供一种半导体器件，其形成在绝缘基板上，通常是半导体器件，其具有可以在光学传感器，太阳能电池或使用TFT的电路中增加布线板的安装强度的结构，并且其可以使其安装在高密度的布线板上，并且还提供其制造方法。根据本发明，在半导体器件中，半导体元件形成在绝缘基板上，在半导体器件的侧面形成有凹部，与半导体元件电连接的导电膜形成在凹部一部分。

60. 发明授权

US08044499B2 Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof 有权
标题翻译：配线基板及其制造方法，半导体装置及其制造方法
公开(公告)号：US08044499B2
公开(公告)日：2011-10-25
申请号：US12465703
申请日：2009-05-14
申请人： Akihiro Chida , Tomoyuki Aoki
发明人： Akihiro Chida , Tomoyuki Aoki
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H05K3/4647 , H01L21/6835 , H01L23/3733 , H01L27/124 , H01L27/1266 , H01L29/78603 , H01L2221/6835 , H01L2224/29499 , H01L2924/01067 , H01L2924/01068 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/19043 , H01L2924/3025 , H05K1/0366 , H05K3/4069 , H05K2201/029 , H05K2203/1147 , Y10T442/2418 , H01L2924/00
摘要： A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.
摘要翻译：提供了一种布线基板，包括设置在片状纤维体的两个表面上且被片状纤维体浸渍的绝缘树脂层，以及设置在由绝缘树脂层围绕的区域中的通孔。贯通布线使用导电材料形成，导电材料暴露在绝缘树脂层的两个表面上，片状纤维体位于导电材料中，并且片状纤维体浸渍有导电材料。还提供了布线基板的制造方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式