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    • 51. 发明授权
    • Power transmission device
    • 动力传动装置
    • US08992376B2
    • 2015-03-31
    • US13580561
    • 2010-02-22
    • Hiroyuki OgawaAkira MurakamiDaisuke TomomatsuTakahiro Shiina
    • Hiroyuki OgawaAkira MurakamiDaisuke TomomatsuTakahiro Shiina
    • F16H15/52
    • F16H15/52
    • A power transmission device includes first and second rings arranged opposite each other, having a common rotation center axis, and rotatable relative to each other; a plurality of planetary balls having rotation center axes parallel to the rotation center axis, and radially arranged between the first and second rings and around the rotation center axis; a transmission control unit configured to change a rotation ratio between the first and second rings by changing the respective contact points of the first and second rings and each of the planetary balls through tilting motion of each of the planetary balls; and a rotation restricting unit disposed between the planetary balls adjacent to each other.
    • 动力传递装置包括彼此相对布置的第一和第二环,具有共同的旋转中心轴线并且可相对于彼此旋转; 多个行星球,其旋转中心轴与旋转中心轴平行,并且径向配置在第一和第二环之间并且围绕旋转中心轴线; 变速器控制单元,其被配置为通过通过每个所述行星球的倾斜运动来改变所述第一和第二环和每个所述行星球的各个接触点来改变所述第一和第二环之间的旋转比; 以及设置在彼此相邻的行星球之间的旋转限制单元。
    • 55. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US08785274B2
    • 2014-07-22
    • US12785964
    • 2010-05-24
    • Katsuyoshi MatsuuraMasayoshi AsanoHiroyuki OgawaMyounggoo Lee
    • Katsuyoshi MatsuuraMasayoshi AsanoHiroyuki OgawaMyounggoo Lee
    • H01L21/8242
    • H01L29/66659H01L27/1085H01L27/10861H01L27/10894H01L28/91H01L29/105H01L29/66537H01L29/7835
    • A method for manufacturing a semiconductor device includes preparing a semiconductor substrate having a first region of a first electrical conduction type as a part of a surface layer of the semiconductor substrate and a first gate electrode and a capacitor structure, the first gate electrode and the capacitor structure being disposed on the first region; forming a first insulating film covering the first gate electrode and the capacitor structure, the first insulating film being covering the surface of the semiconductor substrate; implanting a first impurity of a second electrical conduction type into the semiconductor substrate, so as to form a region of the second electrical conduction type in each of a second region and a third region, the second region being a region between the first gate electrode and the capacitor structure, the third region being a region opposite to the capacitor structure with the first gate electrode therebetween.
    • 一种制造半导体器件的方法包括制备具有第一导电类型的第一区域作为半导体衬底的表面层的一部分的半导体衬底和第一栅电极和电容器结构,第一栅电极和电容器 结构设置在第一区域上; 形成覆盖所述第一栅电极和所述电容器结构的第一绝缘膜,所述第一绝缘膜覆盖所述半导体基板的表面; 将第二导电类型的第一杂质注入到所述半导体衬底中,以便在第二区域和第三区域中的每一个中形成所述第二导电类型的区域,所述第二区域是所述第一栅电极和 电容器结构,第三区域是与电容器结构相反的区域,其间具有第一栅电极。