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51. 发明申请

US20050258044A1 Magnetic focus rings for improved copper plating 审中-公开
标题翻译：用于改善镀铜的磁性聚焦环
公开(公告)号：US20050258044A1
公开(公告)日：2005-11-24
申请号：US10850648
申请日：2004-05-21
申请人： Michael Berman , Steven Reder
发明人： Michael Berman , Steven Reder
IPC分类号： C25D5/00 , C25D7/12 , C25D21/12 , H01L21/288 , H01L21/768
CPC分类号： H01L21/2885 , C25D5/00 , C25D5/006 , C25D5/18 , C25D7/123 , C25D21/12 , H01L21/76877
摘要： A method and system wherein magnets are employed on the outside of a plating bath chamber to control the field lines that are used during the plating process. By being able to control the field lines during the plating process, improved gap fill and uniformity can be achieved. The magnetic field acting on the bath can be continuous, pulsed, stressed (i.e., the shape of the field can be changed), sinusoidal, etc. The magnetic field can be modulated as function of time to produce a desired copper uniformity on the wafer. It is anticipated that there is no limit to how the shape of the magnets or magnetic field can be configured and controlled to achieve the desired result for both fill of deep contacts and the uniformity needed to match the succeeding polishing process.
摘要翻译：一种方法和系统，其中在镀浴室的外侧采用磁体来控制在电镀过程中使用的场线。通过能够在电镀过程中控制场线，可以实现改善的间隙填充和均匀性。作用在浴上的磁场可以是连续的，脉冲的，应力的（即，场的形状可以改变），正弦曲线等。磁场可以作为时间的函数被调制以在晶片上产生期望的铜均匀性。可以预期，磁体或磁场的形状如何被配置和控制以达到对于深度接触的填充以及匹配随后的抛光过程所需的均匀性所需的结果是没有限制的。

52. 外观设计

USD511564S1 Faucet 失效
公开(公告)号：USD511564S1
公开(公告)日：2005-11-15
申请号：US29208834
申请日：2004-07-06
申请人： Michael Berman
设计人： Michael Berman

53. 发明申请

US20050110512A1 Contact resistance device for improved process control 有权
标题翻译：接触电阻器件，用于改进过程控制
公开(公告)号：US20050110512A1
公开(公告)日：2005-05-26
申请号：US10723701
申请日：2003-11-26
申请人： Michael Berman , Steven Reder
发明人： Michael Berman , Steven Reder
IPC分类号： C25D21/12 , G01R31/26 , H01L21/288
CPC分类号： C25D21/12 , H01L21/2885
摘要： A device for measuring resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process. The device includes a substrate and a conductive pattern on the substrate. The conductive pattern is electrically contactable with the electrical contacts of the contact ring. Resistance measurement circuitry is connected to the conductive pattern. The resistance measurement circuitry is configured to send test signals to the conductive pattern, receive signals from the conductive pattern, and measure the resistances associated with the electrical contacts of the contact ring. A method of using such a device to measure resistances associated with electrical contacts of a contact ring used in a semiconductor wafer electroplating process is also provided.
摘要翻译：一种用于测量与半导体晶片电镀工艺中使用的接触环的电触点相关联的电阻的装置。该器件在衬底上包括衬底和导电图案。导电图案与接触环的电触点电接触。电阻测量电路连接到导电图案。电阻测量电路被配置为将测试信号发送到导电图案，从导电图案接收信号，并测量与接触环的电触点相关联的电阻。还提供了使用这种装置来测量与在半导体晶片电镀工艺中使用的接触环的电触点相关联的电阻的方法。

54. 发明申请

US20050090121A1 Chemical mechanical electropolishing system 失效
公开(公告)号：US20050090121A1
公开(公告)日：2005-04-28
申请号：US10693110
申请日：2003-10-24
申请人： Steven Reder , Michael Berman
发明人： Steven Reder , Michael Berman
IPC分类号： B24B37/04 , C25F3/02 , H01L21/31
CPC分类号： C25F3/02 , B24B37/042 , H01L21/32125 , Y10S438/907
摘要： A system for thinning a layer on a substrate without damaging a delicate underlying layer in the substrate. The system includes means for mechanically eroding the layer on the substrate, and means for electropolishing the layer on the substrate. In this manner, portions of the layer that cannot be removed by electropolishing can be removed by the mechanical erosion. However, electropolishing can preferentially be used on some portions of the layer so that unnecessary mechanical stresses can be avoided. Thus, the system imparts less mechanical stress to the substrate during the removal of the layer, and the delicate underlying layer receives less damage during the process, and preferably no damage whatsoever.

55. 发明授权

US06874510B2 Method to use a laser to perform the edge clean operation on a semiconductor wafer 失效
公开(公告)号：US06874510B2
公开(公告)日：2005-04-05
申请号：US10360903
申请日：2003-02-07
申请人： Steven Reder , Michael Berman , Rennie Barber
发明人： Steven Reder , Michael Berman , Rennie Barber
IPC分类号： B08B7/00 , H01L21/00 , H01L21/304 , C25F5/00
CPC分类号： H01L21/02087 , B08B7/0042 , H01L21/02021 , H01L21/67051
摘要： A method for performing the edge clean operation on a semiconductor wafer. A laser beam is used to accurately clean the edge of the wafer. The wafer is clamped concentrically to a chuck and rotated at a selectable speed, preferably in the range of 10 rpm to 1,000 rpm. A laser beam of variable power is directed onto toward the edge of the wafer at an oblique angle through a nozzle through which an inert purge gas is simultaneously passed. The laser beam removes unwanted deposits at the edge of the wafer and the gas is used to blow away the residue and prevent slag buildup on other parts of the wafer. The process is preferably carried out in an exhausted chamber.

56. 发明授权

US06869893B2 Laminate low K film 有权
标题翻译：层压低K膜
公开(公告)号：US06869893B2
公开(公告)日：2005-03-22
申请号：US10277025
申请日：2002-10-21
申请人： Steven Reder , Michael Berman , Rennie Barber
发明人： Steven Reder , Michael Berman , Rennie Barber
IPC分类号： H01L21/312 , H01L21/31
CPC分类号： H01L21/022 , H01L21/312
摘要： Application of an extremely low K material by the application of a laminate onto a wafer. The laminate preferably contains alternating layers of low K material and etch stop layers, and could be applied by rolling the laminate onto the wafer. An anneal process can be utilized to bond the film to the wafer. Conventional photo masking and etching techniques are then used to open vias and line areas in the film, and to deposit the next copper layer on the wafer. Electro polishing can be used to planarize or remove residual copper. Thereafter, an etch step can be performed to remove the excess material between the copper lines to leave an ultra low K region between the copper lines. The next layer of low K film can then be deposited, and the process repeated for all subsequent metal layering.
摘要翻译：通过在晶片上施加层压材料来应用极低K材料。层压件优选地包含低K材料和蚀刻停止层的交替层，并且可以通过将层压体滚动到晶片上来施加。可以利用退火工艺将膜粘合到晶片上。然后使用常规的光掩模和蚀刻技术来打开膜中的通孔和线区域，并将下一个铜层沉积在晶片上。电抛光可用于平坦化或去除残留的铜。此后，可以执行蚀刻步骤以去除铜线之间的多余材料，以在铜线之间留下超低K区。然后可以沉积下一层低K膜，并且对于所有随后的金属分层重复该过程。

57. 发明申请

US20050029122A1 Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath 失效
标题翻译：通过使用电镀电极来提高电抛光控制的方法
公开(公告)号：US20050029122A1
公开(公告)日：2005-02-10
申请号：US10637385
申请日：2003-08-08
申请人： Michael Berman , Steven Reder
发明人： Michael Berman , Steven Reder
IPC分类号： B23H5/00 , C25F7/02
CPC分类号： C25F7/02
摘要： A method and apparatus which uses a plating electrode in an electrolyte bath. The plating electrode works to purify an electrolyte polishing solution during the electro-polishing process. Preferably, the plating electrode is employed in a closed loop feedback system. The plating electrode may be powered by a power supply which is controlled by a controller. A sensor may be connected to the controller and the sensor may be configured to sense a characteristic (for example, but not limited to: resistance, conductance or optical transmission, absorption of light, etc.) of the electrolyte bath, which tends to indicate the level of saturation. Preferably, the plating electrode is easily replaceable.
摘要翻译：在电解液槽中使用电镀电极的方法和装置。电镀电极用于在电抛光过程中净化电解抛光液。优选地，电镀电极用于闭环反馈系统中。电镀电极可以由控制器控制的电源供电。传感器可以连接到控制器，并且传感器可以被配置为感测电解液浴的特性（例如但不限于：电阻，电导或光传输，光的吸收等），其倾向于指示饱和度水平。优选地，电镀电极易于更换。

58. 外观设计

USD495034S1 Faucet 失效
公开(公告)号：USD495034S1
公开(公告)日：2004-08-24
申请号：US29188182
申请日：2003-08-13
申请人： Michael Berman
设计人： Michael Berman

59. 发明授权

US06315724B1 3-dimensional ultrasonic imaging 失效
标题翻译：三维超声成像
公开(公告)号：US06315724B1
公开(公告)日：2001-11-13
申请号：US09421046
申请日：1999-10-19
申请人： Michael Berman , James Gessert , Wayne Moore , Rachel Nechushtai , Hillel Rom , Ziv Soferman
发明人： Michael Berman , James Gessert , Wayne Moore , Rachel Nechushtai , Hillel Rom , Ziv Soferman
IPC分类号： A61B800
CPC分类号： A61B8/483 , A61B8/0833 , A61B8/13 , A61B8/4245 , A61B8/4254 , G01S7/5208 , G01S15/8934 , G01S15/899 , G01S15/8993 , Y10S128/916
摘要： An ultrasonic imaging system including a probe containing at least one ultrasonic transducer and at least one inertial sensor as well as electronic circuitry connected to the probe for causing the at least one ultrasonic transducer to transmit ultrasonic energy into a region and to receive reflected ultrasonic energy therefrom, creating a plurality of generally two-dimensional images whose geometrical relationship is indicated by outputs from the at least one inertial sensor.
摘要翻译：一种超声成像系统，包括包含至少一个超声波换能器和至少一个惯性传感器的探针以及连接到所述探针的电子电路，用于使所述至少一个超声波换能器将超声波能量传输到区域中并从其接收反射的超声能量，产生多个通常二维图像，其几何关系由来自至少一个惯性传感器的输出指示。

60. 发明授权

US6089235A Method of using an in vivo mechanical energy source 有权
标题翻译：使用体内机械能源的方法
公开(公告)号：US6089235A
公开(公告)日：2000-07-18
申请号：US258361
申请日：1999-02-26
申请人： Roger Hastings , Kenneth Larson , Michael Berman , Daniel M Lafontaine
发明人： Roger Hastings , Kenneth Larson , Michael Berman , Daniel M Lafontaine
IPC分类号： A61B17/00 , A61B17/22 , A61F2/958 , A61M1/10
CPC分类号： A61M25/10 , A61M1/1072 , A61M1/1081 , A61B17/3207 , A61B2017/00345
摘要： An in vivo source of mechanical energy is provided in close proximity to its load. In the disclosed embodiments, the mechanical energy source is a miniaturized motor ("micromotor") and the load is a miniaturized perfusion pump located at the distal end of a transluminal catheter. The motor is powerful enough to provide the electrical energy needed by the perfusion pump to fluid, and yet small enough to fit inside a body vessel. A position sensor may be provided for automatically controlling the motor's driving current so that it is corresponds to the applied load. An embodiment of the perfusion pump is also provided in which an external energy source is used. Another embodiment is provided wherein a balloon/pump/miniaturized-motor configuration is provided on a distal end of a catheter.
摘要翻译：靠近其负载提供体内机械能源。在所公开的实施例中，机械能源是小型电动机（“微型电动机”），负载是位于腔内导管远端的小型灌注泵。电动机足够强大以将灌注泵所需的电能提供给流体，并且足够小以适合体内容器。可以设置位置传感器，用于自动控制电动机的驱动电流，使其对应于所施加的负载。还提供了一种使用外部能量源的灌注泵的实施例。提供了另一个实施例，其中气囊/泵/小型电动机构造设置在导管的远端。

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