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    • 51. 发明授权
    • Preventing stains on multiple-electroplated articles
    • 防止多层电镀物品上的污渍
    • US4236976A
    • 1980-12-02
    • US92472
    • 1979-11-08
    • Paul A. Kohl
    • Paul A. Kohl
    • C25D5/02C25D5/34C25D5/52
    • C25D5/34C25D5/02C25D5/52
    • A method is shown of reducing the incidence of stains on objects, such as electrical contact pins, having two or more electroplated regions. An exemplary embodiment is the case of two gold electroplating operations. After the first gold electroplating operation, the article is passed through a cyanide etching bath. The article is typically then polished, and then plated in a second electroplating operation. The etching bath removes extraneous gold deposits that can cause stains. A typical etching solution is a 0.01 molar concentration of KCN etchant and 0.1 molar KOH or K.sub.3 PO.sub.4 buffer in a water solution, typically applied by spraying.
    • 示出了减少具有两个或更多个电镀区域的物体上的污渍(例如电接触针)的发生率的方法。 一个示例性的实施例是两次镀金操作的情况。 在第一次镀金操作之后,将物品通过氰化物蚀刻槽。 然后将制品抛光,然后在第二次电镀操作中进行电镀。 蚀刻浴去除可能引起污渍的外来金矿床。 典型的蚀刻溶液是通常通过喷雾施加的0.01摩尔浓度的KCN蚀刻剂和0.1摩尔KOH或K 3 PO 4缓冲液。
    • 56. 发明申请
    • Micro-electromechanical switched tunable inductor
    • 微机电开关可调谐电感
    • US20080136572A1
    • 2008-06-12
    • US11999527
    • 2007-12-06
    • Farrokh AyaziMina RaieszadehPaul A. Kohl
    • Farrokh AyaziMina RaieszadehPaul A. Kohl
    • H01F21/00H01F27/02
    • H01F17/0006H01F21/12H01F27/022H01F2017/0086H01F2021/125
    • Disclosed is an integrated tunable inductor having mutual micromachined inductances fabricated in close proximity to a tunable inductor that is switched in and out by micromechanical ohmic switches to change the inductance of the integrated tunable inductor. To achieve a large tuning range and high quality factor, silver is preferably used as the structural material to co-fabricate the inductors and micromachined switches, and silicon is selectively removed from the backside of the substrate. Using this method, exemplary tuning of 47% at 6 GHz is achievable for a 1.1 nH silver inductor fabricated on a low-loss polymer membrane. The effect of the quality factor on the tuning characteristic of the integrated inductor is evaluated by comparing the measured result of substantially identical inductors fabricated on various substrates. To maintain the quality factor of the silver inductor, the device may be encapsulated using a low-cost wafer-level polymer packaging technique.
    • 公开了一种集成的可调电感器,其具有相互微机电感应,其紧密接近可调电感器,该可调谐电感器由微机械欧姆开关导入和切出以改变集成可调电感器的电感。 为了实现大的调谐范围和高品质因素,优选使用银作为用于共同制造电感器和微加工开关的结构材料,并且硅从衬底的背面选择性地去除。 使用这种方法,在低损耗聚合物膜上制造的1.1nH银电感器可以实现在6GHz下47%的示例性调谐。 通过比较在各种衬底上制造的基本相同的电感器的测量结果来评估质量因子对集成电感器的调谐特性的影响。 为了保持银电感器的品质因素,可以使用低成本晶圆级聚合物封装技术封装器件。
    • 57. 发明授权
    • Porous insulating compounds and method for making same
    • 多孔绝缘化合物及其制备方法
    • US06509386B1
    • 2003-01-21
    • US09544638
    • 2000-04-05
    • Paul A. Kohl
    • Paul A. Kohl
    • C08J902
    • H01L21/762H01L21/02126H01L21/02203H01L21/02216H01L21/02282H01L21/3121H01L21/316H01L21/31695H01L21/3185H01L23/49894H01L23/5222H01L23/5329H01L2924/0002H01L2924/00
    • A method of forming a porous insulating composition comprising the steps of (A) providing at least one organic sacrificial material/dielectric material composition comprising at least one organic sacrificial material and at least one dielectric material; and (B) removing the at least one organic sacrificial material in the at least one organic sacrificial material/dielectric material composition, in order to generate pores in the at least one dielectric material. Also disclosed is a composition useful in making a porous insulator, comprising a heat-activated, pore-forming, sacrificial material; and a dielectric material. Alternatively, the composition useful in making a porous insulator, comprises at least one pore-forming, organic sacrificial material; and at least one dielectric material, wherein the at least one pore-forming, material is a norbornene-type polymer.
    • 一种形成多孔绝缘组合物的方法,包括以下步骤:(A)提供至少一种包含至少一种有机牺牲材料和至少一种介电材料的有机牺牲材料/介电材料组合物; 和(B)去除所述至少一种有机牺牲材料/电介质材料组合物中的至少一种有机牺牲材料,以在所述至少一种电介质材料中产生孔。 还公开了可用于制造多孔绝缘体的组合物,其包含热活化的成孔牺牲材料; 和电介质材料。 或者,可用于制备多孔绝缘体的组合物包括至少一种成孔有机牺牲材料; 和至少一种介电材料,其中所述至少一种成孔材料是降冰片烯型聚合物。
    • 58. 发明授权
    • Process for the low temperature creation of nitride films on
semiconductors
    • 半导体上氮化物薄膜的低温生成工艺
    • US5468688A
    • 1995-11-21
    • US146876
    • 1993-11-01
    • Paul A. KohlKirkland W. Vogt
    • Paul A. KohlKirkland W. Vogt
    • H01L21/318H01L21/18
    • H01L21/318
    • Processes (30, 40) have been developed for forming nitride films (35, 45, 37, 47) at low temperatures and at near atmospheric pressure on sample materials 12, including metals, for example, Co, Cr, Fe, Mo, Si, Ta, Ti, V, and W, and including group IV and group III-V semiconductors, for example, Si and GaAs, respectively. The processes (30, 40) are performed using a reaction system (10) which comprises a reactor (11) enclosed within a dry box (13), a hydrazine bubbler (18), gas sources (14a-14e), and an optional gas disposal system (22) for disposing of exhaust from the reactor (11). The surface of the sample material (12) is initially cleaned to remove any oxides and carbon compounds. The surface is then maintained at a temperature between 0.degree. and 400.degree. C. and at a pressure between 0.001 and 10,000 Torr. The surface is treated with hydrazine by introducing the hydrazine in a gaseous phase over the surface. Nitrogen reactants are formed by the breakdown of the hydrazine, and the nitrogen reactants combine with and consume a portion of the sample material 12 to form a nitride film (35, 45). A thicker nitride film (37, 47) is created by the chemical vapor deposition of boron nitride over the thin nitride film (35, 45).
    • 已经开发了用于在低温和接近大气压下在样品材料12上形成氮化物膜(35,45,37,47)的工艺(30,40),包括金属,例如Co,Cr,Fe,Mo,Si ,Ta,Ti,V和W,并且分别包括IV族和III-V族半导体,例如Si和GaAs。 使用反应系统(10)进行方法(30,40),反应系统(10)包括封闭在干燥箱(13)内的反应器(11),肼起泡器(18),气体源(14a-14e)和可选的 气体处理系统(22),用于处理来自反应器(11)的废气。 最初清洗样品材料(12)的表面以除去任何氧化物和碳化合物。 然后将表面保持在0℃至400℃的温度和0.001至10,000托之间的压力下。 通过在表面上引入气相中的肼来处理表面。 通过肼的分解形成氮反应物,氮反应物与样品材料12的一部分结合并消耗,以形成氮化物膜(35,45)。 通过氮化氮在氮化物薄膜(35,45)上的化学气相沉积来形成较厚的氮化物膜(37,47)。
    • 59. 发明授权
    • Process and system for the photoelectrochemical etching of silicon in an
anhydrous environment
    • 在无水环境下对硅进行光电化学蚀刻的工艺和系统
    • US5348627A
    • 1994-09-20
    • US61090
    • 1993-05-12
    • Eric K. PropstPaul A. Kohl
    • Eric K. PropstPaul A. Kohl
    • C25F3/12C25F3/14H01L21/3063B23H3/00
    • H01L21/3063C25F3/12C25F3/14
    • The photoelectrochemical oxidation and dissolution of silicon (Si) is performed in the absence of water and oxygen. Etch rates and photocurrents in an anhydrous HF-acetonitrile (MeCN) solution are directly proportional to light intensity up to at least 600 mW/cm.sup.2, producing a spatially selective etch rate of greater than 4 .mu.m/min. Four electron transfer reactions per silicon molecule occur with a quantum yield greater than 3.3 due to electron injection from high energy reaction intermediates. Further, the electrochemical oxidation of p-doped silicon in HF-MeCN results in the formation of porous silicon which electroluminescence in an aqueous solution. In an aprotic electrolyte, where tetrabutylammonium tetrafluoroborate (TBAFB) is used as both the supporting electrolyte and source of fluoride in MeCN, photo-induced etching of n-doped silicon occurs at quantum efficiency of 1.9. This indicates that the oxidation and dissolution mechanism of Si in MeCN can occur without protons.
    • 硅(Si)的光电化学氧化和溶解在没有水和氧的情况下进行。 在无水HF-乙腈(MeCN)溶液中的蚀刻速率和光电流与高达至少600mW / cm 2的光强度成正比,产生大于4μm/ min的空间选择性蚀刻速率。 由于高能反应中间体的电子注入,每硅分子发生四个电子转移反应,其量子产率大于3.3。 此外,p-doped硅在HF-MeCN中的电化学氧化导致在水溶液中电致发光的多孔硅的形成。 在非质子电解质中,使用四丁基铵四氟硼酸盐(TBAFB)作为MeCN中的支持电解质和氟化物源,对n掺杂硅的光致蚀刻以量子效率为1.9发生。 这表明Si在MeCN中的氧化和溶解机理不会发生质子。