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    • 58. 发明授权
    • Ion beam processing apparatus
    • 离子束处理装置
    • US07700931B2
    • 2010-04-20
    • US11674262
    • 2007-02-13
    • Hiroyasu ShichiSatoshi TomimatsuNoriyuki KaneokaKaoru UmemuraKoji Ishiguro
    • Hiroyasu ShichiSatoshi TomimatsuNoriyuki KaneokaKaoru UmemuraKoji Ishiguro
    • G21K5/10H01J37/08A61N5/00G21G5/00G21K7/00G01N23/00
    • H01J37/261H01J37/20H01J37/3045H01J2237/08H01J2237/20207H01J2237/24528H01J2237/28H01J2237/31713H01J2237/3174H01J2237/31749
    • The present invention provides an ion beam processing technology for improving the precision in processing a section of a sample using an ion beam without making a processing time longer than a conventionally required processing time, and for shortening the time required for separating a micro test piece without breaking the sample or the time required for making preparations for the separation. An ion beam processing apparatus is structured so that an axis along which an ion beam is drawn out of an ion source and an ion beam irradiation axis along which the ion beam is irradiated to a sample mounted on a first sample stage will meet at an angle. Furthermore, the ion beam processing apparatus has a tilting ability to vary an angle of irradiation, at which the ion beam is irradiated to the sample, by rotating a second sample stage, on which a test piece extracted from the sample by performing ion beam processing is mounted, about the tilting axis of the second sample stage. The ion beam processing apparatus is structured so that a segment drawn by projecting the axis, along which the ion beam is drawn out of the ion source, on a plane perpendicular to the ion beam irradiation axis can be at least substantially parallel to a segment drawn by projecting the tilting axis of the second sample stage on the plane perpendicular to the ion beam irradiation axis.
    • 本发明提供了一种离子束处理技术,用于提高使用离子束处理样品的一部分的精度,而不需要比常规所需的处理时间长的处理时间,并且缩短了分离微测试件所需的时间,而没有 打破样品或准备分离所需的时间。 离子束处理装置被构造成使得离子束从离子源拉出的轴和离子束照射到安装在第一样品台上的样品的离子束照射轴将以一定角度相遇 。 此外,离子束处理装置具有通过旋转第二样品台而使离子束照射到样品上的照射角度的倾斜能力,通过进行离子束处理从样品中提取试验片 围绕第二样品台的倾斜轴安装。 离子束处理装置被构造成使得通过将离子束从离子源拉出的轴在垂直于离子束照射轴线的平面上突出的拉伸而绘制的区段可以至少基本上平行于拉伸的区段 通过将第二样品台的倾斜轴投影在垂直于离子束照射轴的平面上。
    • 60. 发明授权
    • Surface analysis method and apparatus for carrying out the same
    • 表面分析方法及其执行装置
    • US5481109A
    • 1996-01-02
    • US211575
    • 1994-04-11
    • Ken NinomiyaHideo TodokoroTokuo KureYasuhiro MitsuiKatsuhiro KurodaHiroyasu Shichi
    • Ken NinomiyaHideo TodokoroTokuo KureYasuhiro MitsuiKatsuhiro KurodaHiroyasu Shichi
    • G01N23/225H01J37/252G01N23/223
    • G01N23/2252H01J37/252G01N2223/076H01J2237/24415
    • A surface analysis method and an apparatus for carrying out the samein which the method involves the detection of fluorescence X-rays emitted from the surface of a sample in response to a finely focused electron beam irradiated thereto, whereby residues on the sample surface are analyzed qualitatively and quantitatively. An electron beam (1) is irradiated through a hole (9) at the center of an X-ray detector (8) into a fine hole (h) on the surface of a sample (2). In response, fluorescence X-rays are emitted from inside the fine hole (h) and are detected by an annular X-ray detector (8) having an energy analysis function near the axis of the electron beam (1) (preferably within 20 degrees with respect to the center axis of the electron beam). This arrangement allows the fluorescence X-rays from the fine hole (h) to reach the X-ray detector (8) without being absorbed by the substance of the material. That in turn ensures qualitative and quantitative analysis of high accuracy about residues in fine holes of large aspect ratios. Since the method is of non-destructive nature, the analyzed sample may be placed unscathed back into the fabrication process.
    • PCT No.PCT / JP93 / 01373 Sec。 371日期1994年04月11日 102(e)日期1994年4月11日PCT提交1993年9月27日PCT公布。 出版物WO94 / 08232 日期1994年4月14日。表面分析方法及其实施方法涉及检测从样品表面发射的荧光X射线,其响应于照射到其上的精细聚焦的电子束,由此残留物 对样品表面进行定性和定量分析。 电子束(1)通过X射线检测器(8)的中心的孔(9)照射到样品(2)的表面上的细孔(h)中。 作为响应,从细孔(h)内部发射荧光X射线,并且通过在电子束(1)的轴附近具有能量分析功能的环形X射线检测器(8)来检测(优选在20度以内) 相对于电子束的中心轴)。 这种布置允许来自细孔(h)的荧光X射线到达X射线检测器(8)而不被材料的物质吸收。 这反过来又确保了对大长宽比的细孔中残留物的高精度的定性和定量分析。 由于该方法具有非破坏性,所以分析的样品可以无损地放置在制造过程中。