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51. 发明申请

US20120043209A1 MICROFLUIDIC CONTROL APPARATUS AND OPERATING METHOD THEREOF 审中-公开
标题翻译：微流控制装置及其操作方法
公开(公告)号：US20120043209A1
公开(公告)日：2012-02-23
申请号：US13212596
申请日：2011-08-18
申请人： Cheng-Hsien Liu , William Wang , Long Hsu , Yuh-Shyong Yang , Hwan-You Chang , Shih-Mo Yang , Chung-Cheng Chou
发明人： Cheng-Hsien Liu , William Wang , Long Hsu , Yuh-Shyong Yang , Hwan-You Chang , Shih-Mo Yang , Chung-Cheng Chou
IPC分类号： G01N27/447 , B01D21/00 , G01N27/453
CPC分类号： B01L3/50273 , B01D21/0009 , B01L3/502761 , B01L2200/14 , B01L2300/0816 , B01L2300/089 , B01L2400/0418 , B01L2400/082 , G01N35/1095
摘要： A microfluidic control apparatus and operating method thereof. The microfluidic control apparatus includes a photoconductive material layer and a flow passage. When a light with a specific optical pattern is emitted toward the photoconductive material layer, at least three virtual electrodes are formed on the photoconductive material layer according to the specific optical pattern. The at least three virtual electrodes include a first virtual electrode, a second virtual electrode and a third virtual electrode disposed beside the first virtual electrode. There is a specific proportion among a distance between first virtual electrode and third virtual electrode, a width of first virtual electrode, a distance between first virtual electrode and second virtual electrode, and a width of second virtual electrode. When the specific optical pattern changes, the at least three virtual electrodes also change to generate an electro-osmotic force to control the moving state of a microfluid in a flow passage.
摘要翻译：一种微流控制装置及其操作方法。微流控制装置包括光导材料层和流路。当向光导材料层发射具有特定光学图案的光时，根据特定光学图案在光导材料层上形成至少三个虚拟电极。所述至少三个虚拟电极包括设置在第一虚拟电极旁边的第一虚拟电极，第二虚拟电极和第三虚拟电极。在第一虚拟电极和第三虚拟电极之间的距离，第一虚拟电极的宽度，第一虚拟电极和第二虚拟电极之间的距离以及第二虚拟电极的宽度之间存在特定比例。当特定光学图案改变时，至少三个虚拟电极也改变以产生电渗压力以控制流路中微流体的移动状态。

52. 发明申请

US20100129963A1 INTEGRATED CIRCUIT PACKAGE AND FABRICATING METHOD THEREOF 有权
标题翻译：集成电路封装及其制作方法
公开(公告)号：US20100129963A1
公开(公告)日：2010-05-27
申请号：US12694239
申请日：2010-01-26
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L21/60
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要翻译：本发明公开了一种集成电路封装。集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。多个导电线设置在基板的第二表面的一部分上。半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。第一散热层设置在第一孔中并延伸到腔室中。还提供了一种用于制造集成电路封装的方法。

53. 发明申请

US20090097119A1 DIFFRACTION MICRO FLOW STRUCTURE AND OPTICAL TWEEZERS USING THE SAME 审中-公开
标题翻译：衍射微流化结构和光学二极管使用相同
公开(公告)号：US20090097119A1
公开(公告)日：2009-04-16
申请号：US12143943
申请日：2008-06-23
申请人： Chen Peng , William Wang , Chung-Cheng Chou , Fung-Hsu Wu , Long Hsu , Cheng-Hsien Liu , Sheng-Yang Tseng
发明人： Chen Peng , William Wang , Chung-Cheng Chou , Fung-Hsu Wu , Long Hsu , Cheng-Hsien Liu , Sheng-Yang Tseng
IPC分类号： G02B27/42
CPC分类号： G02B21/32 , G02B27/42 , G02B27/4233
摘要： A diffraction micro flow structure and optical tweezers using the same are provided. The diffraction micro flow structure comprises a substrate and a diffraction part. The substrate comprises at least a flow path. The diffraction part is disposed on the substrate. The diffraction part comprises a diffraction optical element. After light passes through the diffraction optical element, the light is focused in the flow path and forms an optical field.
摘要翻译：提供衍射微流结构和使用其的光学镊子。衍射微流结构包括基底和衍射部分。衬底包括至少一个流动路径。衍射部分设置在基板上。衍射部分包括衍射光学元件。光通过衍射光学元件后，光在流路中聚焦并形成光场。

54. 发明申请

US20080186801A1 BUBBLE MICRO-PUMP AND TWO-WAY FLUID-DRIVING DEVICE, PARTICLE-SORTING DEVICE, FLUID-MIXING DEVICE, RING-SHAPED FLUID-MIXING DEVICE AND COMPOUND-TYPE FLUID-MIXING DEVICE USING THE SAME 审中-公开
标题翻译：泡沫微型泵和双向流体驱动装置，颗粒分离装置，流体混合装置，环形流体混合装置和使用该混合装置的复合型流体混合装置
公开(公告)号：US20080186801A1
公开(公告)日：2008-08-07
申请号：US12014813
申请日：2008-01-16
申请人： Cheng-Hsien Liu , Long Hsu , Chih-Ming Cheng , Sheng-Hung Chiu , Wai William Wang , Chung-Cheng Chou
发明人： Cheng-Hsien Liu , Long Hsu , Chih-Ming Cheng , Sheng-Hung Chiu , Wai William Wang , Chung-Cheng Chou
IPC分类号： B01F13/00 , B01F3/08 , B01F15/02 , F04B17/00
CPC分类号： B01F13/0059 , B01F5/10 , B01F11/0071 , F04B17/00 , F04B19/006 , F04B19/24
摘要： A bubble micro-pump includes a first component, a second component and a bubble-generating unit. The first component includes a flow path having a first area and a second area. The second component above the first component has a first roughness surface and a second roughness surface. The first roughness surface opposite the first area has a first roughness factor, and the second roughness surface opposite the second area has a second roughness factor smaller than the first roughness factor. The bubble-generating unit on the first component generates bubble in the first area and the second area when a fluid fills the vacancy between the first component and the second component. Due to the difference in roughness factor, the backfilling velocity of the fluid in the first area is faster than that in the second area when the bubble starts to vanish, such that the fluid is driven to flow.
摘要翻译：气泡微型泵包括第一部件，第二部件和气泡发生单元。第一部件包括具有第一区域和第二区域的流动路径。第一部件上方的第二部件具有第一粗糙度表面和第二粗糙度表面。与第一区域相对的第一粗糙表面具有第一粗糙度因子，并且与第二区域相对的第二粗糙度表面具有小于第一粗糙度因子的第二粗糙度因子。当第一部件和第二部件之间的空隙充满时，第一部件上的气泡发生单元在第一区域和第二区域中产生气泡。由于粗糙度因子的差异，当气泡开始消失时，第一区域中的流体的回填速度比第二区域的回填速度快，使得流体被驱动流动。

55. 发明申请

US20080032593A1 EYE MODULE AND FACIAL EXPRESSION MODULE AND DISPLAY METHOD THEREOF 审中-公开
标题翻译：眼部模块和面部表情模块及其显示方法
公开(公告)号：US20080032593A1
公开(公告)日：2008-02-07
申请号：US11830895
申请日：2007-07-31
申请人： Chung-Cheng Chou , Wai William Wang
发明人： Chung-Cheng Chou , Wai William Wang
IPC分类号： A63H3/40 , G02B3/14
CPC分类号： A63H3/40 , G02B3/14 , G02B26/004
摘要： An eye module and a facial expression module and a display method thereof are provided. The eye module at least includes a transparent casing and an eye element. The eye element is disposed inside the transparent casing for representing a pupil of the eye module. The eye element includes a conductive liquid, a first electrode and a second electrode. The conductive liquid is for representing the pupil. The first electrode is coupled with the conductive liquid. The second electrode is electrically isolated from the first electrode and the conductive liquid. The first electrode and the second electrode generate a first voltage difference in the conductive liquid to cause the deformation, expansion or displacement of the conductive liquid. As a result, the pupil is changed accordingly.
摘要翻译：提供了眼模块和面部表情模块及其显示方法。眼睛模块至少包括透明外壳和眼睛元件。眼元件设置在透明外壳内部，用于表示眼睛模块的瞳孔。眼元件包括导电液体，第一电极和第二电极。导电液体用于表示瞳孔。第一电极与导电液体相连。第二电极与第一电极和导电液体电隔离。第一电极和第二电极在导电液体中产生第一电压差，导致导电液体的变形，膨胀或位移。结果，学生相应地改变了。

56. 发明申请

US20120033211A1 LARGE AREA OPTICAL DIAGNOSIS APPARATUS AND OPERATING METHOD THEREOF 有权
标题翻译：大面积光学诊断装置及其操作方法
公开(公告)号：US20120033211A1
公开(公告)日：2012-02-09
申请号：US13204132
申请日：2011-08-05
申请人： William Wang , Chung-Cheng Chou , Che-Liang Tsai
发明人： William Wang , Chung-Cheng Chou , Che-Liang Tsai
IPC分类号： G01N21/55 , G01J3/28
CPC分类号： G01N21/4795 , A61B5/0066 , A61B5/0073 , G01B9/02019 , G01B9/02027 , G01B9/02091 , G01B2290/45
摘要： A large area optical diagnosis apparatus and the operating method thereof are disclosed. The large area optical diagnosis apparatus includes a light source, a light path structure, and a sensing module. The light source is used to at least emit a coherent light. The light path structure includes a plurality of optical units used for dividing the coherent light into a plurality of first incident lights and a plurality of second incident lights. The plurality of first incident lights are emitted toward an object to be diagnosed and the plurality of second incident lights are emitted toward a reference end. The object to be diagnosed and the reference end reflect the plurality of first incident lights and the plurality of second incident lights to be a plurality of reflected lights. The sensing module senses the plurality of reflected lights to generate a sensing result related to the object to be diagnosed.
摘要翻译：公开了一种大面积光诊断装置及其操作方法。大面积光诊断装置包括光源，光路结构和感测模块。光源用于至少发出相干光。光路结构包括用于将相干光分为多个第一入射光和多个第二入射光的多个光学单元。多个第一入射光朝向被诊断对象发射，并且多个第二入射光朝向参考端发射。要诊断的对象和参考端将多个第一入射光和多个第二入射光反射成多个反射光。感测模块感测多个反射光以产生与被诊断对象相关的感测结果。

57. 发明申请

US20110306835A1 ENDOSCOPY APPARATUS HAVING HIGH DEGREE OF MOTION FREEDOM AND OPERATING METHOD THEREOF 审中-公开
标题翻译：具有高运动自由度的内窥镜装置及其操作方法
公开(公告)号：US20110306835A1
公开(公告)日：2011-12-15
申请号：US13157832
申请日：2011-06-10
申请人： Chung-Cheng Chou , William Wang
发明人： Chung-Cheng Chou , William Wang
IPC分类号： A61B1/005
CPC分类号： A61B1/008 , A61B1/0051 , A61B1/0125
摘要： An endoscopy apparatus having high degree of motion freedom and the operating method thereof are disclosed. The endoscopy apparatus having high degree of motion freedom includes a multi-stage endoscopy module and a control module. The multi-stage endoscopy module includes at least a first endoscopy unit and a second endoscopy unit. The first endoscopy unit and the second endoscopy unit can provide a first bending and a second bending respectively. The second bending is larger than the first bending. When the multi-stage endoscopy module moves to a region near a target observing position, the control module will control the second endoscopy unit to generate slight deformation to observe a real-time state of the target observing position.
摘要翻译：公开了具有高自由度的内窥镜装置及其操作方法。具有高度运动自由度的内窥镜检查装置包括多级内窥镜检查模块和控制模块。所述多级内窥镜检查模块至少包括第一内窥镜检查单元和第二内窥镜检查单元。第一内镜检查单元和第二内窥镜检查单元可以分别提供第一弯曲和第二弯曲。第二次弯曲大于第一次弯曲。当多级内窥镜模块移动到目标观察位置附近的区域时，控制模块将控制第二内窥镜单元产生轻微的变形以观察目标观察位置的实时状态。

58. 发明授权

US07838819B2 Apparatus and method of generating optical tweezers with momentum 有权
标题翻译：用动力产生光学镊子的装置和方法
公开(公告)号：US07838819B2
公开(公告)日：2010-11-23
申请号：US12019316
申请日：2008-01-24
申请人： Long Hsu , Cheng-Hsien Liu , Sheng-Yang Tseng , Chung-Cheng Chou , Wai William Wang , Fung-Hsu Wu , Chen Peng , Ta-Yuan Lee
发明人： Long Hsu , Cheng-Hsien Liu , Sheng-Yang Tseng , Chung-Cheng Chou , Wai William Wang , Fung-Hsu Wu , Chen Peng , Ta-Yuan Lee
IPC分类号： H01S1/00 , H01S3/00 , H05H3/02
CPC分类号： G02B21/32 , G02B5/1842 , G02B21/0088
摘要： An apparatus of generating optical tweezers with momentum is provided for providing optical tweezers with a first momentum on a test piece. The apparatus comprises a laser source, a diffractive optical element (DOE) and a lens. The laser source is for outputting a laser beam. The DOE has a first phase-delay picture, and the laser beam forms a diffraction pattern after passing the first phase-delay picture. The lens is for receiving and focusing the diffraction pattern on the test piece to form the first optical tweezers with the first momentum. The lens has an optical axis intersecting the DOE at an optical intersection point, a geometric center of the phase-delay picture has a displacement vector relative to the optical intersection point and a direction of the first momentum is related to a direction of the displacement vector.
摘要翻译：提供产生具有动量的光学镊子的装置，用于在测试片上提供具有第一动量的光学镊子。该装置包括激光源，衍射光学元件（DOE）和透镜。激光源用于输出激光束。 DOE具有第一相位延迟图像，并且激光束在通过第一相位延迟图像之后形成衍射图案。透镜用于接收和聚焦在测试片上的衍射图案以形成具有第一动量的第一光学镊子。透镜在光学交点处具有与DOE相交的光轴，相位延迟图像的几何中心具有相对于光学交叉点的位移矢量，并且第一动量的方向与位移矢量的方向相关。

59. 发明授权

US07829388B2 Integrated circuit package and fabricating method thereof 有权
标题翻译：集成电路封装及其制造方法
公开(公告)号：US07829388B2
公开(公告)日：2010-11-09
申请号：US12694239
申请日：2010-01-26
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L21/00
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要翻译：本发明公开了一种集成电路封装。集成电路封装包括具有第一表面和与其相对的第二表面的基板以及从第一表面到第二表面穿过基板的第一孔。多个导电线设置在基板的第二表面的一部分上。半导体芯片设置在衬底的第二表面上方，其中在半导体芯片和衬底之间形成腔室。多个接合焊盘设置在半导体芯片的朝向衬底的第二表面的一侧上，其中至少一个接合焊盘电连接到多条导线之一。第一散热层设置在第一孔中并延伸到腔室中。还提供了一种用于制造集成电路封装的方法。

60. 发明授权

US07804169B2 Integrated circuit package and fabricating method thereof 有权
公开(公告)号：US07804169B2
公开(公告)日：2010-09-28
申请号：US12102439
申请日：2008-04-14
申请人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
发明人： Chin-Yung Chen , Chia-Hung Hsu , William Wang , Chung-Cheng Chou
IPC分类号： H01L23/10
CPC分类号： H01L23/3735 , H01L23/3677 , H01L24/48 , H01L2224/16 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

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