专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明申请

US20120085574A1 Heat radiating substrate and method of manufacturing the same 审中-公开
标题翻译：散热基板及其制造方法
公开(公告)号：US20120085574A1
公开(公告)日：2012-04-12
申请号：US13064364
申请日：2011-03-21
申请人： Ji Hyun Park , Tae Hoon Kim , Sang Hyun Shin , Ki Ho Seo , Cheol Ho Heo , Young Ki Lee
发明人： Ji Hyun Park , Tae Hoon Kim , Sang Hyun Shin , Ki Ho Seo , Cheol Ho Heo , Young Ki Lee
IPC分类号： H05K1/14 , H05K3/42
CPC分类号： H05K3/44 , H05K1/0203 , H05K1/053 , H05K3/202 , H05K3/4053 , H05K2201/0355 , H05K2201/0394 , H05K2203/0315 , Y10T29/49165
摘要： Provided are a heat radiating substrate and a method of manufacturing the same. The heat radiating substrate includes a substrate having a via-hole, an anode oxide layer formed on the entire surface of the substrate having the via-hole through an anodizing process, a first circuit pattern formed on the substrate on which the anode oxide layer is formed, and a second circuit pattern formed at a lower part of the via-hole to be connected to the via-hole. Therefore, it is possible to simplify a circuit forming process and readily manufacture the heat radiating substrate by applying a metal anodic bonding process, without using a conventional adhesion layer and metal seed when the heat radiating substrate is manufactured.
摘要翻译：提供一种散热基板及其制造方法。散热基板包括具有通孔的基板，通过阳极氧化处理形成在具有通孔的基板的整个表面上的阳极氧化层，形成在基板上的阳极氧化物层为阳极氧化层以及形成在通孔的下部以连接到通孔的第二电路图案。因此，通过在制造散热基板时不使用常规的粘合层和金属种子，通过施加金属阳极接合工艺来简化电路形成工艺并容易地制造散热基板。

52. 发明申请

US20120043875A1 RADIANT HEAT SUBSTRATE AND METHOD FOR MANUFACTURING THE RADIANT HEAT SUBSTRATE, AND LUMINOUS ELEMENT PACKAGE WITH THE RADIANT HEAT SUBSTRATE 失效
标题翻译：辐射热基板和制造辐射热基板的方法以及具有辐射热基板的发光元件封装
公开(公告)号：US20120043875A1
公开(公告)日：2012-02-23
申请号：US12964285
申请日：2010-12-09
申请人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
发明人： Ki Ho Seo , Tae Hoon Kim , Sang Hyun Shin , Cheol Ho Heo , Young Ki Lee , Ji Hyun Park
IPC分类号： H01J7/24 , H01R43/00
CPC分类号： H01L33/641 , H01L23/3677 , H01L23/3735 , H01L23/3736 , H01L33/642 , H01L2224/48227 , H01L2224/73265 , H01L2933/0075 , H01S5/02276 , H01S5/02476 , Y10T29/49117
摘要： The present invention provides a radiant heat substrate comprising: a conductive substrate which is formed of a metal material and includes a front surface having a luminous element mounted thereon and a rear surface opposed to the front surface; an insulating film which covers the front surface of the conductive substrate; a metal oxide film which covers the rear surface of the conductive substrate; and a metal pattern which covers the insulating film, wherein the metal pattern comprises: a heat transfer pad which is bonded to the luminous element; and a circuit line which is disposed at a region except from the mounting region of the luminous element and is electrically connected to the luminous element.
摘要翻译：本发明提供了一种辐射热衬底，包括：导电衬底，其由金属材料形成并且包括具有安装在其上的发光元件的前表面和与前表面相对的后表面; 覆盖导电性基板的前表面的绝缘膜; 覆盖导电性基板的背面的金属氧化物膜; 以及覆盖绝缘膜的金属图案，其中所述金属图案包括：传热垫，其接合到所述发光元件; 以及电路线，其设置在除了所述发光元件的安装区域以外的区域，并且与所述发光元件电连接。

53. 发明授权

US08052554B2 Arrow for hunting 有权
标题翻译：箭狩猎
公开(公告)号：US08052554B2
公开(公告)日：2011-11-08
申请号：US12770266
申请日：2010-04-29
申请人： Young Ki Lee
发明人： Young Ki Lee
IPC分类号： F42B6/08
CPC分类号： F42B6/06 , F42B6/08
摘要： Disclosed herein is an arrow for hunting. The arrow includes an arrow shaft having a predetermined length and including a nock on one end and a shaft threaded part in the other end. A plurality of feathers is positioned to be adjacent to the nock of the arrow shaft. A connector includes a connecting threaded part fastened to the shaft threaded part, a stopper, and a penetration threaded part. An arrowhead is connected to the connector in such a way as to be opposite to the connecting threaded part. A penetration rotary unit has a threaded part to be fastened to the penetration threaded part of the connector, is shorter than the penetration threaded part, and has wings. A spring is positioned between the stopper and the penetration rotary unit, and provides a restoring force to bias the penetration rotary unit toward the arrowhead.
摘要翻译：这里公开了一种狩猎的箭头。箭头包括具有预定长度的箭头轴，并且在另一端包括一端的一个孔和一个轴螺纹部分。多个羽毛被定位成与箭头轴的nock相邻。连接器包括紧固到轴螺纹部分的连接螺纹部分，止动件和穿透螺纹部分。箭头以与连接螺纹部分相对的方式连接到连接器。穿透旋转单元具有要紧固到连接器的穿透螺纹部分的螺纹部分，比穿透螺纹部分短，并且具有翼部。弹簧定位在止动器和穿透旋转单元之间，并且提供恢复力以将穿透旋转单元偏向箭头。

54. 发明授权

US08030762B2 Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
标题翻译：具有阳极氧化绝缘层的发光二极管封装及其制造方法
公开(公告)号：US08030762B2
公开(公告)日：2011-10-04
申请号：US11730966
申请日：2007-04-05
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L23/34 , H01L33/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

55. 发明授权

US07998879B2 Insulation structure for high temperature conditions and manufacturing method thereof 有权
标题翻译：高温条件的绝缘结构及其制造方法
公开(公告)号：US07998879B2
公开(公告)日：2011-08-16
申请号：US11723236
申请日：2007-03-19
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L21/31
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H05K3/28 , H05K2203/0315 , H05K2203/0542
摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.
摘要翻译：一种用于高温条件的绝缘结构及其制造方法。在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

56. 发明申请

US20110083885A1 METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：包含电镀镍镀层的金属接线结构及其制造方法
公开(公告)号：US20110083885A1
公开(公告)日：2011-04-14
申请号：US12630478
申请日：2009-12-03
申请人： Tae Hyun KIM , Seog Moon Choi , Tae Hoon Kim , Sang Hyun Shin , Young Ki Lee , Sung Keun Park
发明人： Tae Hyun KIM , Seog Moon Choi , Tae Hoon Kim , Sang Hyun Shin , Young Ki Lee , Sung Keun Park
IPC分类号： H05K1/09 , B05D5/12
CPC分类号： H05K3/38 , C23C18/1651 , C23C18/1653 , C23C18/1893 , C23C18/2086 , C23C18/32 , C25D5/10 , H01L23/142 , H01L23/498 , H01L24/03 , H01L24/05 , H01L2224/03828 , H01L2224/0401 , H01L2224/0558 , H01L2224/05639 , H01L2224/05644 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/15787 , H05K1/053 , H05K3/24 , H05K3/244 , H05K3/282 , H05K2201/09436 , H05K2203/072 , H01L2924/00
摘要： Disclosed herein is a metal wiring structure, including: an electroless nickel plating layer formed on an insulation layer; and a surface treatment layer formed on the electroless nickel plating layer, and a method of fabricating the same. The metal wiring structure has excellent adhesivity without regard to the kind of substrate and can be easily fabricated.
摘要翻译：这里公开了一种金属布线结构，包括：形成在绝缘层上的无电镀镍层; 以及形成在无电镀镍层上的表面处理层及其制造方法。金属布线结构具有优异的粘附性，而不考虑基板的种类并且可以容易地制造。

57. 发明授权

US07566912B2 Light emitting diode package 有权
标题翻译：发光二极管封装
公开(公告)号：US07566912B2
公开(公告)日：2009-07-28
申请号：US11717154
申请日：2007-03-13
申请人： Young Ki Lee , Seon Goo Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seon Goo Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/16 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/01078 , H01L2924/00014
摘要： A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.
摘要翻译：发光二极管封装，散热优良，易于制造。在发光二极管封装中，Al衬底上形成有反射杯。至少一个发光二极管芯片设置在反射杯的底表面上。 Al阳极氧化膜延伸穿过Al衬底，以将反射杯的底表面分成多个衬底电极。这里，至少一个基板电极被Al阳极氧化膜包围。此外，基板电极分别连接到发光二极管芯片。

58. 发明申请

US20070235743A1 Light emitting diode package having anodized insulation layer and fabrication method therefor 有权
标题翻译：具有阳极氧化绝缘层的发光二极管封装及其制造方法
公开(公告)号：US20070235743A1
公开(公告)日：2007-10-11
申请号：US11730966
申请日：2007-04-05
申请人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Sang Hyun Shin
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

59. 发明授权

US07268014B2 Fabrication method of light emitting diode package 有权
标题翻译：发光二极管封装的制造方法
公开(公告)号：US07268014B2
公开(公告)日：2007-09-11
申请号：US11314003
申请日：2005-12-22
申请人： Young Ki Lee , Seog Moon Choi , Yong Sik Kim , Sang Hyun Shin
发明人： Young Ki Lee , Seog Moon Choi , Yong Sik Kim , Sang Hyun Shin
IPC分类号： H01L21/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/16245 , H01L2224/48247 , H01L2924/01322 , H01L2924/12041 , H01L2933/0075 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.
摘要翻译：本发明提供一种用于容易地制造具有优异散热特性的LED封装的LED封装的制造方法。在该方法中，制备具有形成在凹部中的凹部和反射表面的金属封装基板，并且将封装基板选择性地阳极氧化并分成彼此分开的两个封装电极部分。然后，将发光装置安装在凹部的底部。优选地，封装衬底是由Al或Al基金属制成的金属衬底。

60. 发明授权

US06488730B2 Polishing composition 有权
标题翻译：抛光组成
公开(公告)号：US06488730B2
公开(公告)日：2002-12-03
申请号：US09850209
申请日：2001-05-07
申请人： Kil Sung Lee , Jae Seok Lee , Seok Jin Kim , Young Ki Lee , Tu Won Chang
发明人： Kil Sung Lee , Jae Seok Lee , Seok Jin Kim , Young Ki Lee , Tu Won Chang
IPC分类号： B24D300
CPC分类号： H01L21/31053
摘要： The present invention relates to a polishing composition comprising 30 to 99 wt % of deionized water, 0.1 to 50 wt % of powder of metallic oxide and 0.01 to 20 wt % of cyclic amine. This polishing composition can be used in a chemical mechanical polishing of thin films in integrated circuit manufacturing and has an effect of minimizing the occurrence of microscratches on the thin film after polishing. Thereby it can be applied to the manufacturing process of highly integrated circuits such as Shallow Trench Isolation.
摘要翻译：本发明涉及一种抛光组合物，其包含30-99重量％的去离子水，0.1-50重量％的金属氧化物粉末和0.01-20重量％的环胺。该抛光组合物可用于集成电路制造中的薄膜的化学机械抛光，并且具有最小化抛光后薄膜上的微细纹差的发生的效果。因此，它可以应用于诸如浅沟槽隔离的高度集成电路的制造过程。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式