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51. 发明授权

US6108618A Method for optically transmitting signals in measurement units and measurement system employing the optical transmission method 有权
标题翻译：在测量单元中光学传输信号的方法和采用光传输方法的测量系统
公开(公告)号：US6108618A
公开(公告)日：2000-08-22
申请号：US365417
申请日：1999-08-02
申请人： Masaru Fujii , Minoru Tanaka
发明人： Masaru Fujii , Minoru Tanaka
IPC分类号： H04B10/07 , H04B10/278 , H04B10/80 , G01B15/00
CPC分类号： H04B10/803 , H04B10/07 , H04B10/278
摘要： A measurement device including a measurement unit, a signal processing unit having a serial interface and connected to the measurement unit for processing signals obtained at the measurement unit, and a photocoupler connected to the serial interface of the signal processing unit for converting processed signals into the optical information, is disclosed. A measurement system made up of a plurality of the measurement devices and a method for measuring an object using the measurement device are also disclosed.
摘要翻译：一种测量装置，包括测量单元，具有串行接口并连接到测量单元的信号处理单元，用于处理在测量单元处获得的信号，以及光耦合器，连接到信号处理单元的串行接口，用于将处理后的信号转换为光学信息被公开。还公开了由多个测量装置构成的测量系统和使用测量装置测量物体的方法。

52. 发明授权

US6094268A Projection exposure apparatus and projection exposure method 失效
标题翻译：投影曝光装置和投影曝光方法
公开(公告)号：US6094268A
公开(公告)日：2000-07-25
申请号：US315841
申请日：1994-09-30
申请人： Yoshitada Oshida , Tetsuzo Tanimoto , Minoru Tanaka
发明人： Yoshitada Oshida , Tetsuzo Tanimoto , Minoru Tanaka
IPC分类号： G03F7/207 , G03F9/00 , G01B11/14
CPC分类号： G03F9/7049
摘要： A projection exposure apparatus (1) comprises an incident light optical system for causing the light emitted from a light source 1 to enter an object of exposure (4) in diagonal direction, a detection apparatus (3) for causing an interference between the light reflected from the object of exposure (4) and a reference light and detecting the resultant interference fringe, a processing circuit for determining the inclination and height of the surface of the object of exposure (4) from the optical information on the interference fringe, and a stage (7) for supporting the object of exposure (4). The object of exposure (4) is subjected to projection exposure by driving the stage (7) according to the calculated inclination and height of the object of exposure (4).
摘要翻译：投影曝光装置（1）包括入射光学系统，用于使从光源1发射的光在对角线方向进入曝光对象（4）;检测装置（3），用于使反射光从曝光对象（4）和参考光中检测所得的干涉条纹，处理电路用于根据干涉条纹的光学信息确定曝光物体（4）的表面的倾斜度和高度，以及舞台（7）支持曝光对象（4）。曝光对象（4）通过根据计算出的曝光对象的倾斜度和高度来驱动舞台（7）进行投影曝光（4）。

53. 发明授权

US5868949A Metalization structure and manufacturing method thereof 失效
标题翻译：金属化结构及其制造方法
公开(公告)号：US5868949A
公开(公告)日：1999-02-09
申请号：US557320
申请日：1995-11-14
申请人： Hideo Sotokawa , Masashi Nishiki , Eiji Matsuzaki , Hidetaka Shigi , Toshio Terouchi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka
发明人： Hideo Sotokawa , Masashi Nishiki , Eiji Matsuzaki , Hidetaka Shigi , Toshio Terouchi , Mamoru Ogihara , Haruhiko Matsuyama , Minoru Tanaka
IPC分类号： C08G73/10 , H01L23/498 , H05K1/03 , H05K1/11 , H05K3/46 , B44C1/22
CPC分类号： H05K1/112 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/0154 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/10674 , H05K3/4605 , Y10T428/24917
摘要： A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.
摘要翻译：一种金属化结构，其具有在下层的表面上的第一导体层，并且还具有与第一导体层导电连接的第二导体层，其中热膨胀系数低的聚酰亚胺绝缘膜存在于第一导体层的至少一端第二导体层和第一导体层的图案，用于稳定地获得高可靠性的金属化结构，并且不会导致导体部分从基板剥离或者发生开裂到下层。

54. 外观设计

USD373458S Shoe sole 失效
公开(公告)号：USD373458S
公开(公告)日：1996-09-10
申请号：US29820
申请日：1994-10-18
申请人： Minoru Tanaka , Tsutomu Otani
设计人： Minoru Tanaka , Tsutomu Otani

55. 外观设计

USD368795S Shoe sole 失效
公开(公告)号：USD368795S
公开(公告)日：1996-04-16
申请号：US32379
申请日：1994-11-04
申请人： Minoru Tanaka , Yutaka Nagai
设计人： Minoru Tanaka , Yutaka Nagai

56. 发明授权

US5401107A Component of printing head for wire-impact type dot printer and molding method thereof 失效
标题翻译：用于线冲击式点阵式打印机的打印头的组件及其成型方法
公开(公告)号：US5401107A
公开(公告)日：1995-03-28
申请号：US206920
申请日：1994-03-04
申请人： Kiyofumi Koike , Minoru Tanaka
发明人： Kiyofumi Koike , Minoru Tanaka
IPC分类号： B22F3/22 , B22F7/06 , B41J2/235 , B41J2/27
CPC分类号： B22F3/225 , B22F7/062 , B41J2/235 , B22F2998/00
摘要： Disclosed are a magnetic circuit component of an impact dot head and a molding method thereof by which the number of parts is reduced, and an excellent magnetic efficiency is exhibited.At least one member among a plurality of members constituting a magnetic circuit component (e.g., a core block 1) of a printing head is injection-molded after kneading a binder with metallic powder of a magnetic substance. The single member is sintered by joining it to another molded member after effecting de-binder processing, thus manufacturing the component.
摘要翻译：公开了一种冲击点头的磁路部件及其成型方法，其中部件数量减少，并且显示出优异的磁效率。构成打印头的磁路部件（例如，芯块1）的多个部件中的至少一个部件在将粘合剂与磁性物质的金属粉末捏合之后被注射成型。在实现脱粘合剂处理之后，通过将单个构件接合到另一个模制构件来烧结，从而制造该组件。

57. 发明授权

US5288698A Method of positioning lead frame on molding die to seal semiconductor element with resin 失效
标题翻译：将引线框架定位在成型模具上以用树脂密封半导体元件的方法
公开(公告)号：US5288698A
公开(公告)日：1994-02-22
申请号：US858785
申请日：1992-03-27
申请人： Toshinobu Banjo , Kouji Shika , Minoru Tanaka
发明人： Toshinobu Banjo , Kouji Shika , Minoru Tanaka
IPC分类号： B29C45/14 , B29C45/84 , H01L21/56 , B29C33/12 , B29C33/30
CPC分类号： B29C47/903 , B29C45/14008 , B29C45/842 , B29C47/907 , H01L21/56 , B29C47/0019 , H01L2924/0002
摘要： A reference pin (150) is provided on a bottom die (108) of a molding device (100). A lead frame (3) is carried with a chucking device (120) attached to an X-Y table mechanism (110). A hole (132) is formed in a stage (131) of the X-Y table mechanism. Respective images of the hole and the pin are detected by a TV camera (142) to control the relative position of the bottom die and the lead frame by driving the X-Y stage.
摘要翻译：参考销（150）设置在模制装置（100）的底模（108）上。引线框架（3）由附接到X-Y工作台机构（110）的夹紧装置（120）承载。在X-Y台机构的台（131）中形成有孔（132）。通过TV摄像机（142）检测孔和针的相应图像，以通过驱动X-Y平台来控制底模和引线框架的相对位置。

58. 发明授权

US5164203A Plastic molding device for a semiconductor element 失效
标题翻译：用于半导体元件的塑料模制装置
公开(公告)号：US5164203A
公开(公告)日：1992-11-17
申请号：US831646
申请日：1992-02-07
申请人： Minoru Tanaka , Itaru Matsuo
发明人： Minoru Tanaka , Itaru Matsuo
IPC分类号： B29C33/22 , B29C45/66
CPC分类号： B29C45/661 , B29C33/22 , B29C2045/648
摘要： A plastic molding device for a semiconductor element for plastic molding a semiconductor element on a lead frame, which comprises: an upper platen, a lower platen, and a movable platen movably provided at a tie bar which is provided between said two platens; an upper metal mold and a lower metal mold provided at the upper platen and the movable platen, respectively; a motor for applying a raising force for driving the movable platen; a driving force conversion mechanism for converting the rotation force of the motor into a reciprocative force; and a double toggle mechanism for giving the reciprocative force to the movable platen.
摘要翻译：一种用于在引线框架上塑造半导体元件的半导体元件的塑料模制装置，包括：上压板，下压板和可移动的压板，可移动地设置在设置在所述两个压板之间的连杆上; 分别设置在上压板和可动压板上的上金属模和下金属模; 用于施加用于驱动可动压板的提升力的电动机; 用于将电动机的旋转力转换成往复力的驱动力转换机构; 以及用于向可动压板提供往复力的双肘杆机构。

59. 发明授权

US5026668A Apparatus and method for producing semiconductor device 失效
标题翻译：半导体装置的制造方法及装置
公开(公告)号：US5026668A
公开(公告)日：1991-06-25
申请号：US436747
申请日：1989-11-15
申请人： Shunji Yamauchi , Minoru Tanaka , Kenitiro Sakamoto , Yutaka Morita , Toru Kidera , Hiroki Mieda
发明人： Shunji Yamauchi , Minoru Tanaka , Kenitiro Sakamoto , Yutaka Morita , Toru Kidera , Hiroki Mieda
IPC分类号： B29C43/56 , B29C45/17 , B30B15/00
CPC分类号： B29C43/18 , B29C43/56 , B29C45/1701 , B30B15/0082 , B29C2791/001 , B29L2031/3406 , Y10T29/49121
摘要： An apparatus for producing a semiconductor device includes a dust-proof cover which covers a dust-generating portion in the apparatus such as a mold for effecting resin-molding of the semiconductor device composed of a lead frame and semiconductor chips wire- and die-bonded thereto, and a dust collecting device for collecting dust which is suspended by the air inside the dust-proof cover.

60. 发明授权

US5022294A Cutting apparatus for a noncircular cross section 失效
标题翻译：非圆形截面切割装置
公开(公告)号：US5022294A
公开(公告)日：1991-06-11
申请号：US338841
申请日：1989-04-17
申请人： Toshiro Higuchi , Hazime Izumi , Minoru Tanaka
发明人： Toshiro Higuchi , Hazime Izumi , Minoru Tanaka
IPC分类号： B23B5/24 , G05B19/18
CPC分类号： G05B19/184 , Y10T82/13 , Y10T82/2541
摘要： A cutting apparatus for forming a noncircular cross-section on a workpiece that includes a tool advancing and retreating device. The tool advancing and retreating device includes a central shaft on which is to be mounted a tool, a journal for supporting the central shaft, a movable plate fixed to the central shaft, and electromagnets positioned opposite to one another such that the movable plate is interposed between the electromagnets with a clearance between the plate and the electromagnets. A device is provided for detecting the rotational angle of the main shaft and a displacement sensor is included for detecting the longitudinal displacement of the central shaft. A speed sensor detects the speed of the longitudinal displacement of the central shaft and an arrangement is provided for controlling the electric current passing through the electromagnets based on the output signals from the rotational angle detecting device, from the displacement sensor and from the speed sensor. The journal that supports the central shaft includes a mount and a plurality of leaf springs which are secured to the central shaft and to a holder. The holder is also secured to the mount.

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