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    • 55. 发明授权
    • Apparatuses, systems and methods for treating substrate
    • 用于处理底物的设备,系统和方法
    • US08974601B2
    • 2015-03-10
    • US13559797
    • 2012-07-27
    • Hyung Joon Kim
    • Hyung Joon Kim
    • C23C16/50C23C16/458H01L21/67
    • H01L21/67109H01L21/67167H01L21/67184H01L21/67196Y10T156/11Y10T156/19
    • Provided is an apparatus, system and method for treating a substrate, and more particularly, a substrate treating apparatus having a cluster structure, a substrate treating system, and a substrate treating method using the substrate treating system. The substrate treating apparatus includes a load port on which a container containing a substrate is installed, a plurality of process modules treating the substrate, a transfer module disposed between the load port and the process modules, and transferring the substrate between the container and the process modules, and a buffer chamber disposed between neighboring ones of the process modules, and providing a space for carrying the substrate between the neighboring process modules.
    • 本发明提供一种用于处理基板的装置,系统和方法,更具体地说,涉及使用基板处理系统的具有簇结构的基板处理装置,基板处理系统和基板处理方法。 基板处理装置包括:装载有容纳基板的容器的负载端口,处理基板的多个处理模块,设置在负载端口和处理模块之间的转移模块,以及将基板转移到容器与过程之间 模块和设置在相邻处理模块之间的缓冲室,并且在相邻处理模块之间提供用于承载衬底的空间。
    • 57. 发明授权
    • Multilayer ceramic capacitor
    • 多层陶瓷电容器
    • US08400753B2
    • 2013-03-19
    • US13478540
    • 2012-05-23
    • Sang Huk KimHyung Joon KimJu Myung SuhJang Ho LeeJun Hee KimMin Gon Lee
    • Sang Huk KimHyung Joon KimJu Myung SuhJang Ho LeeJun Hee KimMin Gon Lee
    • H01G4/005
    • H01G4/01H01G4/005H01G4/12H01G4/30
    • There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L2 and a width of a portion of a margin portion M in each dielectric layer is defined as a maximum width M2, the portion of the margin portion M having no internal electrode layer present thereon and corresponding to the ends of each internal electrode layer in the length direction, a ratio of M2 to L2 (M2/L2) ranges from 0.2 to 0.3.
    • 提供了一种多层陶瓷电容器,其包括:具有交替层叠的多个电介质层和多个内部电极层的多层体; 其中每个内部电极层的宽度从长度方向的中心向其两端逐渐减小; 并且当将每个内部电极层在其长度方向上的端部的宽度定义为最小宽度L2,将每个电介质层中的边缘部分M的一部分的宽度定义为最大宽度M2时, 边缘部M在其上不存在内部电极层,并且与长度方向上的每个内部电极层的端部相对应,M2与L2的比(M2 / L2)为0.2〜0.3。
    • 59. 发明申请
    • APPARATUS AND METHOD FOR TREATING SUBSTRATE
    • 用于处理基板的装置和方法
    • US20120322015A1
    • 2012-12-20
    • US13485300
    • 2012-05-31
    • Hyung Joon Kim
    • Hyung Joon Kim
    • B25J11/00H01L21/677F27D3/00C23F1/00B32B38/10B05D3/02C23C16/513B05D1/00
    • H01L21/67201Y10T156/11
    • Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.
    • 提供了一种用于处理基板的装置和方法,更具体地,涉及一种具有簇结构的基板处理装置和使用其的基板处理方法。 用于处理基板的装置包括:负载端口,其上放置有用于接收基板的容器,用于处理基板的处理模块;以及转移模块,其包括用于在容器和处理模块之间转移基板的机器人。 所述处理模块包括传送室,所述传送室包括用于传送所述基板的机器人,设置在所述传送室和所述传送模块之间的装载锁定室,与所述传送模块在所述传送室周围隔开设置以执行第一处理过程的第一处理室, 以及设置在传送室周围的第二处理室,以执行第二处理过程。