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    • 51. 发明授权
    • Containment member for a magnetic-drive centrifugal pump
    • 用于磁驱离心泵的容器
    • US06293772B1
    • 2001-09-25
    • US09428730
    • 1999-10-28
    • Jeffrey S. BrownManfred P. KleinScott A. McAloonPeter E. Phelps
    • Jeffrey S. BrownManfred P. KleinScott A. McAloonPeter E. Phelps
    • F04B1700
    • F04D13/026F04D13/025
    • A containment member for a magnetic-drive centrifugal pump includes a reinforcement member cooperating with an inner layer and an outer layer to form a unitary body. The inner layer has a first side defining a generally annular recess and a second side opposite the first side. The second side defines a pocket located coaxially and radially inward with respect to the annular recess. The reinforcement member has a stem portion nested within the pocket. The reinforcement member has a curved portion extending radially outward from the stem portion. The stem portion has a first radial dimension and the curved portion has a second radial dimension greater than the first radial dimension. The outer layer covers the curved portion and is affixed to the curved portion and the inner layer.
    • 用于磁驱动离心泵的容纳构件包括与内层和外层协作以形成整体的加强构件。 内层具有限定大致环形凹部的第一侧和与第一侧相对的第二侧。 第二侧限定了相对于环形凹部同轴且径向向内定位的口袋。 加强构件具有嵌套在口袋内的柄部。 加强构件具有从杆部向径向外侧延伸的弯曲部。 杆部分具有第一径向尺寸,并且弯曲部分具有大于第一径向尺寸的第二径向尺寸。 外层覆盖弯曲部分并且固定到弯曲部分和内层。
    • 53. 发明授权
    • Method of forming a semiconductor diode with depleted polysilicon gate structure
    • 形成具有耗尽的多晶硅栅结构的半导体二极管的方法
    • US06232163B1
    • 2001-05-15
    • US09362549
    • 1999-07-28
    • Steven H. VoldmanRobert J. Gauthier, Jr.Jeffrey S. Brown
    • Steven H. VoldmanRobert J. Gauthier, Jr.Jeffrey S. Brown
    • H01L218238
    • H01L27/0811H01L29/7391H01L2924/0002H01L2924/00
    • A high voltage tolerant diode structure for mixed-voltage, and mixed signal and analog/digital applications. The preferred silicon diode includes a polysilicon gate structure on at least one dielectric film layer on a semiconductor (silicon) layer or body. A well or an implanted area is formed in a bulk semiconductor substrate or in a surface silicon layer on an SOI wafer. Voltage applied to the polysilicon gate film, electrically depletes it, reducing voltage stress across the dielectric film. An intrinsic polysilicon film may be counter-doped, implanted with a low doped implantation, implanted with a low doped source/drain implant, or with a low doped MOSFET LDD or extension implant. Alternatively, a block mask may be formed over the gate structure when defining the depleted-polysilicon gate silicon diode to form low series resistance diode implants, preventing over-doping the film. Optionally, a hybrid photoresist method may be used to form higher doped edge implants in the silicon to reduce diode series resistance without a block mask.
    • 用于混合电压,混合信号和模拟/数字应用的高耐压二极管结构。 优选的硅二极管包括在半导体(硅)层或主体上的至少一个电介质膜层上的多晶硅栅极结构。 阱体或植入区域形成在SOI半导体衬底或SOI晶片的表面硅层中。 施加到多晶硅栅极膜的电压,电耗电,降低电介质膜两端的电压。 本征多晶硅膜可以是反掺杂的,注入低掺杂注入,注入低掺杂源/漏注入,或者与低掺杂的MOSFET LDD或延伸注入。 或者,当限定耗尽多晶硅栅极硅二极管以形成低串联电阻二极管植入物时,可以在栅极结构上形成块掩模,防止膜过度掺杂。 可选地,可以使用混合光致抗蚀剂方法在硅中形成更高掺杂的边缘注入,以减少二极管串联电阻而不使用块掩模。
    • 54. 发明授权
    • Method and structure for increasing the threshold voltage of a corner
device
    • 提高拐角装置阈值电压的方法和结构
    • US6097069A
    • 2000-08-01
    • US102196
    • 1998-06-22
    • Jeffrey S. BrownRobert J. GauthierSteven H. Voldman
    • Jeffrey S. BrownRobert J. GauthierSteven H. Voldman
    • H01L29/78H01L21/28H01L21/8238H01L29/423H01L29/76H01L29/00
    • H01L21/28167H01L21/8238H01L29/42368
    • A structure for increasing the threshold voltage of a corner device, particularly for shallow trench isolation having narrow devices. An FET comprises a substrate having a channel formed therein under a gate between spaced source and drain regions. A trench isolation region is formed in the substrate around the transistor and on opposite sides of the channel to isolate the transistor from other devices formed in the substrate, with the trench isolation region forming first and second junction corner devices with opposite sides of the channel. A first dielectric layer is formed under the gate and over the channel of the field effect transistor to form a gate insulator for the transistor. A second corner edge dielectric layer is formed under the gate structure and over the first and second corner devices, such that the corner edge dielectric layer increases the thickness of dielectric over each corner device and thus increases the threshold voltage (Vt) and edge dielectric breakdown and decreases MOSFET corner gate-induced drain leakage.
    • 一种用于增加角装置的阈值电压的结构,特别是对于具有窄装置的浅沟槽隔离。 FET包括在间隔开的源极和漏极区之间的栅极下方形成有沟道的衬底。 沟槽隔离区形成在晶体管周围的衬底和通道的相对侧上,以将晶体管与形成在衬底中的其它器件隔离,其中沟槽隔离区形成具有通道相对侧的第一和第二接合角器件。 在场效应晶体管的栅极和沟道之下形成第一介电层,以形成晶体管的栅极绝缘体。 在栅极结构之下和第一和第二角部器件之上形成第二角边缘电介质层,使得角部边缘电介质层增加每个拐角器件上的电介质厚度,从而增加阈值电压(Vt)和边缘电介质击穿 并降低MOSFET栅极引起的漏极泄漏。
    • 55. 发明授权
    • Depleted polysilicon circuit element and method for producing the same
    • 耗尽多晶硅电路元件及其制造方法
    • US6034388A
    • 2000-03-07
    • US79846
    • 1998-05-15
    • Jeffrey S. BrownRobert J. Gauthier, Jr.Steven H. Voldman
    • Jeffrey S. BrownRobert J. Gauthier, Jr.Steven H. Voldman
    • H01L21/334H01L21/762H01L21/8238H01L27/06H01L27/12H01L29/94H01L29/76
    • H01L29/66181H01L21/76237H01L21/76264H01L21/823842H01L21/82385H01L27/0629H01L27/1203H01L29/94H01L21/76283Y10S257/907
    • A circuit element comprising a semiconductor substrate. A well region of a first conductivity type is formed in a surface of the substrate. A dielectric film is formed on the substrate. A gate conductor of the first conductivity type is formed on the dielectric film over the well region of the substrate. The gate conductor is formed of a polycrystalline silicon film. The gate conductor has an impurity concentration substantially lower than a standard impurity concentration for the gate conductor of an MOS device. A polycrystalline silicon edge spacer is formed on each side of the gate conductor. A first pair of first conductivity type impurity diffusion regions are formed adjacent to the polycrystalline silicon edge spacers. The polycrystalline silicon film and edge spacers lie on a portion of the substrate between the first pair of first conductivity type impurity diffusion regions. The first pair of first conductivity type impurity diffusion regions have an impurity concentration substantially lower than the standard impurity concentration for the gate conductor of an MOS device. The gate conductor and the first pair of first conductivity type impurity diffusion regions may be formed by a single implantation step. Applications include ESD protection, analog applications, peripheral input/output circuitry, decoupling capacitors, and resistor ballasting.
    • 一种包括半导体衬底的电路元件。 第一导电类型的阱区形成在衬底的表面中。 在基板上形成电介质膜。 在衬底的阱区上的电介质膜上形成第一导电类型的栅极导体。 栅极导体由多晶硅膜形成。 栅极导体的杂质浓度基本上低于MOS器件的栅极导体的标准杂质浓度。 在栅极导体的每一侧上形成多晶硅边缘隔离物。 第一对第一导电型杂质扩散区形成在与多晶硅边缘隔离物相邻的位置。 多晶硅膜和边缘隔离物位于第一对第一导电型杂质扩散区之间的衬底的一部分上。 第一对第一导电型杂质扩散区的杂质浓度基本上低于MOS器件的栅极导体的标准杂质浓度。 可以通过单个注入步骤形成栅极导体和第一对第一导电型杂质扩散区。 应用包括ESD保护,模拟应用,外围输入/输出电路,去耦电容和电阻镇流器。
    • 58. 发明申请
    • MODELING SEMICONDUCTOR DEVICE PERFORMANCE
    • 建模半导体器件性能
    • US20140039863A1
    • 2014-02-06
    • US13562393
    • 2012-07-31
    • Jeffrey S. Brown
    • Jeffrey S. Brown
    • G06F17/50
    • G06F17/5036G06F17/50G06F17/5068G06F17/5081
    • Disclosed are embodiments for modeling semiconductor device performance using a single compact model despite changes in performance attribute to model parameter dependency of a single semiconductor device that occur during fitting and/or re-centering due to local layout effects (LLEs) and despite variations in this dependency across multiple related semiconductor devices due to LLEs. In one embodiment, the actual performance attribute to model parameter dependence of a single semiconductor device is fit to a reference dependence so that changes to the compact model are not required even when changes occur in the performance attribute to model parameter dependency during fitting and/or re-centering. In another embodiment, the actual performance attribute to model parameter dependence of each of multiple related semiconductor devices are fit to a reference dependence so that changes to the compact model are not required even when the performance attribute to model parameter dependency varies across the devices.
    • 公开了使用单个紧凑型模型来建模半导体器件性能的实施例,尽管由于局部布局效应(LLE)而在拟合和/或重新对中期间发生的单个半导体器件的性能属性与模型参数依赖性的变化,并且尽管在该 由于LLE引起的多个相关半导体器件的依赖性。 在一个实施例中,单个半导体器件的模型参数依赖性的实际性能属性适合于参考依赖性,使得即使在性能属性中发生改变以在拟合和/或模拟参数依赖性期间发生变化,也不需要对紧凑模型的改变 重新定心 在另一个实施例中,对于多个相关半导体器件中的每一个的模型参数依赖性的实际性能属性适合于参考依赖性,使得即使当器件的性能属性与模型参数依赖性变化时,也不需要对紧凑模型的改变。
    • 60. 发明授权
    • Granular channel width for power optimization
    • 颗粒通道宽度进行功率优化
    • US08196086B2
    • 2012-06-05
    • US12840535
    • 2010-07-21
    • Jeffrey S. BrownJonathan W. ByrnMark F. Turner
    • Jeffrey S. BrownJonathan W. ByrnMark F. Turner
    • G06F17/50
    • G06F17/5068G06F2217/78
    • A storage medium recording a cell library having one or more cells that may be readable by a computer and may be used by the computer to design an integrated circuit. The one or more cells may have a physical dimension parameter and a channel width parameter. The physical dimension parameter may be a footprint of the one or more cells. The channel width parameter may have a minimum driver size and a maximum driver size. The channel width parameter may define a range within which a tool varies the channel width between the maximum driver size and the minimum driver size during a design flow of the integrated circuit based upon one or more power criteria without changing the footprint.
    • 记录具有一个或多个可由计算机读取的单元的单元库的存储介质,并可由计算机用于设计集成电路。 一个或多个单元可以具有物理尺寸参数和通道宽度参数。 物理尺寸参数可以是一个或多个单元格的占位面积。 通道宽度参数可能具有最小驱动程序大小和最大驱动程序大小。 通道宽度参数可以定义范围,在该范围内,工具在集成电路的设计流程期间基于一个或多个功率准则改变最大驱动器尺寸和最小驱动器尺寸之间的通道宽度,而不改变占用面积。