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51. 发明授权

US07367195B2 Application and removal of thermal interface material 有权
标题翻译：热界面材料的应用和去除
公开(公告)号：US07367195B2
公开(公告)日：2008-05-06
申请号：US11599671
申请日：2006-11-14
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： F25B21/02
CPC分类号： F28D15/02 , H01L23/38 , H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/01079 , H01L2924/10253 , H01L2924/16195 , H01L2924/00
摘要： A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.
摘要翻译：描述了一种方法，系统和装置。该装置包括用于调节与热电（TEC）模块相关联的极性的第一装置。调整是为了控制热量的流动。热流导向热界面材料（TIM），以便将TIM熔化到可接受的熔体水平。该装置还包括第二装置，用于确定TIM已经熔化到可接受的熔融水平。该装置包括一个施加装置，用于将TIM施加到散热器上，如果TIM熔化已熔化到可接受的熔融水平。

52. 发明授权

US07327572B2 Heat dissipating device with enhanced boiling/condensation structure 有权
公开(公告)号：US07327572B2
公开(公告)日：2008-02-05
申请号：US11582626
申请日：2006-10-17
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： H05K7/20 , F28D15/00 , H01L23/34
CPC分类号： F28D15/046 , F28D15/043 , F28F13/187 , F28F2245/04 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device. The heat dissipating device comprises a receptor plate to be placed over a device that generates heat, an evaporator coupling to the receptor plate, a condenser column placed in fluid communication with the evaporator, and a set of condenser extension surfaces extending from the condenser. The evaporator includes a modulated porous layer and stores liquid. The condenser column includes a non-wetting surface. The condenser extension surface facilitates heat dissipation.

53. 发明申请

US20070090518A1 Microelectronic cooling apparatus and associated method 有权
标题翻译：微电子冷却装置及相关方法
公开(公告)号：US20070090518A1
公开(公告)日：2007-04-26
申请号：US11255678
申请日：2005-10-20
申请人： Ioan Sauciuc , Gregory Chrysler
发明人： Ioan Sauciuc , Gregory Chrysler
IPC分类号： H01L23/34
CPC分类号： H01L23/38 , H01L35/16 , H01L2224/73253 , H01L2924/12044 , H01L2924/16152
摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.
摘要翻译：通常描述了向微电子器件提供局部冷却的装置和相关方法。在这方面，根据一个示例性实施例，包括散热器和热耦合到散热器的一个或多个热电冷却器的冷却装置向微电子器件的一个或多个热点提供冷却，一个或多个具有单个材料的单个热交换元件的热电冷却器。

54. 发明申请

US20060226539A1 Integrated circuit coolant microchannel assembly with targeted channel configuration 有权
标题翻译：具有目标通道配置的集成电路冷却液微通道组件
公开(公告)号：US20060226539A1
公开(公告)日：2006-10-12
申请号：US11101061
申请日：2005-04-07
申请人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory Chrysler , Ravi Prasher
发明人： Je-Young Chang , Ioan Sauciuc , Chuan Hu , Chia-Pin Chiu , Gregory Chrysler , Ravi Prasher
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , F28F3/12 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.
摘要翻译：微通道结构中形成有微通道。微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。每个子通道具有大于第一宽高比的相应的第二宽高比。

55. 发明申请

US20060033205A1 Liquid metal thermal interface for an integrated circuit device 有权
标题翻译：用于集成电路器件的液态金属热接口
公开(公告)号：US20060033205A1
公开(公告)日：2006-02-16
申请号：US10917702
申请日：2004-08-13
申请人： Ioan Sauciuc , Gregory Chrysler
发明人： Ioan Sauciuc , Gregory Chrysler
IPC分类号： H01L23/34
CPC分类号： H01L23/42 , H01L23/473 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01068 , H01L2924/15311 , H01L2224/0401
摘要： A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.
摘要翻译：用于集成电路管芯的液态金属热接口。液态金属热界面可以设置在模具和另一传热元件之间，例如散热器或散热器。液体金属热界面包括与模具表面流体连通的液态金属，并且在模具表面上移动的液态金属将热量从模具传递到传热元件。传热元件的表面也可以与液态金属流体连通。描述和要求保护其他实施例。

56. 发明申请

US20050286227A1 Cooling integrated circuits using a cold plate with two phase thin film evaporation 有权
标题翻译：冷却集成电路采用冷板两相薄膜蒸发
公开(公告)号：US20050286227A1
公开(公告)日：2005-12-29
申请号：US10876399
申请日：2004-06-24
申请人： Hakan Erturk , Ioan Sauciuc
发明人： Hakan Erturk , Ioan Sauciuc
IPC分类号： H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H05K7/20363 , H01L2924/00
摘要： A microchannel cold plate for cooling semiconductor electronic devices which may include a semi-permeable wall in contact with liquid in the cooling passage. The cold plate, in turn, may be in contact with the integrated circuit. Cooling liquid passes through the cold plate where it starts boiling inside of the microchannels. The wall allows gas bubbles to pass through while preventing the passage of liquid. As a result, the gas bubbles may be removed from the liquid flow by upward buoyancy. The removal of the gas bubbles improves the operation of the cold plate in some embodiments.
摘要翻译：一种用于冷却半导体电子器件的微通道冷板，其可包括与冷却通道中的液体接触的半透壁。冷板又可能与集成电路接触。冷却液通过冷板，开始在微通道内部沸腾。该壁允许气泡通过，同时防止液体通过。结果，气泡可以通过向上的浮力从液体流中去除。在一些实施例中，去除气泡改善了冷板的操作。

57. 发明申请

US20050219816A1 CLEARING OF VAPOR LOCK IN A MICROCHANNEL COOLING SUBSYSTEM 失效
标题翻译：在微通道冷却子系统中清除蒸汽锁
公开(公告)号：US20050219816A1
公开(公告)日：2005-10-06
申请号：US10814051
申请日：2004-03-31
申请人： Gregory Chrysler , Ioan Sauciuc
发明人： Gregory Chrysler , Ioan Sauciuc
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods in accordance with the present invention provide a system to create turbulence inside microchannels of a microchannel cooling subsystem to disrupt vapor locks therein.
摘要翻译：根据本发明的装置和方法提供了一种在微通道冷却子系统的微通道内部产生紊流以破坏其中的蒸气锁的系统。

58. 发明授权

US09142482B2 Transient thermal management systems for semiconductor devices 有权
标题翻译：半导体器件瞬态热管理系统
公开(公告)号：US09142482B2
公开(公告)日：2015-09-22
申请号：US13977402
申请日：2011-12-27
申请人： Sandeep Ahuja , Ioan Sauciuc , Susan F. Smith
发明人： Sandeep Ahuja , Ioan Sauciuc , Susan F. Smith
IPC分类号： H05K7/20 , H01L23/473 , H01L23/34 , G06F1/20
CPC分类号： H01L23/473 , G06F1/206 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.
摘要翻译：提供半导体器件的热管理系统。本发明的实施例提供两个或更多个液体冷却子系统，每个液体冷却子系统能够向一个或多个半导体器件（例如封装的处理器）提供主动冷却。在操作中，第一液体冷却子系统可以向半导体器件提供主动冷却，而第二冷却子系统在其自身子系统内循环传热流体。然后可以将第二液体冷却子系统切换到操作中，并且在第一冷却子系统在其自己的子系统内循环传热流体时，向半导体装置提供主动冷却。在替代实施例中，传热流体保留在子系统中，但是当子系统不向半导体器件提供冷却时，该子系统不会在子系统内循环。子系统包括散热单元。冷却系统之间的切换允许半导体器件保持在比不使用冷却子系统之间切换的较低的工作温度。

59. 发明授权

US07795711B2 Microelectronic cooling apparatus and associated method 有权
标题翻译：微电子冷却装置及相关方法
公开(公告)号：US07795711B2
公开(公告)日：2010-09-14
申请号：US11255678
申请日：2005-10-20
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： H01L23/495
CPC分类号： H01L23/38 , H01L35/16 , H01L2224/73253 , H01L2924/12044 , H01L2924/16152
摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.
摘要翻译：通常描述了向微电子器件提供局部冷却的装置和相关方法。在这方面，根据一个示例性实施例，包括散热器和热耦合到散热器的一个或多个热电冷却器的冷却装置向微电子器件的一个或多个热点提供冷却，一个或多个具有单个材料的单个热交换元件的热电冷却器。

60. 发明授权

US07742299B2 Piezo fans for cooling an electronic device 有权
标题翻译：用于冷却电子设备的压电风扇
公开(公告)号：US07742299B2
公开(公告)日：2010-06-22
申请号：US12118338
申请日：2008-05-09
申请人： Ioan Sauciuc , Sandeep Ahuja , Ashish Gupta
发明人： Ioan Sauciuc , Sandeep Ahuja , Ashish Gupta
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , B01L7/00 , B01L2300/1894 , G06F1/20 , H01L23/467 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H05K7/20163 , Y10T29/49826 , H01L2924/00
摘要： A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.
摘要翻译：公开了一种包括用于电子组件的一个或多个压电风扇的冷却系统。电子组件可以包括与印刷电路板（PCB）的前侧耦合的发热部件和与PCB背面耦合的一个或多个压电风扇。一个或多个压电风扇可能能够从后侧冷却发热部件。冷却系统还可以包括与PCB背面耦合的散热器。

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