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    • 51. 发明申请
    • Systems and methods for manipulating liquid films on semiconductor substrates
    • 用于操纵半导体衬底上的液膜的系统和方法
    • US20070197050A1
    • 2007-08-23
    • US11359730
    • 2006-02-22
    • Paul ShirleyHiroyuki Mori
    • Paul ShirleyHiroyuki Mori
    • H01L21/00
    • H01L21/6715
    • A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An annular-shaped sheet of liquid is formed on the surface, the sheet of liquid having an inner diameter defining a liquid-free void. The size of a diameter of the void is reduced by manipulation of the annular-shaped sheet of liquid. The void may then be enlarged until the surface is substantially dry. The annular-shaped sheet of liquid may be formed and altered by selectively moving a contact area on the surface of the substrate on which the liquid is introduced. Systems for processing a substrate and configured to deposit and manipulate a sheet of liquid thereon are also disclosed.
    • 在其上制造集成电路器件的处理的半导体衬底围绕旋转轴旋转,同时将液体引入到衬底的表面上。 在表面上形成环状的液体片,该液体片具有限定无液体空隙的内径。 通过操作环形片状液体来减小空隙直径的大小。 然后可以扩大空隙,直到表面基本上干燥。 可以通过选择性地移动在其上引入液体的基板的表面上的接触区域来形成和改变环形片状液体。 还公开了用于处理基板并且被配置为在其上沉积和操纵一片液体的系统。
    • 52. 发明申请
    • SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 固态成像装置及其制造方法
    • US20070164384A1
    • 2007-07-19
    • US11466523
    • 2006-08-23
    • Yasushi MaruyamaHideshi AbeHiroyuki Mori
    • Yasushi MaruyamaHideshi AbeHiroyuki Mori
    • H01L27/14
    • H01L27/14645H01L27/14621H01L27/14625H01L27/14627H01L27/14636H01L27/1464H01L27/14643H01L27/14658H01L27/14683H01L27/14685H01L27/14689
    • A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.
    • 具有高灵敏度的固态成像装置和获得小型化像素的结构,以及其中界面稳定的固态成像装置的制造方法,光谱特性优异并且可以用 提供高产率。 固态成像装置至少包括形成有光传感器部分的硅层和形成在硅层的表面侧的布线层,并且使光L从相对的背面侧进入 到硅层的表面侧,硅层4的厚度为10μm以下。 此外,制造固态成像装置的方法至少包括以下步骤:在硅衬底,中间层和硅层的层叠衬底的硅层中形成光电传感器部分的半导体区域 层压; 将第一支撑衬底接合到所述硅层上; 去除硅衬底和中间层; 然后形成硅层上方的布线部分; 将第二支撑基板接合到布线部分上,并且移除第一支撑基板以使硅层暴露。
    • 56. 发明申请
    • Solid-state imaging device and method for manufacturing the same
    • 固态成像装置及其制造方法
    • US20050139828A1
    • 2005-06-30
    • US10978754
    • 2004-11-01
    • Yasushi MaruyamaHideshi AbeHiroyuki Mori
    • Yasushi MaruyamaHideshi AbeHiroyuki Mori
    • H01L27/14H01L21/00H01L23/00H01L27/146H01L29/74H01L31/00
    • H01L27/14645H01L27/14621H01L27/14625H01L27/14627H01L27/14636H01L27/1464H01L27/14643H01L27/14658H01L27/14683H01L27/14685H01L27/14689
    • A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.
    • 具有高灵敏度的固态成像装置和获得小型化像素的结构,以及其中界面稳定的固态成像装置的制造方法,光谱特性优异并且可以用 提供高产率。 固态成像装置至少包括形成有光传感器部分的硅层和形成在硅层的表面侧的布线层,并且使光L从相对的背面侧进入 到硅层的表面侧,硅层4的厚度为10μm以下。 此外,制造固态成像装置的方法至少包括以下步骤:在硅衬底,中间层和硅层的层叠衬底的硅层中形成光电传感器部分的半导体区域 层压; 将第一支撑衬底接合到所述硅层上; 去除硅衬底和中间层; 然后形成硅层上方的布线部分; 将第二支撑基板接合到布线部分上,并且移除第一支撑基板以使硅层暴露。
    • 57. 发明授权
    • Lens centering mechanism, lens apparatus and imaging apparatus
    • 透镜定心机构,透镜装置和成像装置
    • US06909558B2
    • 2005-06-21
    • US10662903
    • 2003-09-15
    • Shinichi OrimoHiroyuki Mori
    • Shinichi OrimoHiroyuki Mori
    • G02B7/02G02B27/62G02B15/14G03B21/14
    • G02B13/009G02B7/023G02B27/62G03F7/70825H04N5/2254H04N17/002
    • A lens held by a lens holding member is centered easily and correctly by a mechanism in which a guide pin is inserted into a guide hole for positioning the lens holding member with respect to the main body unit of the lens barrel in a plane perpendicular to the optical axis of the lens and for mounting the lens holding member for movement in a direction along the optical axis. Adjustment pins are rotationally mounted on at least three sites on the outer peripheral surface of the main body unit of the lens barrel. If each adjustment pin is rotated, an offset portion of the adjustment pin which is relative to the center of rotation of the adjustment pin, is rotated, as the offset portion is engaged in an engagement hole of the lens holding member. In this way the lens holding member on each site is displaced in the direction along the optical axis to adjust the tilt of the lens held by the lens holding member.
    • 由透镜保持构件保持的透镜通过其中引导销插入导向孔中的机构而容易且正确地对中,用于将透镜保持构件相对于透镜镜筒的主体单元定位在垂直于透镜保持构件的平面中 并且用于安装用于沿着光轴的方向移动的透镜保持构件。 调整销被旋转地安装在镜筒的主体单元的外周表面上的至少三个位置上。 如果每个调节销旋转,则调节销的相对于调节销的旋转中心的偏移部分被旋转,因为偏移部分接合在透镜保持部件的接合孔中。 以这种方式,每个位置处的透镜保持构件沿着光轴的方向移位,以调整由透镜保持构件保持的透镜的倾斜。