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51. 发明申请

US20050224469A1 Efficient micro-machining apparatus and method employing multiple laser beams 审中-公开
标题翻译：高效的微加工设备和采用多个激光束的方法
公开(公告)号：US20050224469A1
公开(公告)日：2005-10-13
申请号：US11000333
申请日：2004-11-29
申请人： Donald Cutler , Brian Baird , Richard Harris , David Hemenway , Ho Lo , Brady Nilsen , Yasu Osako , Lei Sun , Yunlong Sun , Mark Unrath
发明人： Donald Cutler , Brian Baird , Richard Harris , David Hemenway , Ho Lo , Brady Nilsen , Yasu Osako , Lei Sun , Yunlong Sun , Mark Unrath
IPC分类号： B23K26/06 , B23K26/00
CPC分类号： B23K26/06
摘要： A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs positioned such that the laser beam passes through the AOMs without being deflected. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head.
摘要翻译：激光束切换系统采用耦合到光束切换装置的激光器，其使激光束在第一和第二光束定位头之间切换，使得当第一光束定位头引导激光束来处理工件目标位置时，第二光束定位头正在移动到另一个目标位置，反之亦然。优选的光束切换装置包括第一和第二AOM，其被定位成使得激光束不经偏转地穿过AOM。当RF施加到第一AOM时，激光束朝向第一光束定位头衍射，并且当RF施加到第二AOM时，激光束被朝向第二光束定位头衍射。

52. 发明授权

US5361268A Switchable two-wavelength frequency-converting laser system and power control therefor 失效
标题翻译：可切换双波长变频激光系统及其功率控制
公开(公告)号：US5361268A
公开(公告)日：1994-11-01
申请号：US064515
申请日：1993-05-18
申请人： Michael E. Fossey , Yunlong Sun
发明人： Michael E. Fossey , Yunlong Sun
IPC分类号： B23K26/00 , G02F1/35 , G02F1/37 , H01S3/107
CPC分类号： G02F1/3534 , G02F1/37 , H01S3/109 , H01S3/08054 , H01S3/107 , H01S3/1103
摘要： A laser system and power control have a polarization state changer that produces in response to an incident beam with selected polarization state at a first wavelength .lambda..sub.1 a beam at .lambda..sub.1 with a desired polarization state. A frequency converter responds to the beam at .lambda..sub.1 with the desired polarization state to produce a frequency converted beam at a second, different wavelength .lambda..sub.2. When the polarization state changer and the frequency converter are located within a laser cavity, the laser system is operable in three different states and produces an output beam at .lambda..sub.1 or .lambda..sub.2, or no output beam, depending on the polarization state changer. In this intracavity configuration the polarization state changer is also operable as a Q-switch. When the polarization state changer and the frequency converter are located outside a laser cavity, the polarization state changer is operable in the whole range between its first and third states; the device thus produces an output beam at .lambda..sub.2, an output beam including components at .lambda..sub.1 and .lambda..sub.2, or an output beam having no component at .lambda..sub.2, again depending on the polarization state changer. In the extracavity configuration the power in the output at .lambda..sub.2 is continuously controllable between a maximum and zero.
摘要翻译：激光系统和功率控制具有偏振状态变换器，其响应于具有选定的偏振态的入射光束，其以第一波长λ1具有λ1的具有期望偏振态的光束。频率转换器以λ1响应所需的偏振状态的波束，以产生在第二不同波长λ2的频率转换波束。当偏振状态变换器和变频器位于激光腔内时，激光系统可在三种不同状态下工作，并根据偏振状态变化器产生λ1或λ2的输出光束，或不输出光束。在该腔内配置中，偏振状态变换器也可用作Q开关。当偏振状态变换器和变频器位于激光腔外部时，偏振状态变换器可在其第一和第三状态之间的整个范围内操作; 因此该装置产生λ2的输出光束，包括λ1和λ2的分量的输出光束，或者不依赖于偏振状态变换器的，没有λ2分量的输出光束。在腔外构造中，λ2处的输出功率在最大值和零之间是连续可控的。

53. 发明授权

US10307862B2 Laser micromachining with tailored bursts of short laser pulses 有权
公开(公告)号：US10307862B2
公开(公告)日：2019-06-04
申请号：US12413350
申请日：2009-03-27
申请人： Yunlong Sun
发明人： Yunlong Sun
IPC分类号： H01S3/098 , H01S3/10 , B23K26/0622 , B23K26/40 , B23K103/10 , B23K103/12 , B23K103/16 , B23K103/00
摘要： A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

54. 发明授权

US08599890B2 Systems and methods for laser pulse equalization 有权
标题翻译：激光脉冲均衡的系统和方法
公开(公告)号：US08599890B2
公开(公告)日：2013-12-03
申请号：US12054811
申请日：2008-03-25
申请人： Yunlong Sun , Feng Chang
发明人： Yunlong Sun , Feng Chang
IPC分类号： H01S3/13
CPC分类号： H01S3/0941 , H01S3/042 , H01S3/094076 , H01S3/10046 , H01S3/10069 , H01S3/1024 , H01S3/1068 , H01S3/117 , H01S3/1306
摘要： Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.
摘要翻译：系统和方法提供不同脉冲重复频率（PRF）的激光脉冲均衡。在初始将激光介质从第一泵浦电平泵送到峰值泵浦电平之后，控制器可以使泵浦源根据脉冲均衡泵送曲线继续泵浦激光介质。可以基于在不同PRF下测试激光脉冲参数来确定均衡泵送曲线，以实现脉冲参数的最佳均衡结果。用于评估各种均衡泵送曲线的优化度量可以包括不同PRF下的激光器的脉冲能级，峰值功率电平和/或脉冲宽度的一致性。均衡泵送曲线可以是从峰值泵送电平到第一泵浦电平的下降曲线。均衡泵送曲线可以是线性下降曲线，基本上呈指数下降曲线，参数下降曲线或任何其它曲线类型。

55. 再颁专利

USRE43605E1 Laser segmented cutting, multi-step cutting, or both 有权
标题翻译：激光分段切割，多步切割或两者兼容
公开(公告)号：USRE43605E1
公开(公告)日：2012-08-28
申请号：US12351562
申请日：2009-01-09
申请人： James N. O'Brien , Lian-Cheng Zou , Yunlong Sun , Kevin P. Fahey , Michael J. Wolfe , Brian W. Baird , Richard S. Harris
发明人： James N. O'Brien , Lian-Cheng Zou , Yunlong Sun , Kevin P. Fahey , Michael J. Wolfe , Brian W. Baird , Richard S. Harris
IPC分类号： B23K26/04 , C04B41/91
CPC分类号： B23K26/0622 , B23K26/032 , B23K26/066 , B23K26/073 , B23K26/083 , B23K26/0869 , B23K26/364 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.
摘要翻译：通过将长切割路径（112）分割成约10微米至1mm的短段（122）来提高通过硅等材料的UV激光切割吞吐量。激光输出（32）在第一短段（122）内扫描预定数量的通过，然后移动到第二短段（122）内并在第二短段（122）内扫描预定次数的通过次数。可以操纵咬合尺寸，段尺寸（126）和段重叠（136）以最小化沟槽回填的数量和类型。采用实时监测来减少已经完成切割的切割路径112（112）的重新扫描部分。激光输出（32）的极化方向也与切割方向相关，以进一步提高吞吐量。该技术可用于切割具有各种不同激光和波长的各种材料。多步骤过程可以优化每个单独层的激光工艺。

56. 再颁专利

USRE43400E1 Laser segmented cutting, multi-step cutting, or both 有权
公开(公告)号：USRE43400E1
公开(公告)日：2012-05-22
申请号：US11332815
申请日：2006-01-13
申请人： James N. O'Brien , Lian-Cheng Zou , Yunlong Sun , Kevin P. Fahey , Michael J. Wolfe , Brian W. Baird , Richard S. Harris
发明人： James N. O'Brien , Lian-Cheng Zou , Yunlong Sun , Kevin P. Fahey , Michael J. Wolfe , Brian W. Baird , Richard S. Harris
IPC分类号： B23K26/04 , C04B41/91
CPC分类号： B23K26/0622 , B23K26/032 , B23K26/066 , B23K26/073 , B23K26/083 , B23K26/0869 , B23K26/364 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50
摘要： UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

57. 发明授权

US07982161B2 Method and apparatus for laser drilling holes with tailored laser pulses 有权
标题翻译：激光钻孔的方法和设备，具有定制的激光脉冲
公开(公告)号：US07982161B2
公开(公告)日：2011-07-19
申请号：US12054115
申请日：2008-03-24
申请人： Yunlong Sun , Weisheng Lei , Hisashi Matsumoto , Brian Johansen , Gregg Hardy , Brian Baird
发明人： Yunlong Sun , Weisheng Lei , Hisashi Matsumoto , Brian Johansen , Gregg Hardy , Brian Baird
IPC分类号： B23K26/38
CPC分类号： B23K26/0622 , B23K26/382 , B23K26/389 , B23K26/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/42 , B23K2103/50 , B23K2103/52 , B23K2103/54 , H05K3/0035
摘要： An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.
摘要翻译：提出了一种用于在具有激光脉冲的电子衬底中钻通孔的改进方法和装置，其使用一个或多个定制脉冲来减少残留在通孔中的残留物，同时保持系统吞吐量并避免损坏衬底。定制脉冲是一种激光脉冲，其特征在于具有比脉冲的平均功率高10％的峰值功率并持续小于脉冲持续时间的50％的功率尖峰。示出了通过切片更长持续时间脉冲来创建裁剪脉冲的方法和装置。

58. 发明申请

US20080203071A1 LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
标题翻译：使用具有特殊定制电源配置的激光脉冲进行链接处理
公开(公告)号：US20080203071A1
公开(公告)日：2008-08-28
申请号：US12052577
申请日：2008-03-20
申请人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
发明人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
IPC分类号： B23K26/00
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

59. 发明申请

US20060138106A1 Processing a memory link with a set of at least two laser pulses 审中-公开
公开(公告)号：US20060138106A1
公开(公告)日：2006-06-29
申请号：US11359642
申请日：2006-02-21
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/16
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

60. 发明申请

US20060138096A1 Processing a memory link with a set of at least two laser pulses 审中-公开
公开(公告)号：US20060138096A1
公开(公告)日：2006-06-29
申请号：US11291523
申请日：2005-11-30
申请人： Yunlong Sun , Edward Swenson , Richard Harris
发明人： Yunlong Sun , Edward Swenson , Richard Harris
IPC分类号： B23K26/00
CPC分类号： B23K26/04 , B23K26/0604 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/067 , B23K26/361 , G03F7/70041 , G03F7/70725 , H01L21/76894 , H01L23/5258 , H01L2924/0002 , H01S3/005 , H01S3/0057 , H01S3/0085 , H01S3/0092 , H01S3/1118 , H01S3/2383 , H01S5/4012 , Y10S438/94 , H01L2924/00
摘要： A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

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