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1. 发明申请

US20080203071A1 LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES 审中-公开
标题翻译：使用具有特殊定制电源配置的激光脉冲进行链接处理
公开(公告)号：US20080203071A1
公开(公告)日：2008-08-28
申请号：US12052577
申请日：2008-03-20
申请人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
发明人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
IPC分类号： B23K26/00
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

2. 发明授权

US07348516B2 Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 有权
标题翻译：使用激光脉冲进行链接处理的特殊定制功率曲线的方法和激光系统
公开(公告)号：US07348516B2
公开(公告)日：2008-03-25
申请号：US10921481
申请日：2004-08-18
申请人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
发明人： Yunlong Sun , Richard Harris , Ho Wai Lo , Brian Baird , Jay Johnson , Robert F. Hainsey
IPC分类号： B23K26/00 , B23K26/14 , B23K26/16
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

3. 发明申请

US20050067388A1 Methods of and laser systems for link processing using laser pulses with specially tailored power profiles 有权
标题翻译：使用激光脉冲进行链接处理的特殊定制功率曲线的方法和激光系统
公开(公告)号：US20050067388A1
公开(公告)日：2005-03-31
申请号：US10921481
申请日：2004-08-18
申请人： Yunlong Sun , Richard Harris , Ho Lo , Brian Baird , Jay Johnson
发明人： Yunlong Sun , Richard Harris , Ho Lo , Brian Baird , Jay Johnson
IPC分类号： B23K20060101 , B23K26/06 , B23K26/38 , H01S20060101 , H04J14/02
CPC分类号： H01L23/5258 , B23K26/0613 , B23K26/0622 , B23K2101/40 , H01L2924/0002 , H01L2924/00
摘要： A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.
摘要翻译：具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰。尖峰的定时优先设置在链路被大部分去除的时间之前。特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层链接。

4. 发明申请

US20060028710A1 AOM FREQUENCY AND AMPLITUDE MODULATION TECHNIQUES FOR FACILITATING FULL BEAM EXTINCTION IN LASER SYSTEMS 有权
标题翻译：用于在激光系统中实现全光束截止的AOM频率和幅度调制技术
公开(公告)号：US20060028710A1
公开(公告)日：2006-02-09
申请号：US11138657
申请日：2005-05-25
申请人： Jay Johnson , David Watt , Brian Baird , Richard Harris
发明人： Jay Johnson , David Watt , Brian Baird , Richard Harris
IPC分类号： G02F1/33
CPC分类号： B23K26/0626 , B23K26/0622 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , G02F1/0121 , G02F1/292 , G02F1/33 , G02F1/332 , G02F2201/16 , H01S3/005 , H01S3/1068 , H01S3/117 , H01S3/1306 , H01S3/136
摘要： Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.
摘要翻译：腔内和/或外腔AOM（60）的频率和/或幅度调制技术的数字控制促进激光束（90）的基本上完全消光，以防止不期望的激光能量撞击工件（80）; 通过脉冲对脉冲激光能量的闭环控制，促进激光脉冲幅度稳定性; 促进波束定位控制，包括但不限于用于诸如对准误差校正，波束行走整流或三次定位之类的应用的闭环控制; 并且便于在AOM（60）上使用多于一个的换能器来执行任何上述应用。

5. 发明授权

US07133182B2 AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems 有权
标题翻译：用于促进激光系统全光束消光的AOM频率和幅度调制技术
公开(公告)号：US07133182B2
公开(公告)日：2006-11-07
申请号：US11138657
申请日：2005-05-25
申请人： Jay Johnson , David Watt , Brian Baird , Richard Harris
发明人： Jay Johnson , David Watt , Brian Baird , Richard Harris
IPC分类号： G02F1/11 , B23K26/00 , G02F1/33 , H01S3/10
CPC分类号： B23K26/0626 , B23K26/0622 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , G02F1/0121 , G02F1/292 , G02F1/33 , G02F1/332 , G02F2201/16 , H01S3/005 , H01S3/1068 , H01S3/117 , H01S3/1306 , H01S3/136
摘要： Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.
摘要翻译：腔内和/或外腔AOM（60）的频率和/或幅度调制技术的数字控制促进激光束（90）的基本上完全消光，以防止不期望的激光能量撞击工件（80）; 通过脉冲对脉冲激光能量的闭环控制，促进激光脉冲幅度稳定性; 促进波束定位控制，包括但不限于用于诸如对准误差校正，波束行走整流或三次定位之类的应用的闭环控制; 并且便于在AOM（60）上使用多于一个的换能器来执行任何上述应用。

6. 发明申请

US20050042805A1 Method of forming a scribe line on a passive electronic component substrate 有权
标题翻译：在无源电子部件基板上形成划线的方法
公开(公告)号：US20050042805A1
公开(公告)日：2005-02-24
申请号：US10887662
申请日：2004-07-09
申请人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson , Doug Garcia , Rupendra Anklekar
发明人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson , Doug Garcia , Rupendra Anklekar
IPC分类号： B23K26/04 , B23K26/06 , B23K26/08 , B23K26/40 , B28D5/00 , H01L21/301 , H01L21/44 , H01L21/48 , H01L21/50 , H01S20060101
CPC分类号： B23K26/0622 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/52 , B28D5/0011 , H01L2224/16 , H01L2924/0102 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/09701 , Y10S438/94
摘要： A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.
摘要翻译：形成具有尖锐捕捉线的划线的方法需要沿着陶瓷或陶瓷状衬底引导UV激光束，使得去除衬底厚度的一部分。 UV激光束在衬底中形成划线，而没有明显的衬底熔化，使得明确限定的捕捉线形成延伸到衬底厚度的高应力集中区域。因此，响应于施加到划线的任一侧的断裂力，多个深度裂纹在高应力集中区域中传播到基板的厚度中，以使基板清洁断裂成单独的电路部件。该区域的形成促进了基板的高精度断裂，同时在施加破损力的同时保持了每个部件的内部结构的完整性。

7. 发明申请

US20050009235A1 Method of forming a scribe line on a ceramic substrate 有权
公开(公告)号：US20050009235A1
公开(公告)日：2005-01-13
申请号：US10618377
申请日：2003-07-11
申请人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson
发明人： Edward Swenson , Yunlong Sun , Manoj Sammi , Jay Johnson
IPC分类号： B23K26/04 , B23K26/06 , B23K26/08 , B23K26/40 , B28D5/00 , H01L21/301 , H01L21/44 , H01L21/48 , H01L21/50 , H01S20060101
CPC分类号： B23K26/0622 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/52 , B28D5/0011 , H01L2224/16 , H01L2924/0102 , H01L2924/01067 , H01L2924/01068 , H01L2924/01077 , H01L2924/09701 , Y10S438/94
摘要： A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic substrate such that a portion of the thickness of the ceramic substrate is removed. The UV laser beam forms a scribe line in the ceramic substrate in the absence of appreciable ceramic substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the ceramic substrate. Consequently, multiple depthwise fractures propagate into the thickness of the ceramic substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean breakage of the ceramic substrate into separate circuit components. The formation of this region facilitates higher precision breakage of the ceramic substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.

8. 发明申请

US20070130871A1 Siding spacer and ventilation means for outer walls 审中-公开
标题翻译：用于外墙的隔板和通风装置
公开(公告)号：US20070130871A1
公开(公告)日：2007-06-14
申请号：US11297543
申请日：2005-12-08
申请人： Jay Johnson , Michael Conroy , Kurt Daniels
发明人： Jay Johnson , Michael Conroy , Kurt Daniels
IPC分类号： E04D1/34
CPC分类号： E04F13/0864 , E04F21/1855
摘要： A spacer and a method for its use in an outer wall of a building between the outer vertical surface of its underlying structure and the inner surfaces of each of the portions of overlapped lengths of siding through which the lengths of siding are nailed to the underlying structure to provide a ventilation space between the rear surfaces of the lengths of siding and the outer surface of the underlying structure. The spacers each have a planer rear surface adapted to be positioned against the outer surface of the underlying structure, and a planer front surface portion that can be disposed at a small acute angle (e.g., in the range of about 2 to 3 degrees) with respect to the rear surface at which angle it is desired to have the rear surfaces of the lengths of siding disposed with respect to the outer surface of the underlying structure. A ventilation channel can be provided between a lower horizontal surface on the building and an uppermost edge of its siding to facilitate movement of air to the atmosphere from such a ventilation space transversely through the ventilation channel and openings in a perforated wall portion of the ventilation channel.
摘要翻译：一种间隔件及其在建筑物的外壁中的用途，其在其下部结构的外部垂直表面与重叠长度的壁板的每个部分的内表面之间用于建筑物的外壁，其中壁板的长度通过该间隔钉固定到下面的结构以在隔板长度的后表面和下面的结构的外表面之间提供通风空间。间隔件各自具有适于抵靠下面结构的外表面定位的平面后表面，以及可以以小锐角（例如，在大约2至3度的范围内）设置的平面前表面部分，相对于后表面，在该角度下，希望具有相对于下层结构的外表面设置的侧板长度的后表面。通风通道可以设置在建筑物的下水平表面和其侧板的最上边缘之间，以便于空气从空气通过空气通道横向穿过空气进入大气，并且通风通道的穿孔壁部分中的开口。

9. 发明申请

US20070050075A1 Automatic wafer tracking process and apparatus for carrying out the process 审中-公开
标题翻译：自动晶片跟踪过程和进行该过程的设备
公开(公告)号：US20070050075A1
公开(公告)日：2007-03-01
申请号：US11213103
申请日：2005-08-26
申请人： Jay Johnson , Sean Phillips
发明人： Jay Johnson , Sean Phillips
IPC分类号： G06F19/00
CPC分类号： H01L21/67294
摘要： A semi-conductor wafer processing information system which includes a sensor responsive to the presence of a wafer at a monitored location of a processing machine to read the wafer identification scribe and send both wafer and machine identification signals to a host computer which may be independent of a wafer tracking system. The computer determines whether processing at the selected machine is appropriate. Wafer history information is updated when the wafer departs a given machine.
摘要翻译：一种半导体晶片处理信息系统，其包括响应于处理机器的监视位置处的晶片的存在的传感器，以读取晶片识别划片并将晶片和机器识别信号发送到主计算机，主计算机可独立于晶圆跟踪系统。计算机确定所选机器上的处理是否合适。当晶片离开给定的机器时，晶片历史信息被更新。

10. 发明授权

US07133188B2 AOM modulation techniques employing an upstream Bragg adjustment device 有权
标题翻译：采用上游布拉格调整装置的AOM调制技术
公开(公告)号：US07133188B2
公开(公告)日：2006-11-07
申请号：US11138659
申请日：2005-05-25
申请人： Jay Johnson
发明人： Jay Johnson
IPC分类号： G02F1/33 , B23K26/08 , B23K26/04 , G02F1/11
CPC分类号： B23K26/0626 , B23K26/0622 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , G02F1/0121 , G02F1/292 , G02F1/33 , G02F1/332 , G02F2201/16 , H01S3/005 , H01S3/1068 , H01S3/117 , H01S3/1306 , H01S3/136
摘要： Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM (60) facilitate substantially full extinction of a laser beam (90) to prevent unwanted laser energy from impinging a workpiece (80); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM (60) to perform any of the above-listed applications.
摘要翻译：腔内和/或外腔AOM（60）的频率和/或幅度调制技术的数字控制促进激光束（90）的基本上完全消光，以防止不期望的激光能量撞击工件（80）; 通过脉冲对脉冲激光能量的闭环控制，促进激光脉冲幅度稳定性; 促进波束定位控制，包括但不限于用于诸如对准误差校正，波束行走整流或三次定位之类的应用的闭环控制; 并且便于在AOM（60）上使用多于一个的换能器来执行任何上述应用。

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