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51. 发明申请

US20070131563A1 MEANS TO IMPROVE CENTER TO EDGE UNIFORMITY OF ELECTROCHEMICAL MECHANICAL PROCESSING OF WORKPIECE SURFACE 审中-公开
标题翻译：改善中心工作面电化学机械加工边缘均匀性的手段
公开(公告)号：US20070131563A1
公开(公告)日：2007-06-14
申请号：US11564242
申请日：2006-11-28
申请人： Jeffrey Bogart , Bulent Basol
发明人： Jeffrey Bogart , Bulent Basol
IPC分类号： B23H3/00
CPC分类号： B23H5/08 , C25D5/06 , C25D17/001 , C25D17/06 , C25D17/14 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： An electrochemical mechanical process for electroplating or electropolishing a conductive surface of a wafer is provided. The conductive surface of the wafer is touched by a polishing surface of a compressible pad while a process solution flows through the pad and a potential difference is maintained between the conductive surface and an electrode. The pressure between the polishing surface and a central region of the conductive surface is increased by applying a shaping process to either the conductive surface or the pad.
摘要翻译：提供了用于电镀或电抛光晶片的导电表面的电化学机械工艺。当处理液流过焊盘时，晶片的导电表面被可压缩焊盘的抛光表面接触，并且在导电表面和电极之间保持电位差。抛光表面和导电表面的中心区域之间的压力通过对导电表面或焊盘施加成型工艺而增加。

52. 发明申请

US20070111367A1 Method and apparatus for converting precursor layers into photovoltaic absorbers 审中-公开
标题翻译：用于将前体层转换成光伏吸收器的方法和装置
公开(公告)号：US20070111367A1
公开(公告)日：2007-05-17
申请号：US11549590
申请日：2006-10-13
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： H01L21/00 , C23C16/00
CPC分类号： C23C16/305 , C23C16/54 , H01L31/0322 , H01L31/03928 , Y02E10/541
摘要： The present invention relates to method and apparatus for preparing thin films of semiconductor films for radiation detector and photovoltaic applications. In one aspect, the present invention includes a series of chambers between the inlet and the outlet, with each chamber having a gap that allows a substrate to pass therethrough and which is temperature controlled, thereby allowing each chamber to maintain a different temperature, and the substrate to be annealed based upon a predetermined temperature profile by efficiently moving through the series of chambers. In another aspect, each of the chambers opens and closes, and creates a seal when in the closed position during which time annealing takes place within the gap of the chamber. In a further aspect, the present invention provides a method of forming a Group IBIIIAVIA compound layer on a surface of a flexible roll.
摘要翻译：本发明涉及用于制备用于辐射检测器和光伏应用的半导体膜的薄膜的方法和装置。在一个方面，本发明包括在入口和出口之间的一系列室，每个室具有允许基板通过并且被温度控制的间隙，从而允许每个室保持不同的温度，并且基于通过有效地移动通过该系列室的预定温度分布来退火的基板。在另一方面，每个室都打开和关闭，并且当处于关闭位置时产生密封，在该位置期间在室的间隙内进行退火。另一方面，本发明提供了在柔性卷的表面上形成IBIIIAVIA族化合物层的方法。

53. 发明申请

US20060252254A1 Filling deep and wide openings with defect-free conductor 审中-公开
标题翻译：用无缺陷导体填充深而宽的开口
公开(公告)号：US20060252254A1
公开(公告)日：2006-11-09
申请号：US11351838
申请日：2006-02-09
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： H01L21/4763
CPC分类号： H01L21/2885 , H01L21/76877 , H01L21/76898
摘要： Relatively large openings or features in integrated circuit metallization or packaging vias are filled by two plating or electrodeposition processes in sequence. The first electrodeposition process conformally lines the large, high aspect ratio features to define an inner cavity. The second electrodeposition process uses a different solution to bottom-up fill the inner cavity left by the first electrodeposition process. Conformality is typically induced by use of levelers during the first electrodeposition, while accelerators and suppressors may be used to promote bottom-up fill during the second electrodeposition, although either process may employ any of the three additives.
摘要翻译：集成电路金属化或封装通孔中的相对较大的开口或特征依次由两个电镀或电沉积工艺填充。第一电沉积工艺一致地排列了大的高纵横比特征以限定内腔。第二个电沉积过程使用不同的解决方案来自底向上填充第一次电沉积过程留下的内腔。通常在第一次电沉积期间通过使用矫直机诱导一致性，而在第二次电沉积期间可以使用促进剂和抑制剂来促进自底向上填充，尽管任一方法都可以使用三种添加剂中的任何一种。

54. 发明申请

US20060165911A1 Method of Forming Semiconductor Compound Film For Fabrication of Electronic Device And Film Produced by Same 审中-公开
标题翻译：形成用于制造由其制造的电子器件和薄膜的半导体复合膜的方法
公开(公告)号：US20060165911A1
公开(公告)日：2006-07-27
申请号：US11278664
申请日：2006-04-04
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： B05D1/04
CPC分类号： C23C8/02 , C23C10/02 , C23C10/06 , C23C12/00 , H01L31/0322 , H01L31/18 , Y02E10/541
摘要： A process of forming a compound film includes formulating a nano-powder material with a controlled overall composition and including particles of one solid solution The nano-powder material is deposited on a substrate to form a layer on the substrate, and the layer is reacted in at least one suitable atmosphere to form the compound film. The compound film may be used in fabrication of a radiation detector or solar cell.
摘要翻译：形成化合物膜的方法包括配制具有受控整体组成的纳米粉末材料并且包括一种固溶体的颗粒将纳米粉末材料沉积在基底上以在基底上形成层，并且该层在至少一种合适的气氛形成复合膜。复合膜可用于制造辐射检测器或太阳能电池。

55. 发明申请

US20050150777A1 Method and system for material removal and planarization 审中-公开
标题翻译：材料去除和平面化的方法和系统
公开(公告)号：US20050150777A1
公开(公告)日：2005-07-14
申请号：US11011529
申请日：2004-11-19
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： B24B37/04 , C25F3/02 , H01L21/321 , B23H5/00
CPC分类号： B24B37/042 , B24B37/015 , B24B37/046 , C25F3/02 , H01L21/32115
摘要： A system and method for removal and planarization of conductive material on a semiconductor substrate using an electrode contacting a solution. Physical contact is established between the conductive material and the solution. A buffer layer on the conductive material is formed by varying the temperature of the conductive material. A potential difference is applied between the conductive material and the electrode and the buffer layer is removed from raised regions of the conductive material by electropolishing the raised regions with the solution while the recessed regions of the conductive material are covered by the buffer layer.
摘要翻译：一种使用接触溶液的电极在半导体衬底上去除和平坦化导电材料的系统和方法。在导电材料和溶液之间建立物理接触。通过改变导电材料的温度来形成导电材料上的缓冲层。在导电材料和电极之间施加电位差，并且通过用溶液电解抛光凸起区域，而导电材料的凹陷区域被缓冲层覆盖，从导电材料的凸起区域去除缓冲层。

56. 发明申请

US20050112868A1 Method and apparatus for localized material removal by electrochemical polishing 失效
标题翻译：通过电化学抛光进行局部材料去除的方法和装置
公开(公告)号：US20050112868A1
公开(公告)日：2005-05-26
申请号：US10719909
申请日：2003-11-21
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： C25F3/02 , C25F7/00 , H01L21/321 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/32115 , C25F3/02 , C25F7/00 , H01L21/7684
摘要： An apparatus for electropolishing a conductive material layer is disclosed. The apparatus comprises a porous conductive member configured to contact the conductive layer and having a first connector for receiving electrical power, an electrode insulatively coupled to the porous conductive member having a second connector configured to receive electrical power, a holder insulatively coupled to the porous conductive member and the electrode configured to establish relative motion between the porous conductive member and the conductive layer, and a power supply coupled to the first connector and the second connector configured to supply the electrical power between the electrode and the porous conductive member for electropolishing the conductive layer.
摘要翻译：公开了一种用于电解抛光导电材料层的装置。所述设备包括多孔导电构件，其被配置为接触所述导电层并且具有用于接收电力的第一连接器，绝缘地连接到所述多孔导电构件的电极，所述多孔导电构件具有被配置为接收电力的第二连接器，与所述多孔导电体绝缘耦合的保持器所述电极构造成在所述多孔导电构件和所述导电层之间建立相对运动;以及电源，其耦合到所述第一连接器和所述第二连接器，所述电源被配置为在所述电极和所述多孔导电构件之间提供电功率，以电抛光所述导电层。

57. 发明申请

US20050095846A1 System and method for defect free conductor deposition on substrates 审中-公开
标题翻译：衬底上无缺陷导体沉积的系统和方法
公开(公告)号：US20050095846A1
公开(公告)日：2005-05-05
申请号：US10979341
申请日：2004-11-01
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： H01L21/4763 , H01L21/768
CPC分类号： H01L21/76843 , H01L21/76868 , H01L21/76873 , H01L2221/1089
摘要： A system and method for depositing a defect-free conductor on semiconductor substrates having features and seed layers with defective regions. A repair layer is deposited over the seed layer and the defective regions in a deposition module within a housing. The repair layer can be deposited by atomic layer deposition or chemical vapor deposition. A conductive material is then electroplated over the seed layer to fill the features and form a defect-free conductive layer over the top surface of the substrate. The electroplating is performed in another deposition module within the housing.
摘要翻译：一种用于在具有缺陷区域的特征和种子层的半导体衬底上沉积无缺陷导体的系统和方法。修复层沉积在种子层上并且在壳体内的沉积模块中的缺陷区域上沉积。可以通过原子层沉积或化学气相沉积来沉积修复层。然后将导电材料电镀在种子层上以填充特征并在衬底的顶表面上形成无缺陷的导电层。电镀在外壳内的另一沉积模块中进行。

58. 发明授权

US07404886B2 Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece 有权
标题翻译：通过在设置在工件的表面部分上的添加剂和工件的空腔部分之间产生差异来进行电镀
公开(公告)号：US07404886B2
公开(公告)日：2008-07-29
申请号：US11436857
申请日：2006-05-17
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： C25D5/06 , C25D5/22 , C25D7/12
CPC分类号： H01L21/2885 , C25D3/38 , C25D5/02 , C25D5/022 , C25D5/18 , C25D5/22 , C25D5/34 , C25D17/001 , C25D17/008 , H01L21/7684 , H01L21/76879
摘要： The present invention relates to methods for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
摘要翻译：本发明涉及以非常理想的方式在基板表面上镀覆导电材料的方法。本发明除了设置在空腔部分上的至少一种添加剂之外，除去至少一种吸附在工件的顶部上的添加剂，从而允许导电材料的镀覆在添加剂完全重新吸附到顶部部分之前发生并且产生更大的空腔部分相对于顶部的电镀。

59. 发明申请

US20080093221A1 Roll-To-Roll Electroplating for Photovoltaic Film Manufacturing 审中-公开
标题翻译：光伏薄膜制造的卷对卷电镀
公开(公告)号：US20080093221A1
公开(公告)日：2008-04-24
申请号：US11875784
申请日：2007-10-19
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： C25D5/10 , C25D17/00
CPC分类号： H01L31/0322 , C25D5/10 , C25D5/50 , C25D7/0635 , C25D17/00 , C25D21/12 , H01L31/03928 , Y02E10/541 , Y02P70/521
摘要： A roll to roll system for forming an absorber structure for solar cells on a flexible foil as the flexible foil is advanced through units of the system and by unwrapping from a supply spool and wrapping around a take-up spool. Surface of the flexible foil is first conditioned in a conditioning unit to form an activated surface. A precursor stack including copper, gallium and indium layers is electroplated onto the activated surface by utilizing separate electroplating units for each layers. The precursor layer is reacted with at least one of Se and S in an annealing unit of the system.
摘要翻译：一种卷对卷系统，用于在柔性箔片上形成用于太阳能电池的吸收体结构，因为柔性箔片通过系统的单元前进并且从供应卷轴展开卷绕并卷绕卷绕卷轴。柔性箔的表面首先在调节单元中调节以形成活化表面。包括铜，镓和铟层的前体堆叠通过为每层使用单独的电镀单元而电镀到活化表面上。在系统的退火单元中，前体层与Se和S中的至少一个反应。

60. 发明申请

US20070093006A1 Technique For Preparing Precursor Films And Compound Layers For Thin Film Solar Cell Fabrication And Apparatus Corresponding Thereto 审中-公开
标题翻译：用于制备薄膜的前体膜和复合层的技术太阳能电池制造及其相应的装置
公开(公告)号：US20070093006A1
公开(公告)日：2007-04-26
申请号：US11462685
申请日：2006-08-04
申请人： Bulent Basol
发明人： Bulent Basol
IPC分类号： H01L21/84 , H01L29/08 , H01L35/24 , H01L21/00 , H01L51/00
CPC分类号： H01L31/0322 , H01L21/0237 , H01L21/02425 , H01L21/02491 , H01L21/02568 , H01L21/02614 , H01L21/02628 , H01L21/02658 , H01L31/022425 , H01L31/022466 , H01L31/022483 , H01L31/0296 , H01L31/0392 , H01L31/03925 , H01L31/03928 , H01L31/0749 , H01L31/1844 , Y02E10/541 , Y02E10/544 , Y02P70/521
摘要： The present invention advantageously provides for, in different embodiments, improved contact layers or nucleation layers over which precursors and Group IBIIIAVIA compound thin films adhere well and form high quality layers with excellent micro-scale compositional uniformity. It also provides methods to form precursor stack layers, by wet deposition techniques such as electroplating, with large degree of freedom in terms of deposition sequence of different layers forming the stack.
摘要翻译：本发明在不同的实施方案中有利地提供了改进的接触层或成核层，其上前体和IBIIIAVIA族化合物薄膜在其上良好地粘附并形成具有优异的微尺度组成均匀性的高质量层。它还提供了通过诸如电镀的湿沉积技术形成前体叠层的方法，在形成叠层的不同层的沉积顺序方面具有很大的自由度。

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