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    • 56. 发明授权
    • Method and apparatus for vacuum treatment
    • 真空处理方法和装置
    • US06553277B1
    • 2003-04-22
    • US09959764
    • 2001-11-06
    • Shoji YagisawaHiromitsu KanbaraHiroshi NishikawaTakashi Ito
    • Shoji YagisawaHiromitsu KanbaraHiroshi NishikawaTakashi Ito
    • H05H100
    • H01L21/67253H01J37/32935H01L22/34H01L2924/0002H01L2924/00
    • A method of vacuum treatment is performed using a vacuum treatment system (1) comprising a vacuum treatment unit (31) for treating a wafer (W) placed on a wafer stage (10) and a controller (51) for controlling the vacuum treatment unit (31). A sensor wafer (11) of substantially the same shape and size as a wafer (W), which includes a detector element (11d) for detecting data about the state of a vacuum treatment and a data processing element (11p) for processing the detected data, is placed on the wafer stage (10) and treated in a vacuum by the vacuum treatment unit (31). While the sensor wafer (11) is subjected to a vacuum treatment, data on the state of the vacuum treatment is detected and processed. Based on the processed data, the controller (51) controls the vacuum treatment unit (31) to treat the wafer (W).
    • 使用真空处理系统(1)进行真空处理的方法,真空处理系统(1)包括用于处理放置在晶片台(10)上的晶片(W)的真空处理单元(31)和用于控制真空处理单元 (31)。 一种与晶片(W)基本相同形状和尺寸的传感器晶片(11),其包括用于检测关于真空处理状态的数据的检测器元件(11d)和用于处理检测到的数据处理元件(11p) 数据放置在晶片台(10)上,并通过真空处理单元(31)在真空中进行处理。 在对传感器晶片(11)进行真空处理的同时,检测并处理真空处理状态的数据。 基于处理数据,控制器(51)控制真空处理单元(31)来处理晶片(W)。
    • 57. 发明授权
    • Optical data recording/reproducing device
    • 光学数据记录/再现装置
    • US06411588B1
    • 2002-06-25
    • US09152329
    • 1998-09-14
    • Toshiyuki KaseHiroshi Nishikawa
    • Toshiyuki KaseHiroshi Nishikawa
    • G11B700
    • G11B7/133G11B7/1263G11B7/1374G11B7/1381
    • Disclosed is an optical data recording/reproducing device which is provided with a laser diode for emitting laser beam, an illuminating optical system including an objective lens which converges the laser beam emitted by the laser diode on an optical disc, a monitoring optical system including a light receiving element which receives a part of the laser beam emitted by the laser diode, and a driving circuit which drives the laser diode in accordance with an output signal of the light receiving element. A coupling efficiency of the illuminating optical system and a coupling efficiency of the monitoring optical system are made substantially the same.
    • 公开了一种设置有用于发射激光束的激光二极管的光学数据记录/再现装置,包括将由激光二极管发射的激光束会聚在光盘上的物镜的照明光学系统,包括 接收由激光二极管发射的激光束的一部分的光接收元件,以及根据光接收元件的输出信号来驱动激光二极管的驱动电路。 照明光学系统的耦合效率和监视光学系统的耦合效率基本上相同。
    • 59. 再颁专利
    • Plasma processing apparatus and method
    • 等离子体处理装置及方法
    • USRE36810E
    • 2000-08-08
    • US165545
    • 1998-10-02
    • Masashi ArasawaKatsuhiko OnoHiroshi NishikawaKazuo Tsuchiya
    • Masashi ArasawaKatsuhiko OnoHiroshi NishikawaKazuo Tsuchiya
    • H01L21/302C23C16/458H01J37/32H01L21/205H01L21/3065H01L21/00
    • C23C16/466C23C16/4586H01J37/32431H01J2237/2001
    • A plasma processing apparatus comprises a first passage opened in a top of suscepter at a peripheral area thereof, a first gas supply source for supplying heat exchange gas into a small clearance between the suscepter and a wafer through the first passage, a first vacuum pump for exhausting the clearance through the first passage, a second passage opened in the top of the suscepter at a center area thereof, a second gas supply source for supplying heat exchange gas into the clearance through the second passage, a second vacuum pump for exhausting the clearance through the second passage, and a controller for controlling the first and second gas supply sources and the first and second vacuum pumps independently of the others in such a way that backpressure caused in the second passage by the second gas supply source and vacuum pump can become lower than backpressure caused in the first passage by the first gas supply source and vacuum pump.
    • 一种等离子体处理装置,包括:在其周边区域的开口的顶部开口的第一通路;第一气体供给源,其通过第一通路将热交换气体供给到所述容器和晶片之间的小间隙;第一真空泵, 通过第一通道排出间隙,第二通道在其中心区域处在容器的顶部开口,第二气体供应源,用于通过第二通道将热交换气体供应到间隙中;第二真空泵,用于排出间隙 通过第二通道,以及用于独立于其他方式控制第一和第二气体供给源以及第一和第二真空泵的控制器,使得由第二气体供应源和真空泵在第二通道中产生的背压可以变成 低于由第一气体供应源和真空泵在第一通道中引起的背压。