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51. 发明授权

US09390950B2 Rapid thermal processing chamber with micro-positioning system 有权
标题翻译：具有微型定位系统的快速热处理室
公开(公告)号：US09390950B2
公开(公告)日：2016-07-12
申请号：US14529848
申请日：2014-10-31
申请人： Applied Materials, Inc.
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
IPC分类号： H01L21/68 , H01L21/67 , H01L21/687 , H01L21/324
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译：描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

52. 发明申请

US20160196992A1 LAMP DRIVER FOR LOW PRESSURE ENVIRONMENT 审中-公开
标题翻译：用于低压环境的灯驱动器
公开(公告)号：US20160196992A1
公开(公告)日：2016-07-07
申请号：US14987378
申请日：2016-01-04
申请人： Applied Materials, Inc.
发明人： Oleg V. SEREBRYANOV , Alexander GOLDIN , Joseph M. Ranish
IPC分类号： H01L21/67 , F27D11/02
CPC分类号： H01L21/67115 , F27B17/0025
摘要： Embodiments of the present disclosure relate to a lamp driver for lamps used as a source of heat radiation in a thermal processing chamber. The lamp driver includes a power source, at least two DC/DC converters, each DC/DC converter connected with the power source in series, a direct connection between the at least two DC/DC converters, and a line that is attached to the direct connection and attachable to a reference voltage. A plurality of the lamp drivers may be utilized to power a plurality of lamps positioned in a grounded lamphead assembly. The electrical potential between the lamps and the grounded lamphead assembly is reduced, which reduces the risk of arcing between the lamps and the lamphead assembly.
摘要翻译：本公开的实施例涉及用作在热处理室中的热辐射源的灯的灯驱动器。灯驱动器包括电源，至少两个DC / DC转换器，与电源串联的每个DC / DC转换器，至少两个DC / DC转换器之间的直接连接，以及连接到直接连接并可连接到参考电压。可以使用多个灯驱动器为位于接地的灯头组件中的多个灯提供动力。灯和接地灯头组件之间的电位降低，这降低了灯和灯头组件之间的电弧的风险。

53. 发明授权

US09076828B2 Edge ring for a thermal processing chamber 有权
标题翻译：用于热处理室的边缘环
公开(公告)号：US09076828B2
公开(公告)日：2015-07-07
申请号：US14264828
申请日：2014-04-29
申请人： Applied Materials, Inc.
发明人： Blake Koelmel , Joseph M. Ranish , Abhilash J. Mayur
IPC分类号： H01L21/673 , F27D11/12 , H01L21/687 , F27D5/00 , H01L21/67
CPC分类号： H01L21/67346 , F27D5/0037 , F27D11/12 , F27D2005/0081 , H01L21/67115 , H01L21/68735
摘要： Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring.
摘要翻译：本发明的实施例提供一种用于支撑具有增加的温度均匀性的基板的边缘环。更具体地，本发明的实施例提供一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个表面积增加结构。

54. 发明申请

US20140376898A1 ABSORBING REFLECTOR FOR SEMICONDUCTOR PROCESSING CHAMBER 有权
标题翻译：用于半导体加工室的吸收反射器
公开(公告)号：US20140376898A1
公开(公告)日：2014-12-25
申请号：US14258410
申请日：2014-04-22
申请人： Applied Materials, Inc.
发明人： Kin Pong Lo , Paul Brillhart , Balasubramanian Ramachandran , Satheesh Kuppurao , Daniel Redfield , Joseph M. Ranish , James Francis Mack , Kailash Kiran Patalay , Michael Olsen , Eddie Feigel , Richard Halpin , Brett Vetorino
IPC分类号： H05B3/00 , H01L21/67
CPC分类号： H05B3/0047 , H01L21/67115
摘要： Embodiments of the disclosure generally relate to a reflector for use in a thermal processing chamber. In one embodiment, the thermal processing chamber generally includes an upper dome, a lower dome opposing the upper dome, the upper dome and the lower dome defining an internal volume of the processing chamber, a substrate support disposed within the internal volume, and a reflector positioned above and proximate to the upper dome, wherein the reflector has a heat absorptive coating layer deposited on a side of the reflector facing the substrate support.
摘要翻译：本公开的实施例一般涉及用于热处理室的反射器。在一个实施例中，热处理室通常包括上圆顶，与上圆顶相对的下圆顶，上圆顶和下圆顶，其限定处理室的内部体积，设置在内部体积内的基板支撑件和反射器定位在上部圆顶上方并且靠近上部圆顶，其中反射器具有沉积在面向基板支撑件的反射器的侧面上的热吸收涂层。

55. 发明授权

US08900889B2 Rapid thermal processing chamber with micro-positioning system 有权
标题翻译：具有微型定位系统的快速热处理室
公开(公告)号：US08900889B2
公开(公告)日：2014-12-02
申请号：US13656150
申请日：2012-10-19
申请人： Applied Materials, Inc.
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
IPC分类号： H01L21/66 , H01L21/687 , H01L21/67 , H01L21/68
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译：描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

56. 发明授权

US08698049B2 Rapid thermal processing lamphead with improved cooling 有权
标题翻译：快速热处理灯头具有改进的冷却
公开(公告)号：US08698049B2
公开(公告)日：2014-04-15
申请号：US13657935
申请日：2012-10-23
申请人： Applied Materials, Inc.
发明人： Joseph M. Ranish , Khurshed Sorabji , Kedarnath Sangam , Alexander Lerner
IPC分类号： A21B1/00 , F21V29/00
CPC分类号： F27B17/0025 , F27D5/0037 , F27D21/0014 , H01L21/67109 , H01L21/67115
摘要： Embodiments of a lamphead and apparatus utilizing same are provided. In some embodiments, a lamphead for thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage, wherein the at least one heat transfer member extends into each coolant passage up to the full height of each coolant passage. The lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
摘要翻译：提供了一种灯头和利用其的装置的实施例。在一些实施例中，用于热处理的灯头可以包括具有多个冷却剂通道和多个灯通道和反射器腔的整体构件，其中每个灯通道被配置为容纳灯，并且每个反射器腔被成形为充当反射器或接收用于灯的可替换反射器，并且其中所述多个冷却剂通道设置成靠近所述多个灯通道; 以及至少一个传热构件，其从所述整体构件延伸到每个冷却剂通道中，其中所述至少一个传热构件延伸到每个冷却剂通道中直到每个冷却剂通道的全高度。灯头可以设置在包括具有基板支撑件的处理室的设备中，其中灯头被定位成向基板支撑件提供能量。

57. 发明授权

US11337277B2 Circular lamp arrays 有权
公开(公告)号：US11337277B2
公开(公告)日：2022-05-17
申请号：US16390892
申请日：2019-04-22
申请人： Applied Materials, Inc.
发明人： Joseph M. Ranish
IPC分类号： H05B3/00 , H05B1/02
摘要： Embodiments disclosed herein relate to circular lamp arrays for use in a semiconductor processing chamber. Circular lamp arrays utilizing one or more torroidal lamps disposed in a reflective trough and arranged in a concentric circular pattern may provide for improved rapid thermal processing. The reflective troughs, which may house the torroidal lamps, may be disposed at various angles relative to a surface of a substrate being processed.

58. 发明授权

US11162845B2 Method and apparatus for measuring temperature 有权
公开(公告)号：US11162845B2
公开(公告)日：2021-11-02
申请号：US16381995
申请日：2019-04-11
申请人： Applied Materials, Inc.
发明人： Joseph M. Ranish
IPC分类号： G01J5/00 , G01K7/00 , G01K7/01
摘要： Apparatuses and methods for measuring substrate temperature are provided. In one or more embodiments, an apparatus for estimating a temperature is provided and includes a plurality of electromagnetic radiation sources positioned to emit electromagnetic radiation toward a reflection plane, and a plurality of electromagnetic radiation detectors. Each electromagnetic radiation detector is positioned to sample the electromagnetic radiation emitted by a corresponding electromagnetic radiation source of the plurality of electromagnetic radiation sources. The apparatus also includes a pyrometer positioned to receive electromagnetic radiation emitted by plurality of electromagnetic radiation sources and reflected from a substrate disposed at a reflection plane and electromagnetic radiation emitted by the substrate. The apparatus includes a processor configured to estimate a temperature of the substrate based on the electromagnetic radiation emitted by the substrate. Methods of estimating temperature are also provided.

59. 发明授权

US10857623B2 Annealing apparatus using two wavelengths of radiation 有权
公开(公告)号：US10857623B2
公开(公告)日：2020-12-08
申请号：US15838010
申请日：2017-12-11
申请人： Applied Materials, Inc.
发明人： Dean Jennings , Haifan Liang , Mark Yam , Vijay Parihar , Abhilash J. Mayur , Aaron Muir Hunter , Bruce E. Adams , Joseph M. Ranish
IPC分类号： B23K26/06 , B23K26/073 , B23K26/352 , H01L21/324 , H01L21/268 , H01L21/02 , H01L21/20
摘要： A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

60. 发明授权

US10734257B2 Direct current lamp driver for substrate processing 有权
公开(公告)号：US10734257B2
公开(公告)日：2020-08-04
申请号：US13866505
申请日：2013-04-19
申请人： APPLIED MATERIALS, INC.
发明人： Oleg Serebryanov , Joseph M. Ranish , Alexander Goldin
IPC分类号： H01L21/67
摘要： Methods and apparatus for heating a substrate in a process chamber are provided herein. In some embodiments, an apparatus for heating a substrate in a process chamber includes a lamp group comprising one or more sets of lamps to provide radiant energy to heat a substrate when disposed in the process chamber, wherein each set of lamps comprises a plurality of lamps wired in series, and wherein each set of lamps is wired in parallel with respect to other sets of the one or more sets of lamps; an alternating current (AC) power source to produce an AC input waveform; and a lamp driver to power the lamp group, the lamp driver including a rectifier coupled to the AC power source to convert the AC input waveform to DC voltage; and a direct current to direct current (DC/DC) converter to reduce voltage of the DC power.

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