会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 51. 发明申请
    • Electron beam exposure method, hot spot detecting apparatus, semiconductor device manufacturing method, and computer program product
    • 电子束曝光方法,热点检测装置,半导体器件制造方法和计算机程序产品
    • US20070042513A1
    • 2007-02-22
    • US11504666
    • 2006-08-16
    • Tetsuro Nakasugi
    • Tetsuro Nakasugi
    • H01L21/66G01N23/00
    • G01N23/00G01R31/305Y10S430/143
    • An EB exposure method includes dividing drawing layer pattern to be transferred onto drawing layer by EB exposure and underlying pattern to be transferred onto an underlying layer of the drawing layer by the EB exposure respectively into unit regions, setting representative figure in each of the unit regions of the drawing and underlying layers, the representative figure set in each of the unit regions of the drawing layer corresponding to the drawing layer pattern of each of the unit regions of the drawing layer, the representative figure set in each of the unit regions of the underlying layer corresponding to the underlying layer pattern of each of the unit regions of the underlying layer, and obtaining influence of proximity effect of an arbitrary region of the drawing layer pattern, based on the representative figure that corresponds to the drawing and underlying layer patterns.
    • EB曝光方法包括通过EB曝光将下层图案划分到绘图层上并通过EB曝光转移到绘图层的下层上,分别形成单元区域,在每个单位区域中设置代表性图形 的图形和下层的每个单元区域中的每个单元区域中的代表性图形对应于绘图层的每个单位区域的绘制层图案,在每个单元区域中设置的代表性图形 下层对应于下层的每个单位区域的下层图案,并且基于对应于附图和下层图案的代表性图来获得绘图层图案的任意区域的邻近效应的影响。
    • 52. 发明申请
    • Electron beam writing method, electron beam writing apparatus and semiconductor device manufacturing method
    • 电子束写入方法,电子束写入装置和半导体器件的制造方法
    • US20060289797A1
    • 2006-12-28
    • US11409987
    • 2006-04-25
    • Ryoichi InanamiTetsuro Nakasugi
    • Ryoichi InanamiTetsuro Nakasugi
    • A61N5/00
    • H01J37/3174B82Y10/00B82Y40/00
    • An electron beam writing method is disclosed, which includes preparing electron beam writing data structured from writing pattern data expressed by both data of VSB shots which are units of shaping beams at the time of carrying out writing a pattern and data of CP shots serving as bases of a repeating pattern, and CP aperture data into which identification numbers IDs and opening positions of respective openings of a CP aperture having openings for VSB shots and openings for CP shots are described, inputting the electron beam writing data to an electron beam writing apparatus, and expanding the electron beam writing data into data of the respective shots defined in the electron beam writing data, determining irradiation times of the respective expanded shots while correcting shot positions, and outputting control signals corresponding to shot data to repeat a shot of a desired pattern, by the electron beam writing apparatus.
    • 公开了一种电子束写入方法,其中包括准备电子束写入数据,该电子束写入数据由写入模式数据构成,该模式数据由作为执行写入模式时的整形波束的单元的VSB镜头的数据和用作基础的CP镜头的数据表示 描述了CP电子束写入数据到电子束写入装置的CP孔径数据,CP孔径数据ID和具有用于VSB镜头的开口的CP孔的各个开口的打开位置和CP镜头的开口位置, 并且将电子束写入数据扩展为在电子束写入数据中定义的各个镜头的数据,同时在校正镜头位置的同时确定各个扩展镜头的照射时间,并且输出对应于镜头数据的控制信号以重复所需图案的镜头 ,由电子束写入装置。
    • 60. 发明授权
    • Imprint method
    • 印记法
    • US08202463B2
    • 2012-06-19
    • US12426527
    • 2009-04-20
    • Ikuo YonedaTetsuro NakasugiShinji Mikami
    • Ikuo YonedaTetsuro NakasugiShinji Mikami
    • B29C59/00
    • B29C37/006B29C35/0888B29C37/0053B29C2035/0827B29C2059/023B82Y10/00B82Y40/00G03F7/0002
    • An imprint method includes contacting a template on a first substrate. The template includes a pattern to be transferred on the first substrate. The first substrate includes a first semiconductor substrate, and a first light curable resin coated on the first semiconductor substrate. The method further includes separating the template from the first substrate, and removing particles adhered on the template. The particle removal includes: pressing the template on an adhesive member which is distinct from the first substrate. The adhesive member includes a dummy substrate, a particle removing film formed on the dummy substrate and configured to remove the particles, and a second light curable resin coated on the particle removing film. The second light curable resin is thicker than the first light curable resin.
    • 压印方法包括在第一衬底上接触模板。 模板包括要在第一基板上转印的图案。 第一基板包括第一半导体基板和涂覆在第一半导体基板上的第一光固化树脂。 该方法还包括从第一基底分离模板,以及除去附着在模板上的颗粒。 颗粒去除包括:将模板压在与第一基板不同的粘合剂构件上。 所述粘合部件包括虚拟基板,形成在所述虚设基板上并构成为除去所述粒子的除粒膜,以及涂覆在所述除粒膜上的第二光固化树脂。 第二光固化树脂比第一光固化树脂厚。