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51. 发明申请

US20120186867A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20120186867A1
公开(公告)日：2012-07-26
申请号：US13432471
申请日：2012-03-28
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/11
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board including a first insulating layer, a first conductor layer having circuits on one surface of the first insulating layer, a second conductor layer having circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes formed in openings of the first and second insulating layers and made of conductive materials filling the openings such that circuits in the first and third conductor layers are connected to one or more circuits in the second conductor layer, and the first and second via holes have bottom ends facing the second conductor layer and top ends larger than the bottom ends.
摘要翻译：一种多层印刷电路板，包括第一绝缘层，在第一绝缘层的一个表面上具有电路的第一导体层，在第一绝缘层的相对表面上具有电路的第二导体层，第二绝缘层，第二导体和第一绝缘层，以及在第二导体层的相对侧的第二绝缘层上具有电路的第三导体层。第一和第二绝缘层具有形成在第一和第二绝缘层的开口中的第一和第二通孔，并由填充开口的导电材料制成，使得第一和第三导体层中的电路连接到第二和第二绝缘层中的一个或多个电路导体层，第一和第二通孔具有面向第二导体层的底端，并且顶端大于底端。

52. 发明申请

US20120169434A1 FILTER 有权
标题翻译：过滤
公开(公告)号：US20120169434A1
公开(公告)日：2012-07-05
申请号：US13420740
申请日：2012-03-15
申请人： Hiroshi MASUDA , Takahiro MORI
发明人： Hiroshi MASUDA , Takahiro MORI
IPC分类号： H03H7/01
CPC分类号： H03H7/0115 , H03H7/075 , H03H7/09 , H03H7/1708 , H03H7/1766 , H03H7/1775 , H03H2001/0085
摘要： A filter includes a multilayer body including a plurality of insulator layers stacked on top of one another. Outer electrodes are provided on surfaces of the multilayer body. A first resonator is connected to a first one of the outer electrodes and includes a first coil. A second resonator is connected to a second one of the outer electrodes and includes a second coil. A third resonator includes a third coil that is magnetically coupled with the first and second coils. The first and second coils are respectively defined by coil conductor layers provided on an insulator layer. The third coil is defined by via hole conductors that penetrate through the insulator layer in a z-axis direction.
摘要翻译：滤波器包括多层体，其包括堆叠在彼此顶部的多个绝缘体层。外电极设置在多层体的表面上。第一谐振器连接到第一外部电极并包括第一线圈。第二谐振器连接到外部电极中的第二谐振器，并且包括第二线圈。第三谐振器包括与第一和第二线圈磁耦合的第三线圈。第一和第二线圈分别由设置在绝缘体层上的线圈导体层限定。第三线圈由穿过绝缘体层的通孔导体在z轴方向上限定。

53. 发明申请

US20120161062A1 FERRITE MAGNETIC MATERIAL 有权
标题翻译：铁素体磁性材料
公开(公告)号：US20120161062A1
公开(公告)日：2012-06-28
申请号：US13382220
申请日：2010-07-02
申请人： Junichi Nagaoka , Takahiro Mori , Hiroyuki Morita , Yoshihiko Minachi
发明人： Junichi Nagaoka , Takahiro Mori , Hiroyuki Morita , Yoshihiko Minachi
IPC分类号： H01F1/01
CPC分类号： H01F1/10 , C01G49/0054 , C01G51/006 , C01P2002/30 , C01P2004/61 , C01P2004/62 , C01P2006/12 , C04B35/2633 , C04B35/2641 , C04B35/6261 , C04B35/6263 , C04B35/632 , C04B2235/32 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3213 , C04B2235/3215 , C04B2235/3217 , C04B2235/3224 , C04B2235/3227 , C04B2235/3232 , C04B2235/3239 , C04B2235/3241 , C04B2235/3244 , C04B2235/3251 , C04B2235/3256 , C04B2235/3258 , C04B2235/3262 , C04B2235/3277 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3286 , C04B2235/3287 , C04B2235/3293 , C04B2235/3294 , C04B2235/3409 , C04B2235/3418 , C04B2235/447 , C04B2235/448 , C04B2235/5409 , C04B2235/5436 , C04B2235/5445 , C04B2235/549 , C04B2235/605 , C04B2235/6562 , C04B2235/661 , C04B2235/72 , C04B2235/726 , C04B2235/727 , C04B2235/767 , C04B2235/785 , C04B2235/786 , C04B2235/85 , C04B2235/94 , C04B2235/95 , H01F1/11
摘要： An object of the present invention is to provide a ferrite magnetic material which can provide a permanent magnet retaining high Br and HcJ as well as having high Hk/HcJ. The ferrite magnetic material according to a preferred embodiment is a ferrite magnetic material formed of hard ferrite, wherein a P content in terms of P2O5 is 0.001% by mass or more.
摘要翻译：本发明的目的是提供一种能够提供保持高Br和HcJ的永磁体以及具有高Hk / HcJ的铁氧体磁性材料。根据优选实施方案的铁氧体磁性材料是由硬质铁氧体形成的铁氧体磁性材料，其中以P 2 O 5计的P含量为0.001质量％以上。

54. 发明申请

US20120049974A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20120049974A1
公开(公告)日：2012-03-01
申请号：US13211355
申请日：2011-08-17
申请人： Hiroshi MASUDA , Takahiro MORI
发明人： Hiroshi MASUDA , Takahiro MORI
IPC分类号： H01P5/00 , H01P3/08
CPC分类号： H01P5/187
摘要： External electrodes are provided on a bottom surface of a laminate, and are connected to both ends of a main line and both ends of a sub-line, respectively. A warpage prevention conductor is provided on an insulating material layer that is provided on a top surface side of the laminate with respect to insulating material layers to which the main line is provided and with respect to insulating material layers to which the sub-line is provided. The warpage prevention conductor overlaps with the external electrodes when seen from a z-axis direction in a plan view. A conductor layer that is not connected to the main line or the sub-line is not provided on any of the insulating material layers provided on a bottom surface side of the laminate with respect to the insulating material layer on which the warpage prevention conductor is provided.
摘要翻译：外部电极设置在层叠体的底面上，分别连接在主线和副线的两端的两端。防翘曲导体设置在绝缘材料层上，该绝缘材料层设置在相对于设置有主线的绝缘材料层的层叠体的顶表面侧，并且相对于设置有子线的绝缘材料层。在俯视图中，从z轴方向观察时，翘曲防止导体与外部电极重叠。没有连接到主线或子线的导体层不设置在相对于其上提供防翘曲导体的绝缘材料层设置在层叠体的底表面侧上的任何绝缘材料层上。

55. 发明申请

US20120001703A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20120001703A1
公开(公告)日：2012-01-05
申请号：US13232563
申请日：2011-09-14
申请人： Takahiro MORI , Hiroshi MASUDA
发明人： Takahiro MORI , Hiroshi MASUDA
IPC分类号： H03H7/01
CPC分类号： H01P1/20354
摘要： An electronic component includes a laminated body including an insulating material layer made of a first dielectric material and a second insulating material layer made of a second dielectric material having a relative dielectric constant greater than that of the first dielectric material that are laminated to one another. An LC filter is defined by a coil included in the laminated body and a capacitor. The coil includes a coil conductor layer provided on the insulating material layer. The coil conductor layer is provided within a region including the insulating material layer.
摘要翻译：电子部件包括层叠体，该层叠体包括由第一电介质材料构成的绝缘材料层和由相互层压的相对介电常数大于第二绝缘材料的第二电介质材料制成的第二绝缘材料层。 LC滤波器由包括在层叠体中的线圈和电容器限定。线圈包括设置在绝缘材料层上的线圈导体层。线圈导体层设置在包括绝缘材料层的区域内。

56. 发明申请

US20110192637A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110192637A1
公开(公告)日：2011-08-11
申请号：US13089378
申请日：2011-04-19
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/03
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction.
摘要翻译：多层印刷电路板包括：包括树脂层的芯结构和被树脂层夹持的导体电路，所述芯结构具有第一和第二表面，在芯结构的第一表面上包括导体电路的第一导体层，以及第二导体层，包括在芯结构的第二表面上的导体电路。芯结构包括第一和通孔，并且第一和第二通孔分别包括在树脂层中分别填充到各个开口顶部的金属，将一个或多个导体电路夹在芯结构中并垂直定位以形成电连接第一和第二导体层的各个导体电路的通孔以及第一和第二通孔在垂直方向上彼此偏离。

57. 发明申请

US20110036626A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD 有权
标题翻译：多层印刷电路板及制造多层印刷电路板的方法
公开(公告)号：US20110036626A1
公开(公告)日：2011-02-17
申请号：US12913258
申请日：2010-10-27
申请人： Motoo ASAI , Dongdong Wang , Takahiro Mori
发明人： Motoo ASAI , Dongdong Wang , Takahiro Mori
IPC分类号： H05K1/11
CPC分类号： H05K3/423 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H05K1/036 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/381 , H05K3/385 , H05K3/387 , H05K3/388 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K2201/0195 , H05K2201/0352 , H05K2201/0355 , H05K2201/0394 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09736 , H05K2201/09881 , H05K2203/0315 , H05K2203/0733 , H05K2203/0773 , H05K2203/1476 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599
摘要： A multi-layer printed circuit board including a first insulating layer, a first conductor layer having conductor circuits on one surface of the first insulating layer, a second conductor layer having conductor circuits on the opposite surface of the first insulating layer, a second insulating layer on the second conductor and first insulating layers, and a third conductor layer having conductor circuits on the second insulating layer on the opposite side of the second conductor layer. The first and second insulating layers have first and second via holes which are formed in openings of the first and second insulating layers and made of conductive materials filled to the top of the openings such that conductor circuits in the first and third conductor layers are connected to one or more conductor circuits in the second conductor layer, and the first and second via holes are tapering toward the second conductor layer.
摘要翻译：一种多层印刷电路板，包括第一绝缘层，在第一绝缘层的一个表面上具有导体电路的第一导体层，在第一绝缘层的相对表面上具有导体电路的第二导体层，第二绝缘层在第二导体和第一绝缘层上的第二绝缘层和在第二导体层的相对侧的第二绝缘层上具有导体电路的第三导体层。第一绝缘层和第二绝缘层具有第一和第二通孔，其形成在第一和第二绝缘层的开口中，并由填充到开口顶部的导电材料制成，使得第一和第三导体层中的导体电路连接到第二导体层中的一个或多个导体电路，以及第一和第二通孔朝向第二导体层逐渐变细。

58. 发明授权

US07859315B2 Driver circuit 有权
标题翻译：驱动电路
公开(公告)号：US07859315B2
公开(公告)日：2010-12-28
申请号：US12330110
申请日：2008-12-08
申请人： Akira Nakamori , Takahiro Mori , Tomoyuki Yamazaki
发明人： Akira Nakamori , Takahiro Mori , Tomoyuki Yamazaki
IPC分类号： H03B1/00
CPC分类号： H03K17/168 , H03K17/163 , H03K2217/0036
摘要： A driver circuit facilitates reducing noises and losses and improving the driving performances thereof without connecting a series circuit of capacitor and a resistor to the gate of IGBT. The driver circuit includes a slope setting circuit that sets the gate voltage waveform of IGBT; and an operational amplifier that includes a non-inverting input terminal, to which an output voltage V* from slope setting circuit is inputted, and an inverting input terminal, to which a divided voltage Vgsf divided by resistors is inputted; and the operational amplifier outputs an output voltage Vout, proportional to the difference between the output voltage V* and the divided voltage Vgsf, to the gate of IGBT.
摘要翻译：驱动电路有助于降低噪声和损耗，并提高其驱动性能，而无需将电容器和电阻器的串联电路连接到IGBT的栅极。驱动电路包括设置IGBT栅极电压波形的斜坡设定电路; 以及运算放大器，其包括输入来自斜坡设定电路的输出电压V *的非反相输入端子和输入了由电阻器分压的分压电压Vgsf的反相输入端子; 并且运算放大器将与输出电压V *和分压Vgsf之间的差成比例的输出电压Vout输出到IGBT的栅极。

59. 发明申请

US20100112323A1 COMPOSITE MATERIAL 有权
标题翻译：复合材料
公开(公告)号：US20100112323A1
公开(公告)日：2010-05-06
申请号：US12595307
申请日：2008-05-29
申请人： Takahiro Mori , Yoshihiro Fukuda , Yoshinori Takahata
发明人： Takahiro Mori , Yoshihiro Fukuda , Yoshinori Takahata
IPC分类号： B32B27/38
CPC分类号： H05K1/036 , B32B27/08 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2262/0269 , B32B2262/0276 , B32B2262/062 , B32B2262/10 , B32B2262/101 , B32B2262/106 , B32B2264/105 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , C08G59/44 , H05K1/0346 , H05K2201/0154 , Y10T428/263 , Y10T428/266 , Y10T428/269 , Y10T428/31511 , Y10T428/31721 , Y10T428/31725
摘要： A composite material obtained by laminating (A) a layer formed of an epoxy resin curing composition including a polyamide compound having a structure containing a phenolic hydroxyl group represented by the following formula (I) or (II) in its repeating unit and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. In formula (I), ring A and R each represent an arylene group having 6 to 18 carbon atoms, an alkylidenediarylene group having 13 to 25 carbon atoms, etc. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediaryl group having 13 to 25 carbon atoms.
摘要翻译：（A）由包含具有下述式（I）或（II）表示的酚羟基的结构的聚酰胺化合物的环氧树脂固化性组合物的层叠体（A）和（B）一层聚酰亚胺彼此。复合材料优选通过将环氧树脂固化组合物施加到聚酰亚胺膜或片材的至少一侧来获得。在式（I）中，环A和R各自表示碳原子数为6〜18的亚芳基，碳原子数为13〜25的亚烷基亚芳基等。式（II）中，环B为6〜18的亚芳基碳原子或碳原子数为13〜25的亚烷基二芳基。

60. 发明申请

US20100066150A1 Seatbelt retractor 审中-公开
标题翻译：安全带卷收器
公开(公告)号：US20100066150A1
公开(公告)日：2010-03-18
申请号：US12458144
申请日：2009-07-01
申请人： Takahiro Mori , Takaaki Kimura , Hideyuki Tonbe , Masato Takao
发明人： Takahiro Mori , Takaaki Kimura , Hideyuki Tonbe , Masato Takao
IPC分类号： B60R22/34 , B60R22/46
CPC分类号： B60R22/4628 , B60R22/46 , B60R2022/4642 , B60R2022/4666
摘要： A seat belt retractor is provided with a reduced size and reduced man-hours required for installation to a vehicle body. A motor for rotating a spool of winding a seat belt and an ECU for the motor are united to form a combined motor/ECU unit. The motor/ECU unit is supported on a frame just below the spool. In this case, the motor and ECU are accommodated in a unit casing of which a casing body is flatly supported on a unit stay. The unit stay is supported by the frame.
摘要翻译：安全带卷收器具有减小的尺寸并减少安装到车身所需的工时。用于旋转卷绕安全带的卷轴和用于马达的ECU的马达被联合以形成组合的马达/ ECU单元。马达/ ECU单元支撑在阀芯正下方的框架上。在这种情况下，电动机和ECU被容纳在单元壳体中，壳体主体被平坦地支撑在单元支架上。单位支持由框架支持。

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