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51. 发明申请

US20070289729A1 THERMALLY CONDUCTIVE COMPOSITE INTERFACE, COOLED ELECTRONIC ASSEMBLIES EMPLOYING THE SAME, AND METHODS OF FABRICATION THEREOF 有权
标题翻译：导热组合物接口，使用其的冷却电子组件及其制造方法
公开(公告)号：US20070289729A1
公开(公告)日：2007-12-20
申请号：US11424642
申请日：2006-06-16
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Keith E. Fogel , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Keith E. Fogel , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L2224/78301 , Y10T29/49128 , Y10T29/4935 , H01L2924/00014
摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.
摘要翻译：提供了复合界面和制造方法，用于将冷却组件连接到电子设备。界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。至少一些线部分地位于较高热通量的第一区域上，并部分地延伸在较低热通量的第二区域上，其中第一和第二区域是待冷却表面的不同区域。这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

52. 发明申请

US20070274045A1 Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Thereof Employing A Thermally Conductive Return Manifold Structure Sealed To The Periphery Of A Surface To Be Cooled 失效
标题翻译：冷却装置，冷却电子模块及其制造方法采用导热回流歧管结构密封到要冷却的表面周边
公开(公告)号：US20070274045A1
公开(公告)日：2007-11-29
申请号：US11420241
申请日：2006-05-25
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： F28C3/08 , F28F7/00 , H01L23/4735 , H01L2224/73253 , Y10S165/908
摘要： A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.
摘要翻译：使用冷却装置提供冷却的电子模块和制造方法，用于从设置在基板上的一个或多个电子装置移除热量。冷却装置包括供给歧管结构，其具有用于将冷却剂喷射到待冷却的表面上的多个入口孔和回流歧管结构。由导热材料制成的回流歧管结构具有使用导热的冷却剂密封密封在其周围的待冷却表面的基面。返回歧管结构提供至少一个返回通道，用于在撞击待冷却表面之后排出冷却剂，其中通过至少一个通道的冷却剂排出冷却回流歧管结构，从而有助于进一步冷却待冷却表面其中基面被密封到待冷却的表面。

53. 发明授权

US07301770B2 Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins 失效
标题翻译：冷却装置，冷却电子模块及其制造方法采用导热的引线引脚散热片
公开(公告)号：US07301770B2
公开(公告)日：2007-11-27
申请号：US11009935
申请日：2004-12-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , F28F3/022 , H01L23/433 , H01L23/473 , H01L2224/78301 , H01L2924/10253 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

54. 发明授权

US07286351B2 Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system 有权
标题翻译：用于使用闭环热交换系统的电子机架的冷却的装置和方法
公开(公告)号：US07286351B2
公开(公告)日：2007-10-23
申请号：US11124525
申请日：2005-05-06
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing a closed loop heat exchange system. The closed loop heat exchange system includes a first heat exchanger, a second heat exchanger, and a coolant distribution loop connecting the first heat exchanger and the second heat exchanger. When operational, the coolant distribution loop allows coolant to circulate between the first heat exchanger and the second heat exchanger. The closed loop heat exchange system couples to the electronics rack with the first heat exchanger disposed at an air inlet side of the electronics rack, and the first heat exchanger and the second heat exchanger disposed in different inlet-to-outlet air flow paths through the electronics rack to reduce an imbalance in air flow temperature of the different inlet-to-outlet air flow paths through the electronics rack.
摘要翻译：提供了设备和方法，以便于采用闭环热交换系统的电子机架的冷却。闭环热交换系统包括第一热交换器，第二热交换器和连接第一热交换器和第二热交换器的冷却剂分配回路。当操作时，冷却剂分配回路允许冷却剂在第一热交换器和第二热交换器之间循环。闭环热交换系统与设置在电子机架的空气入口侧的第一热交换器耦合到电子机架，并且第一热交换器和第二热交换器设置在不同的入口到出口的气流通道中电子机架，以减少通过电子机架的不同入口到出口气流路径的空气流温度不平衡。

55. 发明授权

US06821625B2 Thermal spreader using thermal conduits 失效
标题翻译：散热器使用热导管
公开(公告)号：US06821625B2
公开(公告)日：2004-11-23
申请号：US09965489
申请日：2001-09-27
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： H05K720
CPC分类号： H01L23/373 , H01L23/433 , H01L2224/16 , H01L2224/73253 , H01L2924/15312 , Y10T29/4935 , Y10T29/49368 , Y10T428/30 , Y10T442/2738
摘要： A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.
摘要翻译：在电子电路和散热器之间一次使用的散热装置包括具有平行的第一和第二表面的基板以及在表面之间延伸通过基板的导管。衬底材料在平行于面的方向上具有第一热导率值，并且在垂直于面的方向上具有第二热导率值，第二热导率值小于第一热导率值。导管材料具有与其相关联的热导率值，其热导率值大于衬底的第二热导率值。一种制造热扩散装置的方法包括：围绕棒径向地设置模制材料并硬化材料。其他方法包括压配合并将棒收缩配合到基底材料中。

56. 发明授权

US06820684B1 Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader 失效
标题翻译：冷却系统和采用部分液体填充散热器的冷却电子组件
公开(公告)号：US06820684B1
公开(公告)日：2004-11-23
申请号：US10606588
申请日：2003-06-26
申请人： Richard C. Chu , Micheal J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Micheal J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： F28D1500
CPC分类号： F28D15/02 , F28F3/022 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling system and method, and a cooled electronics assembly are provided employing a thermal spreader having an inner chamber evacuated and partially filled with a liquid. A phase separator is disposed within the thermal spreader to at least partially divide the inner chamber into a boiling section and a condensing section, while allowing vapor and liquid to circulate between the sections. A heat extraction assembly is disposed at least partially within the inner chamber to extract heat therefrom. When the thermal spreader is coupled to a heat generating component with the boiling section disposed adjacent thereto, liquid within the thermal spreader boils in the boiling section, producing vapor which flows upward from the boiling section and causes liquid to flow into the boiling section from the condensing section, thereby providing circulatory flow between the sections and facilitating removal of heat from the heat generating component.
摘要翻译：提供一种冷却系统和方法以及冷却电子组件，其采用具有抽空并部分填充有液体的内部腔室的散热器。相分离器设置在散热器内，以至少部分地将内室分成沸腾部分和冷凝部分，同时允许蒸气和液体在部分之间循环。热抽取组件至少部分地设置在内室内以从其中提取热量。当热撒布机与相邻设置的沸腾部分的发热部件联接时，散热器内的液体在沸腾部分中沸腾，产生从沸腾部分向上流动的蒸气，并使液体从沸腾部分流入沸腾部分从而在各部分之间提供循环流动，并且有助于从发热部件去除热量。

57. 发明授权

US06775137B2 Method and apparatus for combined air and liquid cooling of stacked electronics components 有权
标题翻译：层叠电子元件组合空气和液体冷却的方法和装置
公开(公告)号：US06775137B2
公开(公告)日：2004-08-10
申请号：US10303284
申请日：2002-11-25
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Edward Furey , Roger R. Schmidt , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Edward Furey , Roger R. Schmidt , Robert E. Simons
IPC分类号： G06F116
CPC分类号： H05K7/20754
摘要： An enclosure apparatus provides for combined air and liquid cooling of rack mounted stacked electronic components. A heat exchanger is mounted on the side of the stacked electronics and air flows side to side within the enclosure, impelled by air-moving devices mounted behind the electronics. Auxiliary air-moving devices may be mounted within the enclosure to increase the air flow. In an alternative embodiment, air-to-liquid heat exchangers are provided across the front and back of the enclosure, and a closed air flow loop is created by a converging supply plenum, electronics drawers through which air is directed by air-moving devices, diverging return plenum, and a connecting duct in the bottom. In a variant of this embodiment, connecting ducts are in both top and bottom, and supply and return ducts are doubly convergent and doubly divergent, respectively. Auxiliary blowers may be added to increase total system air flow. The enclosure also may be provided with automatically opening vent panels to allow room air to circulate and cool in the event of an over-temperature condition. The design of the enclosure permits it to be constructed apart from the rack-mounted apparatus and subsequently attached to the rack, if desired, at the facility at which the rack had been previously operating.
摘要翻译：机壳设备提供机架安装的堆叠式电子部件的组合的空气和液体冷却。热交换器安装在堆叠的电子设备的侧面上，空气在壳体内侧向流动，由安装在电子设备后面的气动装置推动。辅助气动装置可以安装在外壳内以增加气流。在替代实施例中，空气到液体的热交换器跨过外壳的前部和后部设置，并且封闭的空气流动回路由会聚的供气室，电子抽屉产生，空气通过空气移动装置引导，发散的回风室，底部有一个连接管。在该实施例的变型中，连接管道位于顶部和底部，并且供应和返回管道分别是双收敛和双重发散的。可以添加辅助鼓风机以增加总系统空气流量。外壳还可以设置有自动打开的通气面板，以允许室内空气在过温情况下循环和冷却。外壳的设计允许其与机架安装的设备分开构造，并且如果需要，则在机架先前已经操作的设施处随后附接到机架上。

58. 发明授权

US06767766B2 Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication 失效
标题翻译：具有集成可编程热电冷却组件的电子模块及其制造方法
公开(公告)号：US06767766B2
公开(公告)日：2004-07-27
申请号：US10368192
申请日：2003-02-18
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： H01L2144
CPC分类号： H01L23/38 , H01L23/34 , H01L2224/16225 , H01L2224/48091 , H01L2224/73253 , H01L2924/00014 , H01L2924/16152 , H01L2224/0401
摘要： An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to couple to an electronic device within the module for removing heat generated thereby, and a programmable power control circuit integrated with the thermoelectric assembly. The programmable power control circuit allows cooling capacity of the thermoelectric assembly to be tailored to anticipated heat dissipation of the electronic device by adjusting, for a given power source, voltage level to the thermoelectric elements of the thermoelectric assembly. Power to the thermoelectric assembly can be provided through conductive power planes disposed within a supporting substrate. The power control circuit includes one or more voltage boost circuits connected in series between the given power source and the thermoelectric elements of the associated thermoelectric assembly.
摘要翻译：使用集成散热组件提供电子模块和制造方法。散热组件包括热电组件，其被配置为耦合到模块内的电子设备，用于去除由此产生的热量，以及与热电组件集成的可编程功率控制电路。可编程功率控制电路允许热电组件的冷却能力通过针对给定的电源调节到热电组件的热电元件的电压水平而被调整为预期的电子设备的散热。可以通过设置在支撑衬底内的导电电力平面来提供对热电组件的功率。功率控制电路包括串联在给定电源和相关热电组件的热电元件之间的一个或多个升压电路。

59. 发明授权

US06519151B2 Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof 失效
标题翻译：用于冷却电子模块的锥形板和喷嘴组件及其制造方法
公开(公告)号：US06519151B2
公开(公告)日：2003-02-11
申请号：US09893212
申请日：2001-06-27
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： H05K720
CPC分类号： H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.
摘要翻译：提供冲击板和喷嘴组件用于冷却电子模块。组件包括具有第一主表面和第二主表面的导热板，第二主表面具有形成在朝向第一主表面延伸的第二主表面中的多个凹表面部分。每个凹面部分具有圆锥截面轮廓。多个喷嘴设置在导热板的上方，每个喷嘴在相应的凹面部分上对齐，其中通过其喷嘴入射到凹面部分的流体，其喷嘴撞击其下部，并沿着凹面部分。每个圆锥截面轮廓是椭圆形截面，圆形截面或抛物线截面之一。

60. 发明授权

US06396700B1 Thermal spreader and interface assembly for heat generating component of an electronic device 失效
标题翻译：散热器和电子设备的发热部件的接口组件
公开(公告)号：US06396700B1
公开(公告)日：2002-05-28
申请号：US09606619
申请日：2000-06-29
申请人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
发明人： Richard C. Chu , Michael J. Ellsworth, Jr. , Robert E. Simons
IPC分类号： H05M720
CPC分类号： H01L23/367 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across a surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The assembly further includes a thermal interface for attaching to the surface of the thermal spreader and aligning to contact a portion of the surface of the heat generating component when the thermal dissipation assembly is placed in contact therewith. The thermal interface is patterned to cover only a portion of the surface of the heat generating component to selectively thermally couple the thermal spreader to the surface of the heat generating component.
摘要翻译：为电子设备提供散热组件。组件包括配置成热耦合到电子设备的发热部件的表面的散热器。发热组件，例如集成电路芯片，在表面的至少一个第一区域和表面的至少一个第二区域之间，在其表面上具有不均匀的热分布，其中至少一个第一区域具有比所述至少一个第二区域更高的热通量。组件还包括热接口，用于附接到散热器的表面，并且当散热组件与其接触时，对准以接触发热部件的表面的一部分。热界面被图案化以仅覆盖发热部件的表面的一部分，以选择性地将散热器热耦合到发热部件的表面。

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