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    • 51. 发明授权
    • Semiconductor optoelectronic device
    • 半导体光电器件
    • US07058105B2
    • 2006-06-06
    • US10624687
    • 2003-07-23
    • Sung-nam LeeKyoung-ho HaTan Sakong
    • Sung-nam LeeKyoung-ho HaTan Sakong
    • H01S5/00
    • H01S5/20B82Y20/00H01L33/02H01L33/06H01L33/32H01S5/2009H01S5/3211H01S5/34333
    • A highly efficient semiconductor optoelectronic device is provided. The semiconductor optoelectronic device includes an active layer, an upper waveguide layer provided on the active layer and a lower waveguide layer provided under the active layer, an upper cladding layer provided on the upper waveguide layer and a lower cladding layer provided under the lower waveguide layer, a substrate supporting a deposited structure of the lower cladding layer, the lower waveguide layer, the active layer, the upper waveguide layer, and the upper cladding layer, and upper and lower optical confinement layers provided between the active layer and the upper waveguide layer and between the active layer and the lower waveguide layer, respectively, and having an energy gap that is smaller than those of the upper and lower waveguide layers but greater than that of the active layer.
    • 提供了一种高效的半导体光电子器件。 半导体光电子器件包括有源层,设置在有源层上的上波导层和设置在有源层下的下波导层,设置在上波导层上的上包层和设置在下波导层下的下包层 ,支撑下包层,下波导层,有源层,上波导层和上包层的沉积结构的基板,以及设置在有源层和上波导层之间的上和下光限制层 并且分别在有源层和下波导层之间并且具有小于上波导层和下波导层的能隙的能隙,但是大于有源层的能隙。
    • 60. 发明授权
    • Semiconductor laser diode having wafer-bonded structure and method of fabricating the same
    • 具有晶片结合结构的半导体激光二极管及其制造方法
    • US07773649B2
    • 2010-08-10
    • US11878347
    • 2007-07-24
    • Kyu-sang KimKyoung-ho Ha
    • Kyu-sang KimKyoung-ho Ha
    • H01S5/00
    • H01S5/34333B82Y20/00H01S5/0215H01S5/0217H01S5/22H01S5/3063H01S2301/173H01S2304/12
    • Example embodiments are directed to a semiconductor laser diode and a method of fabricating the same. The semiconductor laser diode may include a first semiconductor layer formed over a first substrate and capable of emitting light, and a second semiconductor layer capable of guiding the emitted light, wherein the first and second semiconductor layers are bonded to each other. The method of fabricating the semiconductor laser diode may include forming over a first substrate a first semiconductor layer capable of emitting light, forming over a second substrate a second semiconductor layer capable of guiding the light, bonding the first semiconductor layer to the second semiconductor layer, and removing the second substrate. The second semiconductor layer may be grown separately under conditions different from those for forming the first semiconductor layer, and may be subsequently bonded to the first semiconductor layer.
    • 示例性实施例涉及半导体激光二极管及其制造方法。 半导体激光二极管可以包括形成在第一基板上并且能够发光的第一半导体层,以及能够引导发射的光的第二半导体层,其中第一和第二半导体层彼此接合。 制造半导体激光二极管的方法可以包括在第一衬底上形成能够发光的第一半导体层,在第二衬底上形成能够引导光的第二半导体层,将第一半导体层接合到第二半导体层, 并移除第二基板。 第二半导体层可以在与用于形成第一半导体层的条件不同的条件下单独生长,并且可以随后结合到第一半导体层。