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51. 发明申请

US20060038485A1 Laminated light-emitting diode display device and manufacturing method thereof 审中-公开
公开(公告)号：US20060038485A1
公开(公告)日：2006-02-23
申请号：US10920306
申请日：2004-08-18
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chao-Yuan Huang
IPC分类号： H05B33/08 , H05B33/00
CPC分类号： G09F9/302 , G09F9/33 , H05K1/0306 , H05K1/0393 , H05K1/181 , H05K2201/0108 , H05K2201/10106 , Y02P70/611
摘要： A laminated light-emitting diode display device and a manufacturing method thereof are described. The laminated light-emitting diode display device has an insulator, a circuitry device placed on the insulator and having of a plurality of circuits interconnected with each other, and a plurality of SMT-type light-emitting diodes electrically connected to the circuits of the circuitry unit.

52. 外观设计

USD511328S1 Light-emitting diode 失效
公开(公告)号：USD511328S1
公开(公告)日：2005-11-08
申请号：US29207971
申请日：2004-06-23
申请人： Bily Wang , Jonnie Chuang , Huang Hui Yen
设计人： Bily Wang , Jonnie Chuang , Huang Hui Yen

53. 发明申请

US20050236958A1 White light-emitting device 审中-公开
标题翻译：白色发光装置
公开(公告)号：US20050236958A1
公开(公告)日：2005-10-27
申请号：US10830009
申请日：2004-04-23
申请人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
发明人： Bily Wang , Jonnie Chuang , Chuanfa Lin , Chih Yu
IPC分类号： C09K11/77 , H01L33/50 , H05B33/00
CPC分类号： C09K11/7734 , C09K11/7731 , H01L33/502 , H01L33/504 , Y02B20/181
摘要： A white light source has a substrate with a blue light-emitting diode placed thereon and a phosphor mixture coated on the blue light-emitting diode and made of a red phosphor, a green phosphor and a yellow phosphor. The red phosphor can be CaS:Eu or SrS:Eu; the green phosphor can be SrGa2S4:Eu or Ca8EuMnMg(SiO4)4C12; and the yellow phosphor can be YAG:Ce or ThAG:Ce. The red phosphor, the green phosphor and the yellow phosphor emit, respectively, red light, green light and yellow light after receiving blue light from the blue light-emitting diode to mix a white light with a good color-rendering property.
摘要翻译：白色光源具有放置在其上的蓝色发光二极管的基板和涂布在蓝色发光二极管上并由红色荧光体，绿色荧光体和黄色荧光体构成的荧光体混合物。红色荧光体可以是CaS：Eu或SrS：Eu; 绿色荧光体可以是SrGa 2 S 4：Eu或Ca 8 O 5 MnMg（SiO 4） 4 12 黄色荧光体可以是YAG：Ce或ThAG：Ce。在从蓝色发光二极管接收蓝光后，红色荧光体，绿色荧光体和黄色荧光体分别发出红色光，绿色光和黄色光，以混合具有良好显色性能的白色光。

54. 外观设计

USD509809S1 Metal base design for surface mount device LED 失效
标题翻译：金属基座设计用于表面贴装LED
公开(公告)号：USD509809S1
公开(公告)日：2005-09-20
申请号：US29210937
申请日：2004-08-10
申请人： Bily Wang , Jonnie Chuang , Hui Yen Huang
设计人： Bily Wang , Jonnie Chuang , Hui Yen Huang

55. 发明申请

US20050169006A1 Led chip lamp apparatus 审中-公开
标题翻译： LED芯片灯装置
公开(公告)号：US20050169006A1
公开(公告)日：2005-08-04
申请号：US10766827
申请日：2004-01-30
申请人： Bily Wang , Jonnie Chuang , Ching Ko
发明人： Bily Wang , Jonnie Chuang , Ching Ko
IPC分类号： F21S2/00 , F21K99/00 , F21V7/04
CPC分类号： F21V29/74 , F21K9/00 , F21V29/505 , F21V29/83 , F21Y2107/40 , F21Y2115/10
摘要： An LED chap lamp apparatus has a heat sink with a reflector, an LED lamp module and a heat pipe. The LED lamp module is assembled on an inside of the reflector for reflecting light of the LED lamp module. The two ends of the heat pipe each connect to the LED lamp module and the heat sink to conduct and disperse the heat produced form the LED chips to increase the lifetime and the light-emitting efficiency of the LED chap lamp apparatus.
摘要翻译： LED灯具具有具有反射器的散热器，LED灯模块和热管。 LED灯模块组装在反射器的内侧，用于反射LED灯模块的光。热管的两端分别连接到LED灯模块和散热器，以对从LED芯片产生的热量进行分散，从而提高LED灯具的使用寿命和发光效率。

56. 外观设计

USD506187S1 Metal base design for surface mount device LED (light emitting diode) 有权
标题翻译：表面贴装元件LED（发光二极管）金属基座设计
公开(公告)号：USD506187S1
公开(公告)日：2005-06-14
申请号：US29214779
申请日：2004-10-12
申请人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang
设计人： Bily Wang , Jonnie Chuang , Heng-Yen Lee , Hui-Yen Huang

57. 发明申请

US20050083275A1 Circuit board for large screen LED matrix array display 有权
标题翻译：电路板用于大屏幕LED矩阵阵列显示
公开(公告)号：US20050083275A1
公开(公告)日：2005-04-21
申请号：US10685892
申请日：2003-10-16
申请人： Bily Wang , Jonnie Chuang , John Lin
发明人： Bily Wang , Jonnie Chuang , John Lin
IPC分类号： G09F9/33 , G09G3/32 , G09G5/00
CPC分类号： G09F9/33 , G09F9/3026 , Y10S248/917 , Y10S345/905
摘要： Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is inserted in one jaw of the clamp to tighten the pressure between butting edges of the circuit boards. Another set screw is inserted on top of the clamp to align the adjacent boards vertically.
摘要翻译：将多个LED矩阵阵列电路板拼接成一个显示面板。 L形支架安装在电路板的底部，并与电路板的对接边缘对齐。垂直对接墙通过夹具压在一起。一个固定螺丝插入夹具的一个夹爪中，以紧固电路板对接边缘之间的压力。另一个固定螺钉插入夹具的顶部，以使相邻的板垂直对齐。

58. 发明申请

US20120094407A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于增加发光效率和散热效果的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20120094407A1
公开(公告)日：2012-04-19
申请号：US13328083
申请日：2011-12-16
申请人： BILY WANG , JONNIE CHUANG , CHUAN-FA LIN , CHI-WEN HUNG
发明人： BILY WANG , JONNIE CHUANG , CHUAN-FA LIN , CHI-WEN HUNG
IPC分类号： H01L33/62
CPC分类号： H01L23/544 , H01L23/60 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/48 , H01L25/167 , H01L27/0248 , H01L33/46 , H01L33/62 , H01L2223/54493 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/16 , H01L2224/16145 , H01L2224/48091 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2224/45111 , H01L2224/131 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，反射单元，第一导电单元和第二导电单元。发光单元具有基板主体，设置在基板主体上的发光体，形成在发光体上的正极和负极导电层，以及形成在发光体中的发光区域。反射单元具有形成在正导电层和负导电层之间的反射层和用于覆盖发光体的外侧的基板主体。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电结构和形成在第一负导电层上的第二负导电结构。

59. 发明申请

US20120009700A1 METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE 审中-公开
标题翻译：制造LED芯片包装结构的方法
公开(公告)号：US20120009700A1
公开(公告)日：2012-01-12
申请号：US13238394
申请日：2011-09-21
申请人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
发明人： BILY WANG , JONNIE CHUANG , WEN-KUEI WU
IPC分类号： H01L33/64
CPC分类号： F21K9/00 , F21Y2115/10 , G02B6/0073 , H01L25/0753 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： A method of manufacturing a LED chip package structure includes the steps of: providing a substrate unit including a strip substrate body; electrically connecting a plurality of LED chips to the strip substrate body; and placing a strip package colloid body on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.
摘要翻译：一种制造LED芯片封装结构的方法包括以下步骤：提供包括带状基板主体的基板单元; 将多个LED芯片电连接到带状基板主体; 并将带状包装胶体体放置在带状基材主体上以覆盖LED芯片，其中带状包装胶体具有暴露的顶表面和连接在暴露的顶表面和带状基片主体之间的暴露的外围表面，包装胶体具有至少一个暴露的透镜部分，其从暴露的顶表面向上突出并对应于LED芯片。因此，由LED芯片产生的光束通过条带封装胶体，在带状封装胶体上形成带状发光区域。

60. 发明申请

US20110300649A1 PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：一种发光二极管的封装及其制造方法
公开(公告)号：US20110300649A1
公开(公告)日：2011-12-08
申请号：US13214337
申请日：2011-08-22
申请人： BILY WANG , JONNIE CHUANG , HUI-YEN HUANG
发明人： BILY WANG , JONNIE CHUANG , HUI-YEN HUANG
IPC分类号： H01L33/52
CPC分类号： H01L33/486 , H01L33/56 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal.
摘要翻译：一种制造LED的方法包括：提供金属基板; 蚀刻金属基板以形成第一端子，第二端子和第一端子和第二端子之间的间隙，其中第一端子具有至少一个第一蚀刻凹部，并且第二端子具有至少一个第二蚀刻凹部; 将至少一个LED芯片放置在所述至少一个第一蚀刻凹部中，其中所述至少一个LED芯片具有第一电极和第二电极; 将第一电极与第一端子电连接，并将第二电极与第二端子电连接; 然后用合成聚合物覆盖所述至少一个LED芯片，其中所述合成聚合物填充到所述至少一个第一蚀刻凹部中，所述至少一个第二蚀刻凹部和所述间隙将所述第一端子与所述第二端子连接。

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