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51. 发明申请

US20220243357A1 PRODUCTION APPARATUS FOR GALLIUM OXIDE CRYSTAL AND PRODUCTION METHOD FOR GALLIUM OXIDE CRYSTAL 有权
公开(公告)号：US20220243357A1
公开(公告)日：2022-08-04
申请号：US17533377
申请日：2021-11-23
申请人： Fujikoshi Machinery Corp. , SHINSHU UNIVERSITY
发明人： Keigo HOSHIKAWA , Toshinori TAISHI , Takumi KOBAYASHI , Yoshio OTSUKA
IPC分类号： C30B11/00 , C30B29/16
摘要： There is provided a production apparatus for a gallium oxide crystal using the vertical Bridgman method and a production method using the production apparatus. A production apparatus for a gallium oxide crystal using a vertical Bridgman method including: a furnace body formed of a heat resistant material; a crucible shaft freely movable vertically, being extended in the furnace body, and penetrating through a bottom portion of the furnace body in the vertical direction; a crucible for housing a material of a gallium oxide crystal, being disposed on the crucible shaft; a body heater for heating the crucible, being disposed around a periphery of the crucible; and an annealing chamber for annealing the crucible, being disposed under the furnace body, and being connected to a furnace space in the furnace body.

52. 发明申请

US20220196390A1 NON-CONTACT-TYPE APPARATUS FOR MEASURING WAFER THICKNESS 有权
公开(公告)号：US20220196390A1
公开(公告)日：2022-06-23
申请号：US17604553
申请日：2020-04-09
申请人： Fujikoshi Machinery Corp.
发明人： Chihiro MIYAGAWA , Kazutaka SHIBUYA , Kiyohito AOKI
IPC分类号： G01B11/06 , H01L21/304 , G01N21/95 , H01L21/66
摘要： A non-contact-type apparatus for measuring wafer thickness includes a monolithic-type wavelength sweeping semiconductor laser light source having a laser source, a laser control unit that controls the laser source, and a processor to control the laser source to oscillate laser light having a wavelength that changes with a setting profile relative to time; an optical system that guides and emits the laser light onto a wafer; a detection unit that detects an interference light signal of reflected light; an A/D converter that converts the interference light signal detected by the detection unit into a digital signal; and a calculation unit that calculates a thickness of the wafer by analyzing the digital signal from the A/D converter. The processor causes the laser control unit to operate with a clock signal, and to oscillate laser light that performs wavelength-sweeping with the setting profile relative to the time, from the laser source. The A/D converts the interference light signal by generating a sampling clock in synchronization with the clock signal or directly using the clock signal as a sampling clock.

53. 发明申请

US20210269941A1 GALLIUM OXIDE CRYSTAL MANUFACTURING DEVICE 有权
公开(公告)号：US20210269941A1
公开(公告)日：2021-09-02
申请号：US17183753
申请日：2021-02-24
申请人： Fujikoshi Machinery Corp. , SHINSHU UNIVERSITY , Novel Crystal Technology, Inc.
发明人： Keigo HOSHIKAWA , Takumi KOBAYASHI , Yoshio OTSUKA , Toshinori TAISHI
IPC分类号： C30B35/00 , C30B11/00
摘要： A gallium oxide crystal manufacturing device includes a crucible to hold a gallium oxide source material therein, a crucible support that supports the crucible from below, a crucible support shaft that is connected to the crucible support from below and vertically movably supports the crucible and the crucible support, a tubular furnace core tube that surrounds the crucible, the crucible support and the crucible support shaft, a tubular furnace inner tube that surrounds the furnace core tube, and a resistive heating element including a heat-generating portion placed in a space between the furnace core tube and the furnace inner tube. Melting points of the furnace core tube and the furnace inner tube are not less than 1900° C. A thermal conductivity of a portion of the furnace core tube located directly next to the crucible in a radial direction thereof is higher than a thermal conductivity of the furnace inner tube.

54. 发明授权

US10414017B2 Polishing apparatus 有权
公开(公告)号：US10414017B2
公开(公告)日：2019-09-17
申请号：US15512939
申请日：2015-09-24
申请人： SHIN-ETSU HANDOTAI CO., LTD. , FUJIKOSHI MACHINERY CORP.
发明人： Junichi Ueno , Michito Sato , Kaoru Ishii , Hiromi Kishida , Yosuke Kanai , Yuya Nakanishi
IPC分类号： B24B37/005 , B24B49/12 , B24B37/34 , H01L21/304 , B24B37/10
摘要： A polishing apparatus includes: a plurality of polishing heads for holding a wafer, a polishing pad for polishing the wafer, a rotatable turn table having the polishing pad attached thereto, a turn table driving mechanism for rotating the turn table, a plurality of wafer-detecting sensors for detecting coming off of the wafer from the polishing head during polishing, wherein the polishing apparatus has the wafer-detecting sensor disposed above peripheral portions of the respective polishing heads and on each downstream side in a rotation direction of the turn table with respect to the respective polishing heads. The polishing apparatus can detect coming off of a wafer from a polishing head during polishing more rapidly, and can prevent a breakage of the wafer thereby.

55. 发明授权

US10280530B2 Apparatus for producing a single crystal of a metal oxide comprising a Pt-Rh alloy heater coated with zirconia 有权
公开(公告)号：US10280530B2
公开(公告)日：2019-05-07
申请号：US15866952
申请日：2018-01-10
申请人： FUJIKOSHI MACHINERY CORP. , SHINSHU UNIVERSITY
发明人： Keigo Hoshikawa , Yasuyuki Fujiwara , Keiichi Kohama , Shinji Nakanishi , Takumi Kobayashi , Etsuko Ohba
IPC分类号： C30B11/00 , C22C5/04 , C30B29/30 , C30B29/16
摘要： To provide a single crystal production apparatus that is capable of prolonging the lifetime of a heater, and capable of reducing the cost. A single crystal production apparatus of the present invention is the single crystal production apparatus which produces a single crystal of a metal oxide in an oxidative atmosphere, containing: a base body; a cylindrical furnace body having heat resistance disposed above the base body; a lid member occluding the furnace body; a heater disposed inside the furnace body; a high frequency coil heating the heater through high frequency induction heating; and a crucible heated with the heater, the heater containing a Pt-based alloy and having a zirconia coating on an overall surface of the heater.

56. 发明申请

US20180222008A1 POLISHING APPARATUS 审中-公开
公开(公告)号：US20180222008A1
公开(公告)日：2018-08-09
申请号：US15750329
申请日：2016-08-03
申请人： SHIN-ETSU HANDOTAI CO., LTD. , FUJIKOSHI MACHINERY CORP.
发明人： Michito SATO , Junichi UENO , Kaoru ISHII , Yosuke KANAI , Yuya NAKANISHI
IPC分类号： B24B37/10 , B24B57/02
CPC分类号： B24B37/107 , B24B37/00 , B24B37/12 , B24B57/02 , H01L21/304 , Y02P70/177
摘要： The present invention provides a polishing apparatus including: a turntable which has a polishing pad attached thereto; a polishing head configured to hold a wafer; a tank configured to store a polishing agent; a polishing agent supply mechanism which supplies the polishing agent stored in the tank to the polishing pad; a waste liquid receiver which collects the polishing agent flowing down from an upper side of the turntable; and a circulation mechanism which is connected to the waste liquid receiver and supplies the polishing agent collected by the waste liquid receiver to the tank, the polishing agent is supplied to the polishing pad from the tank by the polishing agent supply mechanism, the used polishing agent which flows down from the upper side of the turntable is collected by the waste liquid receiver, a surface of the wafer held by the polishing head is rubbed against the polishing pad so that it is polished while supplying the collected polishing agent to the tank to circulate the polishing agent, and the polishing apparatus is characterized in that the waste liquid receiver is fixed to the turntable. Consequently, it is possible to provide the polishing agent which can suppress mixture with other solutions at the time of collecting the polishing agent to be reused, can suppress degradation of collection efficiency of the polishing agent, and can be easily maintained.

57. 发明申请

US20020153477A1 Work piece feeding machine and abrasive system 失效
标题翻译：工件给料机和研磨系统
公开(公告)号：US20020153477A1
公开(公告)日：2002-10-24
申请号：US10128753
申请日：2002-04-23
申请人： Fujikoshi Machinery Corp.
发明人： Tsuyoshi Hasegawa , Yasuhide Denda
IPC分类号： G02F001/01
CPC分类号： B24B37/345 , H01L21/681
摘要： The work piece feeding machine is capable of correctly and efficiently setting a work piece in a through-hole of a carrier. The work piece feeding machine comprises a positioning unit detecting amount of displacement of the work piece with respect to the through-hole and correcting the position of the work piece in the through-hole. The positioning unit includes: a lighting source section provided on the work piece side or the carrier side, the lighting source section throwing polarized light on the work piece and the carrier; a camera provided on the carrier side or the work piece side, the camera receiving the polarized light from the lighting source section so as to catch images of an outer edge of the work piece and an inner edge of the through-hole in a visual field thereof; and an image processing section measuring the amount of displacement on the basis of positions of the outer edge and the inner edge.
摘要翻译：工件给料机能够正确有效地将工件设置在载体的通孔中。工件给料机包括定位单元检测工件相对于通孔的位移量，并校正工件在通孔中的位置。定位单元包括：设置在工件侧或承载侧的照明源部分，照明源部分在工件和载体上投射偏振光; 设置在载体侧或工件侧的照相机，所述照相机接收来自所述照明源部的偏振光，以便在视场中捕获所述工件的外边缘和所述通孔的内边缘的图像的; 以及图像处理部，其基于所述外缘和所述内缘的位置来测量位移量。

58. 发明申请

US20020119735A1 Wafer abrasive machine 有权
标题翻译：晶圆磨机
公开(公告)号：US20020119735A1
公开(公告)日：2002-08-29
申请号：US10081493
申请日：2002-02-22
申请人： Fujikoshi Machinery Corp.
发明人： Yoshio Nakamura , Tsuyoshi Hasegawa , Susumu Onishi
IPC分类号： B24B001/00 , B24B005/00
CPC分类号： B24B37/30
摘要： In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head member including a concave section, in which the holding plate is accommodated; an elastic sheet member suspending the holding plate and being reinforced by a cloth-formed reinforcing member; a space for storing pressure fluid which pushes the holding plate toward the abrasive plate, the space being formed between the elastic sheet member and the concave section; and a plurality of spherical bodies being provided between an outer circumferential face of the holding plate and an inner circumferential face of the concave section, the spherical bodies simultaneously point-contact the both circumferential faces.
摘要翻译：在本发明的晶片研磨机中，在研磨晶片的同时可以使晶片的重心和旋转轴对应，并且保持板能够平滑地移动到头部构件中。所述研磨机包括：所述头部构件包括凹部，所述保持板容纳在所述凹部中; 弹性片构件，其将所述保持板悬挂并由布形加强构件加强; 用于存储将所述保持板向研磨板推动的压力流体的空间，所述空间形成在所述弹性片构件和所述凹部之间; 并且在所述保持板的外周面与所述凹部的内周面之间设置有多个球状体，所述球状体同时与所述两个圆周面进行点接触。

59. 发明申请

US20020058465A1 Method of abrading both faces of work piece 失效
标题翻译：研磨工件两面的方法
公开(公告)号：US20020058465A1
公开(公告)日：2002-05-16
申请号：US10037742
申请日：2001-11-09
申请人： Fujikoshi Machinery Corp.
发明人： Tadakazu Miyashita , Tsuyoshi Hasegawa , Atsushi Kajikura , Norihiko Moriya
IPC分类号： B24B007/22
CPC分类号： B24B37/08 , B24B37/042 , B24B49/16 , B24B51/00
摘要： The method of the present invention is capable of abrading a work piece with fixed load. The method comprises: a first abrading process, in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted so as to apply first pressure to the work piece via the upper abrasive plate without applying full weight of the upper abrasive plate; and a second abrading process, in which the pressure of the cylinder chamber is readjusted so as to apply second pressure, which is higher than the first pressure, to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.
摘要翻译：本发明的方法能够以固定的载荷研磨工件。该方法包括：第一研磨过程，其中调节悬挂上磨料板的气缸单元的气缸室的压力，以便经由上磨料板向工件施加第一压力，而不用全部重量的上磨料盘子; 以及第二研磨过程，其中重新调节气缸室的压力，以便将高于第一压力的第二压力经由上磨料板施加到工件，而不施加上磨料板的全部重量。

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