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51. 发明申请

US20010015167A1 Method and apparatus for doping a melt with a dopant 有权
标题翻译：用掺杂剂掺杂熔体的方法和装置
公开(公告)号：US20010015167A1
公开(公告)日：2001-08-23
申请号：US09782999
申请日：2001-02-14
申请人： WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AG
发明人： Martin Weber , Erich Gmeilbauer , Robert Vorbuchner , Walter Neumaier , Peter Vilzmann
IPC分类号： C30B001/00
CPC分类号： C30B15/04 , Y10T117/10 , Y10T117/1032 , Y10T117/1056
摘要： A method for doping a melt with a dopant has the melt being provided in a crucible. The dopant is introduced into a vessel and the vessel is immersed in the melt, the dopant being transferred into the melt through an opening which forms in the vessel. There is also an apparatus which comprises a vessel containing the dopant and a device which is connected to the vessel, for lowering the vessel into a melt and for lifting the vessel out of the melt, the vessel being provided with an opening which is blocked by a closure piece which is of the same type of material as the melt and melts when it is brought into contact with the melt.
摘要翻译：用掺杂剂掺杂熔体的方法将熔体设置在坩埚中。将掺杂剂引入容器中并将容器浸入熔体中，通过在容器中形成的开口将掺杂剂转移到熔体中。还有一种设备，其包括容纳掺杂剂的容器和连接到容器的装置，用于将容器降低成熔体并将容器从熔体中提出，容器设有一个开口，该开口被与熔体相同类型的封闭件，当与熔体接触时熔化。

52. 发明授权

US6095898A Process and device for polishing semiconductor wafers 有权
标题翻译：用于抛光半导体晶片的工艺和器件
公开(公告)号：US6095898A
公开(公告)日：2000-08-01
申请号：US181428
申请日：1998-10-28
申请人： Heinrich Hennhofer , Hans Kramer , Helmut Kirschner , Manfred Thurner , Thomas Buschhardt , Klaus Rottger
发明人： Heinrich Hennhofer , Hans Kramer , Helmut Kirschner , Manfred Thurner , Thomas Buschhardt , Klaus Rottger
IPC分类号： B24B37/04 , B24B49/14 , H01L21/304 , B24B1/00
CPC分类号： B24B37/12 , B24B37/015 , B24B37/042
摘要： A process and device for polishing semiconductor wafers has at least one side of at least one semiconductor wafer pressed against a polishing plate, over which a polishing cloth is stretched. The semiconductor wafer and the polishing plate are moved relative to each other to polish the wafer. During the polishing, the semiconductor wafer passes over at least two regions on the polishing plate, which regions have defined radial widths and are at different temperatures. Temperature-control means are provided in the polishing plate, with the aid of which the number, the radial widths and the temperatures of the regions are fixed before the semiconductor wafers are polished.
摘要翻译：用于抛光半导体晶片的工艺和装置具有至少一个半导体晶片的至少一侧，该至少一个半导体晶片压在抛光板上，抛光布被拉伸。半导体晶片和抛光板相对于彼此移动以抛光晶片。在抛光期间，半导体晶片通过抛光板上的至少两个区域，这些区域具有限定的径向宽度并处于不同的温度。温度控制装置设置在抛光板中，借助于此，在半导体晶片被抛光之前，区域的数量，径向宽度和温度被固定。

53. 发明授权

US6073878A Method and device for unwinding or winding up a sawing wire 失效
标题翻译：用于松开或卷绕锯线的方法和装置
公开(公告)号：US6073878A
公开(公告)日：2000-06-13
申请号：US86852
申请日：1998-05-29
申请人： Karl Egglhuber
发明人： Karl Egglhuber
IPC分类号： B24B27/06 , B23D57/00 , B28D5/04 , B65H54/28 , B65H59/38 , B65H75/38 , B65H27/00 , B65H57/00 , B65H75/18
CPC分类号： B23D57/0053 , B65H54/2803 , B65H59/384
摘要： A device and method for unwinding or winding a sawing wire from a reel or to a reel which rotates. The sawing wire runs from the reel or toward the reel over a pulley and in so doing, assumes a defined axial position on the reel. In the method, the reel is moved along its rotational shaft while the sawing wire is unwound or wound up. The sawing wire however remains aligned perpendicular to the rotational shaft of the reel in the region between the reel and the pulley. There is a pivot arm which is moved concomitantly by a carriage system. The pivot arm has an end piece connected to one of the clamping elements. Thus it is possible to move the pivot arm from a reel-holding position into a reel-release position.
摘要翻译：一种用于将卷线器从卷轴或卷轴上展开或卷绕的装置和方法，所述卷轴旋转。锯线从卷轴或者卷轴穿过滑轮，并且在这样做时，呈现在卷轴上的限定的轴向位置。在该方法中，当绕线被展开或卷绕时，卷轴沿其旋转轴移动。然而锯线在卷轴和滑轮之间的区域中保持垂直于卷轴的旋转轴对齐。有一个枢轴臂，由支架系统同时移动。枢转臂具有连接到一个夹紧元件的端件。因此，可以将枢转臂从卷轴保持位置移动到卷轴释放位置。

54. 发明授权

US6055842A Method for calibrating rotating tools 失效
标题翻译：校准旋转刀具的方法
公开(公告)号：US6055842A
公开(公告)日：2000-05-02
申请号：US122462
申请日：1998-07-24
申请人： Karl Kobler , Hanifi Malcok , Hermann Zwirglmaier
发明人： Karl Kobler , Hanifi Malcok , Hermann Zwirglmaier
IPC分类号： B23Q17/10 , G05B19/401 , G05B19/404 , H04N7/18
CPC分类号： G05B19/404 , G05B19/401
摘要： A method for monitoring the calibration of and calibrating rotating tools ich are liable to deviate, wherein at least one known deviation is recorded at a first predetermined rotational speed. The method can be used with annular saws that divide workpieces into semiconductor wafers.
摘要翻译：一种用于监测易于偏离的旋转工具的校准和校准的方法，其中以第一预定旋转速度记录至少一个已知偏差。该方法可用于将工件分成半导体晶片的环形锯。

55. 发明授权

US6050254A Wire saw, repair station, maintenance and testing station for a wire-guiding-roller unit of the wire saw, and method of exchanging the wire-guiding-roller unit 失效
标题翻译：线锯的导丝辊单元的线锯，维修站，维护检测站以及更换导丝辊单元的方法
公开(公告)号：US6050254A
公开(公告)日：2000-04-18
申请号：US56831
申请日：1998-04-07
申请人： Karl Egglhuber
发明人： Karl Egglhuber
IPC分类号： B24B27/06 , B23D57/00 , B28D1/08
CPC分类号： B23D57/0053
摘要： A wire saw for cutting wafers from a workpiece, has a cutting head in which at least two adjacent wire-guiding rollers are mounted rotatably in each case between a moveable bearing and a fixed bearing. These are adjacent wire-guiding rollers, together with a wire wound around them, form a wire web. Each wire-guiding roller and the moveable bearing and fixed bearing assigned to it form a wire-guiding-roller unit, which can only be removed from the cutting head as an entire unit. There is also a repair station and a maintenance and testing station for the wire-guiding-roller unit and a method of exchanging the wire-guiding-roller unit.
摘要翻译：用于从工件切割晶片的线锯具有切割头，其中至少两个相邻的导丝辊可旋转地安装在可移动的轴承和固定的轴承之间。这些是相邻的导丝辊，以及围绕它们缠绕的丝线，形成丝网。每个导线辊和分配给它的可移动轴承和固定轴承形成一个导丝辊单元，其仅能作为整个单元从切割头移除。还有用于导丝辊单元的修理站和维护和测试站以及更换导丝辊单元的方法。

56. 发明授权

US6045436A Process for the material-abrading machining of the edge of a semiconductor wafer 失效
标题翻译：用于半导体晶片的边缘的材料研磨加工的工艺
公开(公告)号：US6045436A
公开(公告)日：2000-04-04
申请号：US906573
申请日：1997-08-05
申请人： Alexander Rieger , Simon Ehrenschwendtner
发明人： Alexander Rieger , Simon Ehrenschwendtner
IPC分类号： B24B9/00 , B24B1/04 , B24B9/06 , B24B27/00 , B24B37/02 , H01L21/304
CPC分类号： B24B27/0076 , B24B1/04 , B24B37/02 , B24B9/065
摘要： In a process for the material-abrading machining of the edge of a semiconductor wafer, the semiconductor wafer is resting on a rotationally movable table, is rotated about a central axis and is machined by a plurality of rotating machining tools. It is intended for each of the machining tools to abrade a specific quantity of material from the edge of the semiconductor wafer. The process is one in which the machining tools, during the course of a 360.degree.-rotation of the semiconductor wafer, are successively advanced toward the edge of the semiconductor wafer and ultimately simultaneously machine the edge of the semiconductor wafer. A machining tool which has just been advanced is intended to abrade a smaller quantity from the edge of the semiconductor wafer than a previously advanced machining tool. The machining of the edge of the semiconductor wafer with one machining tool is terminated at the earliest once the semiconductor wafer has rotated through 360.degree., calculated from the advancement of this machining tool.
摘要翻译：在用于半导体晶片的边缘的材料研磨加工的过程中，半导体晶片搁置在可旋转移动的台上，围绕中心轴线旋转并且由多个旋转加工工具加工。用于每个加工工具从半导体晶片的边缘研磨特定数量的材料。该过程是在半导体晶片360度旋转的过程中，加工工具朝向半导体晶片的边缘连续地前进，最终同时加工半导体晶片的边缘。刚刚推进的加工工具旨在比先前的先进的加工工具从半导体晶片的边缘磨蚀更少的加工工具。一旦半导体晶片从该加工工具的推进计算出，一旦半导体晶片旋转了360度，半导体晶片边缘的加工就被最终终止。

57. 发明授权

US5952242A Method and device for removing a semiconductor wafer from a flat substrate 失效
标题翻译：从平坦基板去除半导体晶片的方法和装置
公开(公告)号：US5952242A
公开(公告)日：1999-09-14
申请号：US954785
申请日：1997-10-21
申请人： Georg Pietsch , Ernst Feuchtinger
发明人： Georg Pietsch , Ernst Feuchtinger
IPC分类号： B24B7/17 , B24B37/08 , B24B37/16 , B24B37/26 , B24B37/34 , H01L21/687 , H01L21/00
CPC分类号： H01L21/68742 , B24B37/08 , B24B37/16 , B24B37/26 , B24B37/345 , H01L21/68764 , H01L21/68771
摘要： A means for removing a semiconductor wafer from a flat substrate uses a device for removing a semiconductor wafer from a polishing cloth of a double side polishing machine. The method has a liquid being pressed through the substrate against the semiconductor wafer lying on the substrate, such that the semiconductor wafer is lifted up from the substrate by the action of the liquid. Then the wafer is picked up by a pick-up device.
摘要翻译：用于从平坦基板去除半导体晶片的装置使用从双面抛光机的抛光布去除半导体晶片的装置。该方法具有通过衬底压靠位于衬底上的半导体晶片的液体，使得半导体晶片通过液体的作用从衬底提升。然后由拾取装置拾取晶片。

58. 发明授权

US5868831A Process for controlling the growth of a crystal 失效
标题翻译：用于控制晶体生长的方法
公开(公告)号：US5868831A
公开(公告)日：1999-02-09
申请号：US878915
申请日：1997-06-19
申请人： Erich Dornberger , Wilfried Von Ammon , Hans Olkrug , Franz Wasmeier , Francois Dupret , Vincent Wertz , Nathalie Van den Bogaert
发明人： Erich Dornberger , Wilfried Von Ammon , Hans Olkrug , Franz Wasmeier , Francois Dupret , Vincent Wertz , Nathalie Van den Bogaert
IPC分类号： C30B11/00 , C30B13/28 , C30B15/20 , C30B29/06 , C30B35/00
CPC分类号： C30B15/20 , C30B13/28 , Y10S117/90 , Y10T117/1004
摘要： A process and an apparatus control the growth of a crystal, which growth is governed by a set of measurable and non-measurable variables. The process includes establishing an on-line simulation software working with a reduced number of variables, the reduction of variables being performed by using a projection algorithm; speeding up the on-line simulation software by generating data banks in which values of off-line precalculated variables are stored; tuning the on-line simulation software by adjusting the results predicted by on-line simulations to the results obtained by off-line simulations and by measurements; and establishing a control loop and controlling at least one of the variables in real time, the control loop using the speeded up and tuned on-line simulation software as an on-line observer.
摘要翻译：一个过程和装置控制晶体的增长，这种增长受一组可测量和不可测量的变量的控制。该过程包括建立一个在线模拟软件，使用减少数量的变量，减少使用投影算法执行的变量; 通过生成其中存储离线预先计算的变量的值的数据库来加速在线仿真软件; 通过调整在线模拟预测的结果，通过离线模拟和测量获得的结果来调整在线仿真软件; 并建立一个控制回路并实时控制至少一个变量，控制循环使用加速和调整的在线仿真软件作为在线观察者。

59. 发明授权

US5759261A Method for pulling a monocrystal 失效
标题翻译：拉制单晶的方法
公开(公告)号：US5759261A
公开(公告)日：1998-06-02
申请号：US744544
申请日：1996-11-06
申请人： Erich Dornberger , Wilfried Von Ammon
发明人： Erich Dornberger , Wilfried Von Ammon
IPC分类号： C30B15/00 , C30B15/14 , C30B29/06 , C30B15/20
CPC分类号： C30B29/06 , C30B15/14 , Y10S117/90 , Y10T117/1068 , Y10T117/1088
摘要： A method and an apparatus for pulling a silicon monocrystal from a melt iudes the pulling of a conical portion in each case at the beginning and at the end of the monocrystal and the pulling of a cylindrical portion between the conical portions. In this method, the surface of the conical portion at the beginning of the monocrystal is shielded by a shielding means spaced apart from the monocrystal.
摘要翻译：从熔体中拉出单晶硅的方法和装置包括在单晶体的开始和结束时拉伸圆锥形部分，并在圆锥形部分之间拉动圆柱形部分。在该方法中，单晶开始处的锥形部分的表面被与单晶间隔开的屏蔽装置屏蔽。

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