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51. 发明申请

US20060055054A1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure 有权
标题翻译：焊锡球及其制造方法以及半导体互连结构的形成方法
公开(公告)号：US20060055054A1
公开(公告)日：2006-03-16
申请号：US10529172
申请日：2003-09-24
申请人： Masuo Kondo , Fumiaki Kikui
发明人： Masuo Kondo , Fumiaki Kikui
IPC分类号： H01L23/48 , C25D5/02
CPC分类号： H05K3/3436 , B23K35/0244 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05644 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15747 , H01L2924/15787 , H05K3/3463 , H05K2201/10234 , Y02P70/613 , H01L2924/00 , H01L2924/00014
摘要： A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4, which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount of water contained in the solder layer 4 is 100 μl/g or less when represented by the amount of water vapor in standard conditions.
摘要翻译：根据本发明的焊球50包括球形芯2和焊料层4，其包括Sn和Ag，并且被设置成将芯2包裹起来。当以标准条件下的水蒸气量表示时，焊料层4中所含的水的量为100mul / g以下。

52. 发明授权

US06974635B1 Package for electronic component, lid material for package lid, and production method for lid material 失效
标题翻译：电子元件封装，封装盖盖材料及盖材料生产方法
公开(公告)号：US06974635B1
公开(公告)日：2005-12-13
申请号：US09395179
申请日：1999-09-14
申请人： Kenichi Funamoto , Hidetoshi Noda , Masaaki Ishio
发明人： Kenichi Funamoto , Hidetoshi Noda , Masaaki Ishio
IPC分类号： H01L23/02 , B23K20/00 , B32B15/01 , H01L21/48 , H01L23/06 , H05K10/00 , B32B15/04 , B32B15/18 , H05K5/06
CPC分类号： H01L21/4817 , H01L23/06 , H01L2924/01079 , H01L2924/16195 , Y10T428/12389 , Y10T428/12451 , Y10T428/12535 , Y10T428/12944
摘要： A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer and composed of a Ni-based metal, such as pure Ni, mainly comprising Ni; and a brazing material layer press-bonded onto the Ni-based metal layer. The Ni-based metal layer has a maximum-to-minimum thickness ratio T1/T2 of 1.4 to 15. The lid material is produced by press-bonding a Ni-based metal foil onto a core sheet for formation of the Ni-based metal layer on the core layer, then diffusion-annealing the Ni-based metal layer and the core layer, and press-bonding a brazing material foil onto the Ni-based metal layer with a reduction ratio of 30 to 65%.
摘要翻译：提供一种盖材料，其包括：由Fe-Ni合金或Fe-Ni-Co合金构成的芯层; 由镍基（Ni基）金属层压制并扩散粘结到芯层上，由Ni基金属构成，例如主要包含Ni的纯Ni; 以及压接在Ni基金属层上的钎料层。 Ni基金属层的最大到最小厚度比T 1 / T 2为1.4〜15。盖材料通过将Ni基金属箔压接在芯片上而形成Ni- 在金属层的芯层上进行扩散退火，然后对Ni基金属层和芯层进行扩散退火，并将钎焊材料箔以30〜65％的压下比压接在Ni系金属层上。

53. 发明授权

US09266188B2 Aluminum copper clad material 有权
标题翻译：铝铜包材
公开(公告)号：US09266188B2
公开(公告)日：2016-02-23
申请号：US13701677
申请日：2011-06-02
申请人： Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
发明人： Yoshimitsu Oda , Masaaki Ishio , Akio Hashimoto , Kenji Ikeuchi
IPC分类号： B32B15/20 , B23K20/02 , B32B15/01
CPC分类号： C21D9/0068 , B23K20/02 , B32B15/017 , C21D1/26 , C22C9/00 , C22C9/04 , C22C21/00 , C22C21/08 , C22C21/10 , C22C21/14 , C22C21/16 , C22C21/18 , C22F1/04 , C22F1/047 , C22F1/053 , C22F1/057 , C22F1/08 , Y10T428/1275
摘要： An aluminum copper clad material has excellent bonding strength and includes an aluminum layer and a copper layer that are bonded without a nickel layer interposed therebetween. The aluminum layer and the copper layer are diffusion-bonded via an Al—Cu intermetallic compound layer. The copper layer satisfies Dcs≦0.5×Dcc, where Dcc represents the average crystal grain size of crystal grains in a central portion in the thickness direction of the copper layer, and Dcs represents the average crystal grain size of an interface adjacent portion C2 in the copper layer that is about 0.5 μm apart from the interface between the copper layer and the intermetallic compound layer. The intermetallic compound layer has an average thickness of about 0.5 μm to about 10 μm.
摘要翻译：铝铜合金材料具有优异的接合强度，并且包括铝层和铜层，其间没有镍层接合。铝层和铜层通过Al-Cu金属间化合物层进行扩散接合。铜层满足Dcs＆nlE; 0.5×Dcc，其中Dcc表示铜层的厚度方向的中心部分的晶粒的平均晶粒尺寸，Dcs表示铜层的相邻部分C2的界面的平均晶粒尺寸铜层与铜层和金属间化合物层之间的界面分开约0.5μm。金属间化合物层的平均厚度为约0.5μm〜约10μm。

54. 发明申请

US20150232244A1 COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT 审中-公开
标题翻译：用于包装电子元件的包封材料和包装材料
公开(公告)号：US20150232244A1
公开(公告)日：2015-08-20
申请号：US14428054
申请日：2013-11-08
申请人： NEOMAX MATERIALS Co., Ltd. , HITACHI METALS, LTD.
发明人： Masayuki Yokota , Masaharu Yamamoto
IPC分类号： B65D65/02 , B32B15/01 , B65D85/00 , B65D25/10 , B65D65/38
CPC分类号： B65D65/02 , B32B15/01 , B65D25/10 , B65D65/38 , B65D85/70 , B81B7/0077 , H01L23/053 , H01L23/562 , H01L2924/0002 , H03H9/02149 , H03H9/1021 , Y10T428/12896 , Y10T428/1291 , Y10T428/12931 , Y10T428/12944 , H01L2924/00
摘要： This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is constituted of a clad material including a base material layer made of an Ni—Cr—Fe alloy containing Ni, Cr and Fe or an Ni—Cr—Co—Fe alloy containing Ni, Cr, Co and Fe, and a surface layer bonded to one surface of the base material layer on a side of an electronic component containing member and made of Ni or an Ni alloy.
摘要翻译：用于气密密封的覆盖材料是用于容纳电子部件的包装的气密密封用覆盖材料。用于气密密封的覆盖材料1由包含由含有Ni，Cr和Fe的Ni-Cr-Fe合金制成的基材层或包含Ni，Cr，Co的Ni-Cr-Co-Fe合金的基材层的包层材料构成， Fe，以及在电子元件容纳部件的一侧由Ni或Ni合金构成的基材层的一个表面附着的表层。

55. 发明申请

US20150086867A1 BATTERY TERMINAL, METHOD FOR MANUFACTURING BATTERY TERMINAL, AND BATTERY 有权
标题翻译：电池端子，制造电池端子的方法和电池
公开(公告)号：US20150086867A1
公开(公告)日：2015-03-26
申请号：US14482516
申请日：2014-09-10
申请人： NEOMAX MATERIALS CO., LTD. , HITACHI METALS, LTD.
发明人： Yoshimitsu Oda , Masaharu Yamamoto , Masaaki Ishio
IPC分类号： H01M2/30 , H01R13/03 , H01M10/0525
CPC分类号： H01R13/03 , H01M2/206 , H01M2/305 , H01M10/0525 , H01R43/16 , Y10T29/49115
摘要： A battery terminal includes an overlay clad plate material including at least a first metal layer made of Al or Al alloy and a second metal layer made of Cu or Cu alloy, formed by bonding at least the first metal layer and the second metal layer to each other in the thickness direction. Either the first metal layer or the second metal layer of the clad plate material is partially removed to form an exposure surface on which either the second metal layer or the first metal layer is exposed in the clad plate material.
摘要翻译：电池端子包括至少包括由Al或Al合金制成的第一金属层和由Cu或Cu合金制成的第二金属层的覆层复合板材料，所述第二金属层至少通过将至少第一金属层和第二金属层结合到每个其他在厚度方向。部分去除包层板材料的第一金属层或第二金属层以形成其中第二金属层或第一金属层暴露在复合板材料中的暴露表面。

56. 发明授权

US08883318B2 Aluminum bonding alloy, and clad material and aluminum bonding composite material each having bonding alloy layer made of the alloy 有权
标题翻译：铝合金，复合材料和铝合金复合材料，各自具有由合金制成的接合合金层
公开(公告)号：US08883318B2
公开(公告)日：2014-11-11
申请号：US13501533
申请日：2010-10-25
申请人： Shinji Yamamoto , Masaaki Ishio
发明人： Shinji Yamamoto , Masaaki Ishio
IPC分类号： B32B15/20 , B32B15/01 , B23K1/19 , B23K20/02 , B23K20/16 , B23K20/227 , B23K20/233 , B23K35/00 , B23K35/02 , B23K35/30 , C22C19/00 , C22C19/03
CPC分类号： B23K1/19 , B23K20/023 , B23K20/16 , B23K20/2275 , B23K20/2333 , B23K20/2336 , B23K35/002 , B23K35/004 , B23K35/0233 , B23K35/3033 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/14 , B23K2103/18 , B23K2103/20 , B23K2103/26 , B32B15/015 , B32B15/017 , C22C19/007 , C22C19/03 , Y10T428/12743 , Y10T428/1275 , Y10T428/12757 , Y10T428/12764 , Y10T428/12806 , Y10T428/1291 , Y10T428/12937
摘要： An aluminum bonding alloy is an Ni—Mg alloy for bonding aluminum and a non-aluminum metal selected from steel, copper, nickel or titanium. The Ni—Mg alloy consists essentially of 0.08-0.90 mass % Mg, and the balance of Ni and inevitable impurities. A clad material includes a non-aluminum metal layer made of the non-aluminum metal and a bonding alloy layer made of the aluminum bonding alloy. The non-aluminum metal layer and the bonding alloy layer are bonded together by pressure welding and diffusion bonding.
摘要翻译：铝合金合金是用于粘合铝的Ni-Mg合金和选自钢，铜，镍或钛的非铝金属。 Ni-Mg合金基本上由0.08-0.90质量％的Mg组成，余量为Ni和不可避免的杂质。包层材料包括由非铝金属制成的非铝金属层和由铝接合合金制成的接合合金层。非铝金属层和接合合金层通过压焊和扩散接合结合在一起。

57. 发明授权

US08431820B2 Hermetic sealing cap 有权
标题翻译：密封盖
公开(公告)号：US08431820B2
公开(公告)日：2013-04-30
申请号：US12990719
申请日：2009-01-30
申请人： Masaharu Yamamoto , Junji Hira
发明人： Masaharu Yamamoto , Junji Hira
IPC分类号： H05K5/06
CPC分类号： H01L23/06 , H01L23/10 , H01L2224/16225 , H01L2924/01079 , H01L2924/16195
摘要： A more thinnable hermetic sealing cap can be provided. This hermetic sealing cap (10) is employed for an electronic component housing package (100) housing an electronic component (40) and includes a cap body portion (1) mainly composed of Ti.
摘要翻译：可以提供更薄的密封盖。这种气密密封盖（10）用于容纳电子部件（40）的电子部件壳体封装（100），并且包括主要由Ti构成的盖主体部分（1）。

58. 发明申请

US20120077056A1 HIGH-TEMPERATURE BIMETAL 审中-公开
标题翻译：高温双金属
公开(公告)号：US20120077056A1
公开(公告)日：2012-03-29
申请号：US13375167
申请日：2010-05-21
申请人： Yoshimitsu Oda , Masaaki Ishio
发明人： Yoshimitsu Oda , Masaaki Ishio
IPC分类号： B32B15/01
CPC分类号： G12B1/02 , B32B15/011 , C22C38/08 , C22C38/12 , C22C38/40 , Y10T428/12465
摘要： A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.
摘要翻译：提供了一种高温双金属，当温度降至常温时，可以抑制其从初始位置的显着偏移。该高温双金属（1）包括由奥氏体不锈钢制成的高热膨胀层（2）和具有居里点的热敏磁性金属制成的低热膨胀层（3），并与高热膨胀层接合。在不低于居里点的高温范围和小于居里点的低温范围内使用高温双金属，而在不低于居里的高温范围内的工作温度的上限点至少为500°C

59. 发明申请

US20110318484A1 SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：镀银球及其制造方法
公开(公告)号：US20110318484A1
公开(公告)日：2011-12-29
申请号：US13227566
申请日：2011-09-08
申请人： Ken ASADA , Fumiaki KIKUI
发明人： Ken ASADA , Fumiaki KIKUI
IPC分类号： B05D7/00 , B05D3/00 , B05D1/18 , B82Y30/00
CPC分类号： B22F1/02 , B23K35/02 , B23K35/0244 , B23K35/3006 , B23K35/40 , H01L21/4853 , H01L23/49816 , H01L24/10 , H01L24/13 , H01L24/48 , H01L2224/13 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13639 , H01L2224/48091 , H01L2224/48227 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15182 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H05K3/3436 , H05K3/3463 , H05K2201/0215 , H05K2201/0257 , H05K2201/10234 , Y02P70/613 , Y10T428/12181 , Y10T428/2991 , Y10T428/2998 , H01L2224/13099 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A silver-coated ball 10 according to the present invention includes: a spherical core 1; and a coating layer 2 including silver superfine particles, which is arranged so as to surround the core 1. The silver superfine particles included in the coating layer 2 have a mean particle size of 1 nm to 50 nm.
摘要翻译：根据本发明的镀银球10包括：球形芯1; 以及包含银超细颗粒的涂层2，其被布置为围绕芯体1。包覆在涂层2中的银超微粒的平均粒径为1nm〜50nm。

60. 发明申请

US20110156982A1 SCREW FOR USE IN A RADIO WAVE RECEIVER, METHOD OF MAKING THE SCREW, AND RADIO WAVE RECEIVER USING THE SCREW 审中-公开
标题翻译：用于无线电波接收器的螺丝，使用螺丝的制造螺丝的方法和无线电波接收器
公开(公告)号：US20110156982A1
公开(公告)日：2011-06-30
申请号：US12974003
申请日：2010-12-21
申请人： Ken ASADA , Takayuki Furujyo , Yoshihiro Maruyama , Junichi Sato
发明人： Ken ASADA , Takayuki Furujyo , Yoshihiro Maruyama , Junichi Sato
IPC分类号： H01Q1/42 , F16B23/00
CPC分类号： F16B33/004
摘要： A screw for use in a radio wave receiver includes a metal screw body that includes a shank and a head, and an insulation resin layer formed on at least a back of the screw head. In the radio wave receiver, a back cover and a case are secured together firmly by a threaded engagement of a threaded part of the shank, on which no insulation resin layer is formed, with a screw hole formed in the case while the insulation resin layer is disposed therebetween.
摘要翻译：用于无线电波接收机的螺钉包括：金属螺丝体，其包括柄和头;以及绝缘树脂层，形成在所述螺钉头的至少后部。在无线电波接收器中，通过在其上没有形成绝缘树脂层的柄的螺纹部分与壳体中形成的螺纹孔的螺纹接合，后盖和壳体牢固地固定在一起，同时绝缘树脂层设置在它们之间。

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