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41. 发明申请

US20150191813A1 HOT STAMPED HIGH STRENGTH PART EXCELLENT IN POST PAINTING ANTICORROSION PROPERTY AND METHOD OF PRODUCTION OF SAME 审中-公开
标题翻译：喷涂抗静电性能好的高强度高强度部件及其生产方法
公开(公告)号：US20150191813A1
公开(公告)日：2015-07-09
申请号：US14608849
申请日：2015-01-29
申请人： NIPPON STEEL & SUMITOMO CORPORATION
发明人： Jun Maki , Kazuhisa Kusumi , Masayuki Abe , Masao Kurosaki
IPC分类号： C23C2/12 , C23C2/28 , C23C2/26 , C23C2/34 , C21D8/02 , C21D9/46 , C22C38/32 , C22C38/28 , C22C38/06 , C22C38/04 , C22C38/02 , C22C38/00 , C22C38/60 , C22C38/54 , C22C38/50 , C22C38/44 , C22C38/38 , C22C38/22 , C22C38/20 , C22C38/14 , C23C2/02
CPC分类号： C23C2/12 , B21B1/26 , C21D1/673 , C21D7/13 , C21D8/0226 , C21D8/0236 , C21D8/0263 , C21D9/46 , C21D2211/004 , C22C38/001 , C22C38/02 , C22C38/04 , C22C38/06 , C22C38/14 , C22C38/20 , C22C38/22 , C22C38/28 , C22C38/32 , C22C38/38 , C22C38/44 , C22C38/50 , C22C38/54 , C22C38/60 , C23C2/02 , C23C2/26 , C23C2/28 , C23C2/34 , Y10T428/12611 , Y10T428/12757 , Y10T428/12951 , Y10T428/12972 , Y10T428/31678
摘要： A hot stamped high strength part in which the propagation of cracks which form at the plating layer at the time of hot stamping when hot stamping aluminum plated steel sheet is suppressed and the post painting anticorrosion property is excellent even without adding special ingredient elements which suppress formation of cracks in an aluminum plating layer is provided.A hot stamped high strength part which is excellent in post painting anticorrosion property, which hot stamped high strength part has an alloy plating layer which includes an Al—Fe intermetallic compound phase on the surface of the steel sheet, wherein the alloy plating layer is comprised from phases of a plurality of intermetallic compounds, a mean linear intercept length of crystal grains of a phase containing Al: 40 to 65 mass % among the phases of the plurality of intermetallic compounds is 3 to 20 μm, an average value of thickness of the Al—Fe alloy plating layer is 10 to 50 μm, and a ratio of the average value of thickness to the standard deviation of thickness of the Al—Fe alloy plating layer satisfies the following relationship: 0
摘要翻译：热冲压高强度部件，其中抑制热冲压镀铝钢板时在烫印时在镀层处形成的裂纹的传播，并且即使不添加抑制形成的特殊成分元素，后喷涂抗腐蚀性也优异提供铝镀层中的裂纹。热冲压高强度部件具有优良的后喷涂抗腐蚀性的热冲压高强度部件，在钢板表面上具有包含Al-Fe金属间化合物相的合金镀层，其中包含合金镀层从多个金属间化合物的相中，多个金属间化合物的相中含有Al：40〜65质量％的相的晶粒的平均线性截距长度为3〜20μm，厚度的平均值 Al-Fe合金镀层为10〜50μm，Al-Fe合金镀层的厚度的平均值与厚度的标准偏差的比例满足以下关系：0 <厚度的平均值/ 厚度＆nlE; 0.15。

42. 发明申请

US20050191510A1 Continuously formed metal matrix composite shapes 失效
标题翻译：连续形成金属基复合材料
公开(公告)号：US20050191510A1
公开(公告)日：2005-09-01
申请号：US10995279
申请日：2004-11-24
申请人： Brian Gordon , Gregg Wolfe
发明人： Brian Gordon , Gregg Wolfe
IPC分类号： B22D19/14 , C23C2/00 , C23C2/04 , C23C2/24 , C23C2/26 , C23C2/32 , C23C2/34 , B32B1/08 , B32B15/04
CPC分类号： C23C2/04 , B22D19/14 , C23C2/00 , C23C2/003 , C23C2/006 , C23C2/24 , C23C2/26 , C23C2/32 , C23C2/34 , Y10T29/49801 , Y10T29/49982 , Y10T29/49993 , Y10T428/12465
摘要： Metal matrix composites having open or closed channels extending longitudinal through the length of the composite as well as methods and apparatus for forming the same are described. The shaped metal matrix composites are made of continuous fiber reinforced metal matrix composite materials. They have an integrally formed, non-cast, metal matrix composite body portion where the walls have a substantially uniform distribution of continuous fibers in a matrix metal throughout the volume of the walls and have at least one channel extending through the body of the shaped metal matrix composite.
摘要翻译：描述了具有纵向延伸通过复合材料的长度的开放或闭合通道的金属基复合材料以及用于形成复合材料的方法和装置。成形金属基复合材料由连续纤维增强金属基复合材料制成。它们具有整体形成的非铸造金属基体复合体部分，其中壁在整个壁的体积中在基体金属中具有基本均匀的连续纤维分布，并且具有延伸穿过成形金属体的至少一个通道基质复合材料。

43. 发明授权

US5329158A Surface mountable semiconductor device having self loaded solder joints 失效
标题翻译：具有自载焊点的表面贴装半导体器件
公开(公告)号：US5329158A
公开(公告)日：1994-07-12
申请号：US964488
申请日：1992-10-21
申请人： Paul T. Lin
发明人： Paul T. Lin
IPC分类号： C23C2/08 , C23C2/10 , C23C2/34 , H01L23/495 , H01L23/50 , H05K1/18 , H05K3/34 , H01L23/48 , H01L29/44 , H01L29/52 , H01L29/60
CPC分类号： H01L23/49582 , H01L23/49579 , H05K3/3426 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01012 , H01L2924/01077 , H01L2924/01078 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K2201/10689 , H05K2201/10909 , H05K2201/10984 , H05K2201/2081 , Y02P70/613
摘要： An improved semiconductor device is disclosed having a predetermined amount of solder, or other electrically conductive binder adsorbed onto the exterior package leads of the semiconductor device. A de-wettable coating comprising preferably nickel, or alternatively chromium, is plated to a superior portion of the package leads, such that, when the heat is applied to the substrate mounting end of the leads, solder desorbes from the de-wettable layer and flows down the lead to the contact pads on the mounting substrate and forms a solder joint. The amount of solder delivered to the contact pad for joint formation is determined by the thickness of the adsorbed solder layer overlying each package lead. Only enough solder is provided on each lead sufficient to form the joint thus avoiding solder bridging between adjacent contact pads.
摘要翻译：公开了一种改进的半导体器件，其具有预定量的焊料或吸附到半导体器件的外部封装引线上的其它导电粘合剂。包含优选镍或可选择的铬的脱湿涂层被电镀到封装引线的上部，使得当将热施加到引线的基板安装端时，来自脱湿层的焊料脱离和沿着导线流到安装基板上的接触焊盘，并形成焊点。输送到用于接合形成的接触焊盘的焊料的量由覆盖在每个封装引线上的吸附焊料层的厚度确定。在每个引线上仅提供足够的焊料以形成接头，从而避免相邻接触焊盘之间的焊料桥接。

44. 发明授权

US5326403A Equipment for discharging treated articles from a barrel in a surface treatment system 失效
标题翻译：用于在表面处理系统中从桶中排出经处理的物品的设备
公开(公告)号：US5326403A
公开(公告)日：1994-07-05
申请号：US980640
申请日：1992-11-24
申请人： Akira Iwanaga
发明人： Akira Iwanaga
IPC分类号： B65G65/28 , B05C13/00 , B08B3/06 , C23C2/00 , C23C2/34 , C23C18/31 , C23G5/04 , C25D17/20 , C25F7/00 , B05C3/00
CPC分类号： C25D17/20 , B05C13/00 , B08B3/06
摘要： An equipment for discharging treated articles from a barrel in a surface treatment system includes: a carriage movable between a discharging position and a charging position; a water tank supported at the discharging position for vertical movements; and a receiver set at the discharging position above the water tank. The carriage device includes a rotating mechanism for rotating the barrel in water in the tank at the discharging position to discharge the articles from the barrel onto the receiver; a cover operating mechanism for removing a cover from an aperture of the barrel at the discharging position and put it on the aperture at the charging position.
摘要翻译：一种用于在表面处理系统中从桶中排出经处理物品的设备包括：可在排放位置和充电位置之间移动的托架; 在排放位置处支撑用于垂直运动的水箱; 以及设置在水箱上方的排放位置处的接收器。托架装置包括一个旋转机构，用于在排放位置使桶中水中的水转动，以将物品从筒体排出到接收器上; 盖操作机构，用于在放电位置从筒的孔中移除盖并将其放在充电位置的孔上。

45. 发明授权

US5240738A Method of applying solder to a flexible circuit 失效
标题翻译：将焊料施加到柔性电路的方法
公开(公告)号：US5240738A
公开(公告)日：1993-08-31
申请号：US815467
申请日：1991-12-31
申请人： Michael G. Quirk
发明人： Michael G. Quirk
IPC分类号： C23C2/20 , C23C2/34 , H05K1/00 , H05K3/34
CPC分类号： C23C2/34 , C23C2/20 , H05K3/3468 , H05K1/0393 , H05K2203/044 , H05K2203/081 , H05K2203/1518
摘要： A flexible circuit 10 panel is coated with solder by lowering into a bath of molten solder 4. On removal from the bath excess solder is blown from the panel by air jets from one or more nozzles 22. The panel is pulled towards the nozzle by a region 60 of negative pressure associated with the nozzles, and is held close to the nozzles to obtain an even coating of solder.
摘要翻译：柔性电路10面板通过下降到熔融焊料4的浴中而涂覆有焊料。在从槽中移除时，多余的焊料从面板通过来自一个或多个喷嘴22的空气射流从面板吹出。面板通过一个与喷嘴相关联的负压区域60，并且保持靠近喷嘴以获得均匀的焊料涂层。

46. 发明授权

US4928869A Solder leveller 失效
标题翻译：焊锡矫平机
公开(公告)号：US4928869A
公开(公告)日：1990-05-29
申请号：US282313
申请日：1988-11-25
申请人： Peter P. A. Lymn
发明人： Peter P. A. Lymn
IPC分类号： B23K1/08 , B23K3/06 , C23C2/00 , C23C2/34 , H05K3/24
CPC分类号： B23K3/0669
摘要： A solder leveller for tinning exposed metal on printed circuit boards comprises a solder bath and paired rollers therein for carrying a board in a curvilinear path downwardly into, through and upwardly out of the bath. At least one pair of rollers having a board engaging nip within the bath is driven. The bath includes means for providing a solder-oxidation inhibiting oil over the solder.
摘要翻译： PCT No.PCT / GB87 / 00367 Sec。 371日期1988年11月25日第 102（e）1988年11月25日日期PCT提交1987年5月27日PCT公布。公开号WO87 / 07196 日本1987年12月3日。印刷电路板上用于镀锡暴露的金属的焊料矫直机包括焊料槽和成对的辊，用于将曲线路径中的板向下运入，通过并向上流出浴槽。至少有一对辊子在浴缸内具有板接合辊隙被驱动。该浴液包括在焊料上提供焊料氧化抑制油的装置。

47. 发明授权

US4770119A Support device for plating an item having fine parts 失效
标题翻译：用于电镀具有精细零件的物品的支撑装置
公开(公告)号：US4770119A
公开(公告)日：1988-09-13
申请号：US15257
申请日：1987-02-17
申请人： Yuuji Kawamata , Tomohiko Iino , Ryoichi Suzuki , Noriyuki Haga
发明人： Yuuji Kawamata , Tomohiko Iino , Ryoichi Suzuki , Noriyuki Haga
IPC分类号： C23C2/14 , B23K1/20 , C23C2/26 , C23C2/30 , C23C2/34 , H01L23/50 , B05C13/02
CPC分类号： C23C2/30 , C23C2/265
摘要： A method and device of performing plating of an item having a row of fine parts, e.g. a flatpack IC are disclosed. The method comprises immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.
摘要翻译：一种执行具有一排精细部件的物品的电镀的方法和装置，例如，公开了一种扁平封装IC。该方法包括将所述物品浸入熔融焊料浴中，从所述浴中除去所述物品，同时将所述物品保持在一定姿态，使得所述一排细小部分相对于所述熔融焊料的表面倾斜，并使助熔剂发挥对所述熔融焊料的助熔作用粘附到所述细小部分，从而降低粘附到所述细小部分上的焊料的表面张力并防止焊料在所述细小部分之间形成桥。

48. 发明授权

US4383494A Solder-coating apparatus 失效
标题翻译：焊接设备
公开(公告)号：US4383494A
公开(公告)日：1983-05-17
申请号：US236006
申请日：1981-02-19
申请人： Peter Schillke , Robert R. Walls
发明人： Peter Schillke , Robert R. Walls
IPC分类号： B23K1/08 , B23K3/06 , C23C2/34 , H05K3/34 , H05K13/04 , B05C3/132 , B05C11/06
CPC分类号： H05K3/3468 , B23K1/085 , B23K3/0653 , C23C2/34 , H05K13/0465 , B23K2201/42 , H05K2203/044 , H05K2203/081 , H05K2203/111 , H05K2203/1509
摘要： A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder is displaced by the circuit board to produce a buoyant force which presses the circuit board against the contact member. The speed of the contact member in moving through the molten solder is controlled to determine dwell time of the circuit board and maintain contact between the circuit board and the contact member.An apparatus for continuously applying a solder coating to copper-coated holes and tracks on a printed circuit board. The apparatus includes means to contain a bath of molten solder and means to contact the upper surface of a printed circuit board. Also, the apparatus includes means to move the contacted circuit board through the bath of molten solder as the displaced solder exerts an upward buoyant force against the circuit board.
摘要翻译：一种将焊料涂层涂覆在印刷电路板上的铜涂层孔和轨道上的连续工艺。具有助焊剂的电路板的上表面与接触构件接触，并且电路板和接触构件移动通过焊料的熔融浴。焊料被电路板移位以产生将电路板压靠接触构件的浮力。控制接触构件在熔融焊料中移动的速度，以确定电路板的停留时间并保持电路板和接触构件之间的接触。一种用于将印刷电路板上的铜涂覆的孔和轨道连续地施加焊料涂层的装置。该装置包括容纳熔融焊料浴的装置和与印刷电路板的上表面接触的装置。此外，该装置包括当移动的焊料向电路板施加向上的浮力时，使接触的电路板移动通过熔融焊料槽的装置。

49. 发明授权

US4298053A Casting belts for machines for the continuous casting of metals 失效
标题翻译：用于连续铸造金属的机器的铸造带
公开(公告)号：US4298053A
公开(公告)日：1981-11-03
申请号：US556370
申请日：1975-03-07
申请人： John Dompas , Charles J. Petry
发明人： John Dompas , Charles J. Petry
IPC分类号： B22D11/06 , C23C2/34 , C23C4/08 , C23C18/16 , C23C18/18 , C23C18/31 , C23C18/50 , C25D7/00 , B23K28/00
CPC分类号： B22D11/0654
摘要： An endless casting belt for machines for continuous casting of metals, said casting belt being provided with a layer of an anti-adhesion agent and having at least in the "welding zone" a coating resistant to stress corrosion cracking when in contact with the liquid metal to be cast and with the said anti-adhesion agent.
摘要翻译：一种用于连续铸造金属的机器的环形铸造带，所述铸造带设置有一层防粘附剂，并且至少在“焊接区”中具有与液态金属接触时耐应力腐蚀开裂的涂层与所述防粘剂一起浇铸。

50. 发明授权

US4277518A Solder-coating method 失效
标题翻译：焊接方法
公开(公告)号：US4277518A
公开(公告)日：1981-07-07
申请号：US93215
申请日：1979-11-13
申请人： Peter Schillke , Robert R. Walls
发明人： Peter Schillke , Robert R. Walls
IPC分类号： H05K3/24 , B23K1/08 , B23K3/06 , C23C2/00 , C23C2/34 , C23C2/40 , H05K3/34 , C23C1/04
CPC分类号： H05K3/3468 , B23K1/085 , B23K3/0653 , C23C2/34 , B23K2201/42 , H05K2203/044 , H05K2203/081 , H05K2203/111 , H05K2203/1509
摘要： A continuous process for applying a solder coating to copper-coated holes and tracks on a printed circuit board. The upper surface of the circuit board having a flux thereon is contacted with a contact member and the circuit board and contact member are moved through a molten bath of solder. Solder is displaced by the circuit board to produce a buoyant force which presses the circuit board against the contact member. The speed of the contact member in moving through the molten solder is controlled to determine dwell time of the circuit board and maintain contact between the circuit board and the contact member.An apparatus for continuously applying a solder coating to copper-coated holes and tracks on a printed circuit board. The apparatus includes means to contain a bath of molten solder and means to contact the upper surface of a printed circuit board. Also, the apparatus includes means to move the contacted circuit board through the bath of molten solder as the displaced solder exerts an upward buoyant force against the circuit board.
摘要翻译：一种将焊料涂层涂覆在印刷电路板上的铜涂层孔和轨道上的连续工艺。具有助焊剂的电路板的上表面与接触构件接触，并且电路板和接触构件移动通过焊料的熔融浴。焊料被电路板移位以产生将电路板压靠接触构件的浮力。控制接触构件在熔融焊料中移动的速度，以确定电路板的停留时间并保持电路板和接触构件之间的接触。一种用于将印刷电路板上的铜涂覆的孔和轨道连续地施加焊料涂层的装置。该装置包括容纳熔融焊料浴的装置和与印刷电路板的上表面接触的装置。此外，该装置包括当移动的焊料向电路板施加向上的浮力时，使接触的电路板移动通过熔融焊料槽的装置。

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